IP Library Granted Patent US 9,287,278
Granted Patent B2
US 9,287,278 · App. 14/193,772 · Granted Mar 15, 2016

Non-volatile push-pull non-volatile memory cell having reduced operation disturb and process for manufacturing same

Inventors: Fethi Dhaoui (Mountain House, CA); John McCollum (Saratoga, CA)
Assignee: Microsemi SoC Corporation
H01L27/11521G11C16/0441G11C16/3418H01L27/2436
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Quick Facts
Patent No.
US 9,287,278
App. No.
14/193,772
Granted
Mar 15, 2016
Kind
B2
Abstract

A non-volatile memory cell includes a p-channel non-volatile transistor having a source and a drain defining a channel and a gate overlying the channel and an n-channel non-volatile transistor having a source and a drain defining a channel and a gate overlying the channel. In at least one of the p-channel non-volatile transistor and the n-channel non-volatile transistor, a lightly-doped drain region extends from the drain into the channel.

Claims (18)

1. A non-volatile memory cell, comprising:

a p-channel non-volatile transistor having a source and a drain defining a channel and a gate overlying the channel;

an n-channel non-volatile transistor having a source and a drain defining a channel and a gate overlying the channel, the drain of the p-channel non-volatile transistor connected to the drain of the n-channel non-volatile transistor; and

in at least one of the p-channel non-volatile transistor and the n-channel non-volatile transistor, a lightly-doped drain region extending from the drain towards the channel, and a lightly-doped drain region extending from the source towards the channel, the lightly-doped drain region extending from the source having a higher doping level than the lightly-doped drain region extending from the drain.

2. The non-volatile memory cell of claim 1 further including a volatile switch transistor having a gate connected to the drains of the p-channel non-volatile transistor and the n-channel non-volatile transistor.

3. The non-volatile memory cell of claim 1 wherein lightly-doped drain regions extend from the drain of the p-channel non-volatile transistor towards the channel of the p-channel non-volatile transistor and from the source of the p-channel non-volatile transistor towards the channel of the p-channel non-volatile transistor.

4. The non-volatile memory cell of claim 1 wherein lightly-doped drain regions extend from the drain of the n-channel non-volatile transistor towards the channel of the n-channel non-volatile transistor and from the source of the n-channel non-volatile transistor towards the channel of the n-channel non-volatile transistor.

5. A non-volatile memory cell, comprising:

a p-channel non-volatile transistor having a source and a drain defining a channel, a gate overlying the channel, a lightly-doped drain region extending from the drain towards the channel, and a lightly-doped drain region extending from the source towards the channel;

an n-channel non-volatile transistor having a source and a drain defining a channel and a gate overlying the channel; and

wherein the lightly-doped drain region extending from the source of the p-channel non-volatile transistor has a higher doping level than the lightly-doped drain region extending from the drain of the p-channel non-volatile transistor.

6. The non-volatile memory cell of claim 5 further including a volatile switch transistor having a gate connected to the drains of the p-channel non-volatile transistor and the n-channel non-volatile transistor.

7. A non-volatile memory cell, comprising:

a p-channel non-volatile transistor having a source and a drain defining a channel, a gate overlying the channel, a lightly-doped drain region extending from the drain towards the channel, and a lightly-doped drain region extending from the source towards the channel;

an n-channel non-volatile transistor having a source and a drain defining a channel, a gate overlying the channel, a lightly-doped drain region extending from the drain towards the channel, and a lightly-doped drain region extending from the source towards the channel;

wherein the lightly-doped drain region extending from the source of the p-channel non-volatile transistor has a higher doping level than the lightly-doped drain region extending from the drain of the p-channel non-volatile transistor; and

wherein the lightly-doped drain region extending from the source of the n-channel non-volatile transistor has a higher doping level than the lightly-doped drain region extending from the drain of the n-channel non-volatile transistor.

8. The non-volatile memory cell of claim 7 further including a volatile switch transistor having a gate connected to the drains of the p-channel non-volatile transistor and the n-channel non-volatile transistor.

Assignments (5)
RELEASE OF SECURITY INTEREST Recorded May 29, 2018
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: MICROSEMI CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.), INC.; MICROSEMI FREQUENCY AND TIME CORPORATION; MICROSEMI COMMUNICATIONS, INC.; MICROSEMI SOC CORP.; MICROSEMI CORP. - POWER PRODUCTS GROUP; MICROSEMI CORP. - RF INTEGRATED SOLUTIONS
Reel/Frame 046251/0391 →
PATENT SECURITY AGREEMENT Recorded Feb 3, 2016
From: MICROSEMI CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.) INC. (F/K/A LEGERITY, INC., ZARLINK SEMICONDUCTOR (V.N.) INC., CENTELLAX, INC., AND ZARLINK SEMICONDUCTOR (U.S.) INC.); MICROSEMI FREQUENCY AND TIME CORPORATION (F/K/A SYMMETRICON, INC.); MICROSEMI COMMUNICATIONS, INC. (F/K/A VITESSE SEMICONDUCTOR CORPORATION); MICROSEMI SOC CORP. (F/K/A ACTEL CORPORATION); MICROSEMI CORP. - POWER PRODUCTS GROUP (F/K/A ADVANCED POWER TECHNOLOGY INC.); MICROSEMI CORP. - RF INTEGRATED SOLUTIONS (F/K/A AML COMMUNICATIONS, INC.)
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037691/0697 →
RELEASE OF SECURITY INTEREST Recorded Jan 19, 2016
From: BANK OF AMERICA, N.A.
To: MICROSEMI CORPORATION; MICROSEMI CORP.-ANALOG MIXED SIGNAL GROUP, A DELAWARE CORPORATION; MICROSEMI SOC CORP., A CALIFORNIA CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.) INC., A DELAWARE CORPORATION; MICROSEMI FREQUENCY AND TIME CORPORATION, A DELAWARE CORPORATION; MICROSEMI COMMUNICATIONS, INC. (F/K/A VITESSE SEMICONDUCTOR CORPORATION), A DELAWARE CORPORATION; MICROSEMI CORP.-MEMORY AND STORAGE SOLUTIONS (F/K/A WHITE ELECTRONIC DESIGNS CORPORATION), AN INDIANA CORPORATION
Reel/Frame 037558/0711 →
SECURITY AGREEMENT Recorded Apr 22, 2015
From: MICROSEMI CORPORATION; MICROSEMI CORP.-ANALOG MIXED SIGNAL GROUP; MICROSEMI SEMICONDUCTOR (U.S.) INC.; MICROSEMI SOC CORP.; MICROSEMI FREQUENCY AND TIME CORPORATION
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 035477/0057 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 20, 2014
From: DHAOUI, FETHI; MCCOLLUM, JOHN
To: MICROSEMI SOC CORPORATION
Reel/Frame 032931/0869 →
Continuity (2)
Provisional Application 61771665 · Mar 1, 2013
Related Publication 20140246719A1 · Sep 4, 2014