Method for reducing lateral extrusion formed in semiconductor structures and semiconductor structures formed thereof
Aspects of the present invention relate to method for reducing lateral extrusion formed in semiconductor structures and semiconductor structures formed thereof. Various embodiments include a method for reducing lateral extrusion formed in semiconductor structures. The method can include removing a portion of a first lateral extrusion in an aluminum layer of the semiconductor structure, and determining a post-removal thickness of a dielectric layer positioned adjacent the aluminum layer. The post-removal thickness may be determined subsequent to the removing of the portion of the first lateral extrusion. The method can also include determining a difference between the post-removal thickness of the dielectric layer and a pre-removal thickness of the dielectric layer.
1. A method comprising:
removing a portion of a first lateral extrusion in an aluminum layer of a semiconductor structure;
determining a post-removal thickness of a dielectric layer positioned adjacent the aluminum layer subsequent to the removing of the portion of the first lateral extrusion; and
determining a difference between the post-removal thickness of the dielectric layer and a pre-removal thickness of the dielectric layer.
2. The method of claim 1 , wherein the removing of the portion of the first lateral extrusion includes performing a dry etching process on the portion of the first lateral extrusion.
3. The method of claim 2 , wherein the dry etching process includes a reactive-ion etching.
4. The method of claim 1 , wherein the semiconductor structure further includes:
a metallurgy stack including the first lateral extrusion in the aluminum layer;
a metal-insulator-metal capacitor (MIM capacitor) structure positioned adjacent the metallurgy stack; and
an opening extending through the metallurgy stack, the opening surrounding the MIM capacitor structure.
5. The method of claim 4 , wherein the removing of the portion of the first lateral extrusion includes removing the portion of the first lateral extrusion a first predetermined distance from the metallurgy stack of the semiconductor structure.
6. The method of claim 4 , wherein the first lateral extrusion in the aluminum layer extends into the opening.
7. The method of claim 5 , wherein the removing of the portion of the first lateral extrusion includes removing the portion of the first lateral extrusion a second predetermined distance from the MIM capacitor structure of the semiconductor structure.
8. The method of claim 4 , wherein the MIM capacitor structure includes a second lateral extrusion extending into the opening.
9. The method of claim 7 , further comprising removing a portion of the second lateral extrusion a third predetermined distance from the MIM capacitor structure of the semiconductor structure.
10. The method of claim 9 , wherein the removing of the portion of the second lateral extrusion includes removing the portion of the second lateral extrusion a fourth predetermined distance from the metallurgy stack of the semiconductor structure.
11. The method of claim 1 , further comprising providing an indicator of an electrical fault in the semiconductor structure in response to the determined difference between the post-removal thickness and the pre-removal thickness of the dielectric layer exceeding a predetermined condition threshold.
12. The method of claim 11 , wherein the predetermined condition threshold is based upon at least one of the pre-removal thickness of the dielectric layer, and a material composition of the dielectric layer of the semiconductor structure.