IP Library Granted Patent US 9,679,765
Granted Patent B2
US 9,679,765 · App. 14/161,564 · Granted Jun 13, 2017

Method of fabricating rare-earth doped piezoelectric material with various amounts of dopants and a selected C-axis orientation

Inventors: John D. Larson, III (Palo Alto, CA); Jyrki Kaitila (Riemerling, DE); Stefan Bader (Fort Collins, CO)
Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
H01L21/02518C23C14/025C23C14/0617C23C14/3414H03H3/02H03H9/02015H03H9/173H03H9/175H03H9/583H03H9/587
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Quick Facts
Patent No.
US 9,679,765
App. No.
14/161,564
Granted
Jun 13, 2017
Kind
B2
Abstract

A method of fabricating a rare-earth element doped piezoelectric material having a first component, a second component and the rare-earth element. The method includes: providing a substrate; initially flowing hydrogen over the substrate; after the initially flowing of the hydrogen over the substrate, flowing the first component to form the rare-earth element doped piezoelectric material over a surface of a target, the target comprising the rare-earth metal in a certain atomic percentage; and sputtering the rare-earth element doped piezoelectric material from the target on the substrate.

Claims (36)

1. A BAW resonator, comprising:

a first electrode disposed over a substrate;

an electropositive seed layer comprising aluminum and scandium (Al—Sc), and disposed over the substrate;

a piezoelectric layer disposed over the electropositive seed layer and comprising a rare-earth element doped piezoelectric material having a compression-negative (C N ) polarity, wherein the electropositive seed layer fosters growth of the piezoelectric layer having the compression-negative (C N ) polarity; and

a second electrode disposed over the rare-earth element doped piezoelectric material.

2. A BAW resonator as claimed in claim 1 , wherein the rare-earth element doped piezoelectric material comprises a first component and a second component.

3. A BAW resonator as claimed in claim 2 , wherein the rare-earth element is scandium (Sc), the first component is nitrogen (N), and the second component is aluminum (Al).

4. A bulk acoustic wave (BAW) resonator structure, comprising:

a first electrode disposed over a substrate;

a first non-ferroelectric piezoelectric layer disposed over the first electrode, the first non-ferroelectric piezoelectric layer having a first c-axis oriented along a first direction, and comprising a rare-earth element doped non-ferroelectric piezoelectric material;

a second electrode disposed over the first non-ferroelectric piezoelectric layer;

a second non-ferroelectric piezoelectric layer disposed over the first electrode, the second non-ferroelectric piezoelectric layer being adjacent to, and in direct contact with, the first non-ferroelectric piezoelectric layer, wherein the second non-ferroelectric piezoelectric layer has a second c-axis oriented in a second direction that is substantially antiparallel to the first direction; and

an acoustic reflector disposed in the substrate.

5. A BAW resonator structure as claimed in claim 4 , wherein the second non-ferroelectric piezoelectric layer comprises the rare-earth element doped non-ferroelectric piezoelectric material.

6. A BAW resonator structure as claimed in claim 5 , wherein the second non-ferroelectric piezoelectric layer has a piezoelectric coupling coefficient (e 33ip ) that is substantially equal in magnitude but opposite in sign to a piezoelectric coupling coefficient (e 33p ) of the first non-ferroelectric piezoelectric layer.

7. A BAW resonator structure as claimed in claim 5 , wherein the rare-earth element doped non-ferroelectric material comprises scandium doped aluminum nitride (AlScN).

8. A bulk acoustic wave (BAW) resonator structure, comprising:

a first electrode disposed over a substrate;

a cavity beneath the first electrode;

a first non-ferroelectric piezoelectric layer disposed over the first electrode, the first non-electric piezoelectric layer comprising a rare-earth element doped non-ferroelectric piezoelectric material, and having a first c-axis oriented along a first direction;

a second electrode disposed over the first non-ferroelectric piezoelectric layer, wherein an active region of the BAW resonator structure comprises an overlap of the first electrode and the second electrode with the cavity; and

a second non-ferroelectric piezoelectric layer disposed over the first electrode, the second non-ferroelectric piezoelectric layer being adjacent to, and in direct contact with, the first non-ferroelectric piezoelectric layer, the second non-ferroelectric piezoelectric layer having a second c-axis oriented in a second direction that is substantially antiparallel to the first direction, wherein the second electrode overlaps the second non-ferroelectric piezoelectric layer; and

an acoustic reflector disposed in the substrate.

9. A BAW resonator structure as claimed in claim 8 , wherein the first non-ferroelectric piezoelectric layer comprises the rare-earth element doped non-ferroelectric piezoelectric material, or the second non-ferroelectric piezoelectric layer comprises the rare-earth element doped non-ferroelectric piezoelectric material, or both.

10. A BAW resonator structure as claimed in claim 9 , wherein the second non-ferroelectric piezoelectric layer has a piezoelectric coupling coefficient (e 33ip ) that is substantially equal in magnitude but opposite in sign of a piezoelectric coupling coefficient (e 33p ) of the first non-ferroelectric piezoelectric layer.

11. A BAW resonator structure as claimed in claim 9 , wherein the rare-earth element doped non-ferroelectric piezoelectric material comprises scandium doped aluminum nitride (AlScN).

12. A BAW resonator as claimed in claim 1 , wherein the electropositive seed layer is comparatively pure.

13. A BAW resonator as claimed in claim 1 , wherein the electropositive seed layer is disposed directly on an upper surface of the first electrode.

14. A BAW resonator as claimed in claim 1 , wherein a thickness of the electropositive seed layer is in a range of approximately 50 {acute over (Å)} to approximately 1000 {acute over (Å)}.

15. A BAW resonator as claimed in claim 2 , wherein a thickness wherein a thickness of the electropositive seed layer is in a range of approximately 50 {acute over (Å)} to approximately 1000 {acute over (Å)}.

16. A BAW resonator as claimed in claim 7 , wherein atomic percentage of scandium in the scandium doped aluminum nitride (AlScN) is approximately 0.5% to approximately 44%.

17. A BAW resonator as claimed in claim 7 , wherein atomic percentage of scandium in the scandium doped aluminum nitride (AlScN) is approximately 2.5% to approximately 5%.

18. A BAW resonator as claimed in claim 7 , wherein atomic percentage of scandium in the scandium doped aluminum nitride (AlScN) is approximately 0.5% to less than approximately 10.0%.

19. A BAW resonator as claimed in claim 11 , wherein atomic percentage of scandium in the scandium doped aluminum nitride (AlScN) is approximately 0.5% to approximately 44%.

20. A BAW resonator as claimed in claim 11 , wherein atomic percentage of scandium in the scandium doped aluminum nitride (AlScN) is approximately 2.5% to approximately 5%.

21. A BAW resonator as claimed in claim 11 , wherein atomic percentage of scandium in the scandium doped aluminum nitride (AlScN) is approximately 0.5% to less than approximately 10.0%.

Assignments (8)
CORRECTIVE ASSIGNMENT TO CORRECT THE EXECUTION DATE PREVIOUSLY RECORDED AT REEL: 047422 FRAME: 0464. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER. Recorded Mar 6, 2019
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 048883/0702 →
MERGER Recorded Oct 5, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047422/0464 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 21, 2017
From: KAITILA, JYRKI; BADER, STEFAN
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 042088/0622 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Recorded Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041710/0001 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2016
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037808/0001 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT RIGHTS (RELEASES RF 032851-0001) Recorded Feb 2, 2016
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 037689/0001 →
PATENT SECURITY AGREEMENT Recorded May 8, 2014
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 032851/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 23, 2014
From: LARSON, JOHN D., III
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 032115/0697 →
Continuity (4)
Continuation In Part 13428474 · Mar 23, 2012
Continuation In Part 13286051 · Oct 31, 2011
Continuation In Part 12692108 · Jan 22, 2010
Related Publication 20140132117A1 · May 15, 2014