Method and system for split threshold voltage programmable bitcells

1. A bitcell comprising:

an insulating layer;

a first doping under the insulating layer;

a second doping under the insulating layer and characterized by a higher gate voltage breakdown than the first doping; and

a gate terminal for the insulating layer, the bitcell configured for programming by a voltage on the gate terminal that results in a conductive hole selectively burned in the insulating layer between the gate terminal and the first doping.

2. The bitcell of claim 1 , where the bitcell is configured as an antifuse.

3. The bitcell of claim 1 , where the first and the second dopings are adjacent to one another under the insulating layer.

4. The bitcell of claim 1 , where the conductive hole is selectively burned between the first doping and the gate terminal by virtue of the higher gate voltage breakdown voltage of the second doping.

5. The bitcell of claim 1 , where the insulating layer is adjacent to the first doping.

6. The bitcell of claim 1 , where the second doping is in between the first doping and an output terminal of the bitcell.

7. The bitcell of claim 1 , where the first doping is located under the insulating layer according to a desired location for the conductive hole and thus for a desired gate length for the bitcell.

8. A bitcell comprising:

an insulating area;

a first doping;

a second doping proximate to the first doping and proximate to the insulating area, the second doping characterized by a lower threshold voltage than the first doping; and

a gate terminal for the insulating area, the bitcell configured for programming by a voltage on the gate terminal that results in a conductive hole selectively burned in the insulating area between the gate terminal and the first doping.

9. The bitcell of claim 8 , where the bitcell is configured as an antifuse.

10. The bitcell of claim 8 , where the first and the second dopings are adjacent to one another under the insulating area.

11. The bitcell of claim 8 , where the insulating area is adjacent to the first doping.

12. The bitcell of claim 8 , where the second doping is in between the first doping and an output terminal of the bitcell.

13. The bitcell of claim 8 , where the first doping is located proximate to the insulating area according to a desired location for the conductive hole and thus for a desired gate length for the bitcell.

14. The bitcell of claim 8 , where the first doping is characterized by a lower gate voltage breakdown than the second doping.

15. A bitcell comprising:

a gate region;

an insulating region proximate to the gate region; and

a substrate region defining a channel proximate to the insulating region, the channel comprising a variable doping profile that causes formation of a conductive hole, burned through the insulating region, in a selected portion of the insulating region.

16. The bitcell of claim 15 , where the bitcell is embedded in a one time programmable memory.

17. The bitcell of claim 15 , where the variable doping profile comprises at least two regions, each with a different doping profile.

18. The bitcell of claim 15 , where the variable doping profile results in a low gate voltage breakdown in the selected portion of the insulating region, relative to other portions of the insulating region.

19. The bitcell of claim 15 , where the variable doping profile results in a high threshold voltage in the selected portion of the insulating region, relative to other portions of the insulating region.

20. The bitcell of claim 15 , where the selected portion corresponds to a pre-determined desired gate length for the bitcell, when programmed.