IP Library Granted Patent US 9,618,988
Granted Patent B2
US 9,618,988 · App. 14/410,146 · Granted Apr 11, 2017

Method and apparatus for managing a thermal budget of at least a part of a processing system

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Quick Facts
Patent No.
US 9,618,988
App. No.
14/410,146
Granted
Apr 11, 2017
Kind
B2
Abstract

A method of managing a thermal budget, for at least a part of a processing system, is described. The method comprises, upon detection of a use case event, determining a thermal budget violation time window for a current use case scenario of the at least part of the processing system, and managing the thermal budget for the at least part of the processing system based at least partly on the determined thermal budget violation time window.

Claims (58)

1. A method of managing a thermal budget for at least a part of a processing system, the method comprising:

in response to detecting, by a processing core of the processing system, a use case event;

scaling, by the processing core, thermal curve data, stored at a storage location of a memory of the processing system, based on a current use case scenario and one or more current environment parameters for the at least part of the processing system;

determining, by the processing core, a thermal budget violation time window for the current use case scenario of the at least part of the processing system based on the scaled thermal curve data; and

managing the thermal budget for the at least part of the processing system based on the determined thermal budget violation time window.

2. The method of claim 1 , wherein the thermal budget violation time window is further determined based on an estimated power consumption for the current use case scenario.

3. The method of claim 2 , wherein the method comprises estimating a power consumption for the current use case scenario based on at least one of:

at least one process scheduled for execution within the at least part of the processing system;

at least one process due to be scheduled for execution within the at least part of the processing system;

an operating mode of the at least part of the processing system;

an on-die leakage measurement and/or estimate for the at least part of the processing system; or

at least one processing system parameter for the at least part of the processing system.

4. The method of claim 1 , wherein scaling the thermal curve data for the at least part of the processing system is further based on at least one of:

an indication of a current junction temperature for the at least part of the processing system,

an indication of an ambient temperature for the at least part of the processing system,

at least one product parameter for the processing system, or

a process corner for the at least part of the processing system.

5. The method of claim 1 , wherein the method comprises managing the thermal budget for the at least part of the processing system by scheduling at least one process to be executed within the at least part of the processing system based on the thermal budget violation time window.

6. The method of claim 1 , wherein the method comprises managing the thermal budget for the at least part of the processing system by determining whether at least one performance sensitive process is scheduled, or due to be scheduled, and if it is determined that at least one performance sensitive process is scheduled, or due to be scheduled, scheduling at least one non performance sensitive process in consideration of the at least one performance sensitive process and the thermal budget violation time window.

7. The method of claim 6 , wherein the method comprises performing, if it is determined that at least one performance sensitive process is scheduled, or due to be scheduled, at least one of:

delaying at least one non performance sensitive process,

rescheduling at least one non performance sensitive process, or

re-prioritising at least one non performance sensitive process.

8. The method of claim 1 , wherein the method comprises managing the thermal budget for the at least part of the processing system by configuring a request for a reduced power state of the at least part of the processing system ahead of an expiry of the thermal budget violation time window.

9. The method of claim 1 , wherein the method comprises detecting the use case event based on at least one of:

a creation of at least one process within a predefined set of at least one use case event process(es), or

a termination of at least one process within the predefined set of at least one use case event process(es).

10. The method of claim 1 , wherein the use case event comprises at least one of:

the start/initiation of a use case,

a predefined event during the life cycle of a use case, or

the end/termination of a use case.

11. An integrated circuit device comprising:

a memory configured to store thermal curve data; and

a processing core coupled to the memory and to detect a use case event, and upon detection of the use case event to:

scale the thermal curve data based on a current use case scenario and one or more current environment parameters for at least part of the processing system;

determine a thermal budget violation time window for the current use case scenario of the at least part of the processing system based on the scaled thermal curve data; and

manage the thermal budget for the at least part of the processing system based on the determined thermal budget violation time window.

12. The integrated circuit device of claim 11 , wherein the thermal budget violation time window is further determined based on an estimated power consumption for the current use case scenario.

13. The integrated circuit device of claim 11 , wherein the scaled thermal curve data is further based on at least one of:

an indication of a current junction temperature for the at least part of the processing system,

an indication of an ambient temperature for the at least part of the processing system,

at least one product parameter for the processing system, or

a process corner for the at least part of the processing system.

14. The integrated circuit device of claim 11 , wherein the scheduling module is further to manage the thermal budget by scheduling at least one process to be executed within the processing system based on the thermal budget violation time window.

15. A processing system comprising:

a memory configured to store use case definitions and thermal curve data; and

a processing core coupled to the memory and to execute a scheduling module to:

detect a use case event based on the use case definitions, and upon detection of the use case event to:

scale the thermal curve data based on a current use case scenario and one or more current environment parameters for at least part of the processing system;

determine a thermal budget violation time window for the current use case scenario based on the scaled thermal curve data; and

manage the thermal budget for the at least part of the processing system based on the determined thermal budget violation time window.

16. The processing system of claim 15 , wherein the thermal budget violation time window is further determined based on an estimated power consumption for the current use case scenario.

17. The processing system of claim 15 , wherein the scheduling module is further configured to manage the thermal budget for the at least part of the processing system by scheduling at least one process to be executed within the at least part of the processing system based at least partly on the thermal budget violation time window.

18. The processing system of claim 15 , wherein the scheduling module is further configured to manage the thermal budget for the at least part of the processing system by determining whether at least one performance sensitive process is scheduled, or due to be scheduled, and the scheduling module is further configured to, if it is determined that at least one performance sensitive process is scheduled, or due to be scheduled, schedule at least one non performance sensitive process in consideration of the at least one performance sensitive process and the thermal budget violation time window.

19. The processing system of claim 15 , wherein the scheduling module is further configured to manage the thermal budget for the at least part of the processing system by configuring a request for a reduced power state of the at least part of the processing system ahead of an expiry of the thermal budget violation time window.

20. The processing system of claim 15 , wherein the scheduling module is further configured to detect the use case event based on at least one of:

a creation of at least one process within a predefined set of at least one use case event process(es), or

a termination of at least one process within the predefined set of at least one use case event process(es).

Assignments (20)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042762 FRAME 0145. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051145/0184 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042985 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0387 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051030/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050744/0097 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
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From: NXP SEMICONDUCTORS USA, INC. (MERGED INTO); FREESCALE SEMICONDUCTOR, INC. (UNDER)
To: NXP USA, INC.
Reel/Frame 041414/0883 →
CHANGE OF NAME Recorded Nov 16, 2016
From: FREESCALE SEMICONDUCTOR INC.
To: NXP USA, INC.
Reel/Frame 040626/0683 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12092129 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
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SUPPLEMENT TO THE SECURITY AGREEMENT Recorded Jun 16, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
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PATENT RELEASE Recorded Dec 21, 2015
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