IP Library Granted Patent US 9,465,491
Granted Patent B2
US 9,465,491 · App. 14/057,107 · Granted Oct 11, 2016

Method for forming a capacitive touch sensor for identifying a fingerprint

Inventors: Jalil Shaikh (Fremont, CA); Esat Yilmaz (Santa Cruz, CA)
Assignee: Atmel Corporation
G06F3/044G06K9/0002Y10T29/49105Y10T29/49124
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Quick Facts
Patent No.
US 9,465,491
App. No.
14/057,107
Granted
Oct 11, 2016
Kind
B2
Abstract

A method of forming a capacitive sensor includes forming a capacitive touch position sensor including a first plurality electrodes sense electrodes and drive electrodes in a touch sensing area of a capacitive sensor. The first plurality of sense electrodes and drive electrodes are configured to enable detection of the presence and position of a touch in the touch sensing area. The method also includes forming a capacitive finger print sensor including a second plurality of sense electrodes and drive in a fingerprint sensing area of the capacitive sensor. The second plurality of sense electrodes and drive are configured to enable identification of the fingerprint of a finger placed in the fingerprint sensing area.

Claims (22)

1. A method of forming a capacitive sensor, the method comprising:

forming, on a surface of a substrate a first plurality of sense electrodes and drive electrodes in a touch sensing area, the first plurality of sense electrodes and drive electrodes forming a capacitive touch position sensor configured to enable detection of the presence and position of a touch in the touch sensing area; and

forming, on the surface of the substrate, a second plurality of sense electrodes and drive electrodes in a fingerprint sensing area, the second plurality of sense electrodes and drive electrodes forming a capacitive finger print sensor configured to enable identification of the fingerprint of a finger placed in the fingerprint sensing area.

2. The method of claim 1 , further comprising forming the fingerprint sensing area outside the touch sensing area.

3. The method of claim 1 , further comprising forming the fingerprint sensing area within the touch sensing area.

4. The method of claim 3 , further comprising coupling the second plurality of sense electrodes and drive electrodes of the capacitive fingerprint sensor to a switching element for switching the second plurality of sense electrodes and drive electrodes between a fingerprint recognition mode and a touch sensing mode.

5. The method of claim 4 , wherein the capacitive fingerprint sensor comprises at least two channels, the capacitive fingerprint sensor configured to combine the at least two channels while operating in the touch sensing mode.

6. The method of claim 1 , wherein a first density of the second plurality of sense electrodes and drive electrodes of the capacitive fingerprint sensor is greater than a second density of the first plurality of sense electrodes and drive electrodes of the capacitive touch position sensor.

7. The method of claim 1 , further comprising forming the first plurality of sense electrodes and drive electrodes of the capacitive touch position sensor and the second plurality of sense electrodes and drive electrodes of the capacitive finger print sensor from a common conductive material.

8. The method of claim 7 , wherein the common conductive material comprises an opaque conductive material.

9. The method of claim 7 , wherein the common conductive material comprises a transparent conductive material.

10. The method of claim 9 , wherein the transparent conductive material is selected from the group consisting of transparent indium tin oxide, antimony tin oxide, tin oxide, PEDOT, conductive polymers, carbon nanotube, and metal nanowire impregnated material.

11. The method of claim 1 , wherein the first plurality of sense electrodes and drive electrodes forming the capacitive touch position sensor are formed from a mesh or other pattern of fine lines configured to allow transmission of light through the mesh electrodes.

12. The method of claim 1 , wherein the first plurality of sense electrodes and drive electrodes forming the capacitive touch position sensor and the first plurality of sense electrodes and drive electrodes forming the capacitive finger print sensor are formed during a same processing step.

13. The method of claim 1 , wherein the first plurality of sense electrodes and drive electrodes forming the capacitive touch position sensor and the first plurality of sense electrodes and drive electrodes forming the capacitive finger print sensor are formed from a common material.

14. The method of claim 1 , wherein at least one of the capacitive touch position sensor and the capacitive finger print sensor comprise a self-capacitance sensor.

15. The method of claim 1 , wherein at least one of the touch position sensor and the capacitive finger print sensor comprise a mutual capacitance sensor.

16. The method of claim 1 , further comprising coupling the plurality of sense electrodes and drive electrodes of the capacitive touch position sensor and the plurality of sense and drive electrodes of the capacitive finger print sensor to a common printed circuit board.

17. The method of claim 1 , further comprising:

coupling the plurality of sense electrodes and drive electrodes of the capacitive touch position sensor to a first printed circuit board; and

coupling the plurality of sense and drive electrodes of the capacitive finger print sensor to a second printed circuit board.

18. The method of claim 1 , further comprising positioning a display under the capacitive touch position sensor for viewing through the touch sensing area.

Assignments (12)
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059358/0001 →
RELEASE OF SECURITY INTEREST Recorded Feb 28, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: ATMEL CORPORATION
Reel/Frame 059262/0105 →
RELEASE OF SECURITY INTEREST Recorded Feb 25, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059333/0222 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 5, 2019
From: MICROCHIP TECHNOLOGY INC.; ATMEL CORPORATION; MICROCHIP TECHNOLOGY GERMANY GMBH
To: NEODRÓN LIMITED
Reel/Frame 048259/0840 →
RELEASE OF SECURITY INTEREST IN CERTAIN PATENT RIGHTS Recorded Dec 21, 2018
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; ATMEL CORPORATION
Reel/Frame 047976/0884 →
RELEASE OF SECURITY INTEREST IN CERTAIN PATENT RIGHTS Recorded Dec 21, 2018
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; ATMEL CORPORATION
Reel/Frame 047976/0937 →
SECURITY INTEREST Recorded Sep 18, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 047103/0206 →
SECURITY INTEREST Recorded Jun 25, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 046426/0001 →
SECURITY INTEREST Recorded Feb 10, 2017
From: ATMEL CORPORATION
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 041715/0747 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 18, 2013
From: QRG LIMITED
To: ATMEL CORPORATION
Reel/Frame 031432/0481 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 18, 2013
From: YILMAZ, ESAT
To: QRG LIMITED
Reel/Frame 031432/0422 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 18, 2013
From: SHAIKH, JALIL
To: ATMEL CORPORATION
Reel/Frame 031432/0302 →
Continuity (2)
Continuation 12938050 · Nov 2, 2010
Related Publication 20140047706A1 · Feb 20, 2014