Semiconductor device with sealing resin
Various embodiments of the present invention include a semiconductor device, the semiconductor device including a first semiconductor chip disposed on a substrate, a first sealing resin sealing the first semiconductor chip, a built-in semiconductor device disposed on the first sealing resin, and a second sealing resin sealing the first sealing resin and the built-in semiconductor device and covering a side surface of the substrate. According to an aspect of the present invention, it is possible to provide a high-quality semiconductor device, in which downsizing and cost reduction can be realized.
1. A media player comprising:
a processor;
a memory coupled to the processor, the memory comprising:
a first semiconductor chip disposed on a first surface of a first substrate, the first substrate comprises a second surface opposing the first surface;
a first resin sealing the first semiconductor chip;
a built-in semiconductor device comprising:
a second substrate;
a second semiconductor chip disposed on the second substrate; and
a second resin sealing the second semiconductor chip, the second resin of the built-in semiconductor device disposed on the first resin; and
a third resin covering the first resin and the built-in semiconductor device and covering a side surface of the first substrate and not extending beyond the second surface of the first substrate.
2. The media player of claim 1 , wherein said media player is a portable media player.
3. The media player of claim 1 , further comprising a display coupled to the processor.
4. The media player of claim 1 , wherein the second semiconductor chip is located between the first and second substrates.
5. The media player of claim 1 , wherein the first substrate is reverse wire bonded to the built-in semiconductor device.
6. The media player of claim 1 , wherein the second semiconductor chip is electrically coupled to the second substrate by a wire.
7. A camera comprising:
an image capturing device;
a memory coupled to the image capturing device, the memory comprising:
a first semiconductor chip disposed on a first surface of a first substrate, the first substrate comprises a second surface opposing the first surface;
a first resin sealing the first semiconductor chip;
a built-in semiconductor device comprising:
a second substrate;
a second semiconductor chip disposed on the second substrate; and
a second resin sealing the second semiconductor chip, the second resin of the built-in semiconductor device disposed on the first resin; and
a third resin covering the first resin and the built-in semiconductor device and covering a side surface of the first substrate and not extending beyond the second surface of the first substrate.
8. The camera of claim 7 , wherein the second semiconductor chip is located between the first and second substrates.
9. The camera of claim 7 , wherein the first substrate is reverse wire bonded to the built-in semiconductor device.
10. The camera of claim 7 , wherein the second semiconductor chip is electrically coupled to the second substrate by a wire.
11. The camera of claim 7 , further comprising a microphone coupled to the memory.