PACKAGE SUBSTRATE WITH IMPROVED RELIABILITY
A packaged semiconductor device having a package substrate that includes a plurality of electrical contacts on a first major surface and a die positioned on a second major surface. Each of the plurality of electrical contacts includes a perimeter portion. A first subset of the electrical contacts have more than fifty percent of the perimeter portion bounded by a solder mask. A second subset of the electrical contacts have less than fifty percent of the perimeter portion bounded by a solder mask. The die is positioned over only the first subset of the electrical contacts.
1 . A packaged semiconductor device comprising:
a package substrate including a plurality of electrical contacts on a first major surface and a die positioned on a second major surface opposing the first major surface, wherein
edges of the die correspond to a die perimeter on the first major surface, each of the plurality of electrical contacts includes a contact perimeter portion, each electrical contact having located within the die
perimeter has more than fifty percent of the contact perimeter portion bounded by a solder mask, and
electrical contact having located outside of the die perimeter has less than fifty percent of the contact perimeter portion bounded by the solder mask.
2 . The packaged semiconductor device of claim 1 further comprising a carrier coupled to the plurality of electrical contacts.
3 . The packaged semiconductor device of claim 1 further comprising:
one of a group consisting of: a mold compound encapsulating the die and underfill between the die and the package substrate.
4 . The packaged semiconductor device of claim 1 wherein the die is one of a group consisting of an integrated circuit die, a sensor die, a passive component, a sensor device, and a mechanically rigid object.
5 . The packaged semiconductor device of claim 1 wherein the package substrate is one of a group consisting of a redistributed chip package (RCP) substrate, ball grid array package substrate, flip chip package substrate, wire bond ball grid array package substrate, an enhanced wafer level ball grid array, and a fan out wafer level package.
6 . The packaged semiconductor device of claim 1 further comprising a plurality of conductive traces, each of the conductive traces is connected to the contact perimeter portion of a corresponding one of the plurality of electrical contacts.
7 . The packaged semiconductor device of claim 1 wherein the plurality of electrical contacts includes solder material.
8 . The packaged semiconductor device of claim 1 wherein the contact perimeter portion is directly adjacent a connection between a pad on the substrate and a corresponding one of the plurality of electrical contacts.
9 . A packaged semiconductor device comprising:
a package substrate;
a solder mask on the package substrate;
a first set of electrical contacts on a first surface of the package substrate, the solder mask is in direct contact with more than fifty percent of a contact perimeter portion of the first set of electrical contacts;
a second set of electrical contacts on the first surface, the solder mask is in direct contact with less than fifty percent of a contact perimeter portion of the second set of electrical contacts; and
a die coupled to a second surface of the package substrate, wherein
the second surface opposes the first surface,
edges of the die correspond to a die perimeter on the first surface,
each electrical contact on the first surface located within the die perimeter is included in the first set of electrical contacts, and
each electrical contact on the first surface located outside of the die perimeter is included in the second set of electrical contacts.
10 . The packaged semiconductor device of claim 9 further comprising a carrier coupled to the first and second sets of the electrical contacts.
11 . The packaged semiconductor device of claim 9 further comprising:
one of a group consisting of: a mold compound encapsulating the die and underfill between the die and the package substrate.
12 . The packaged semiconductor device of claim 9 wherein the die is one of a group consisting of an integrated circuit die, a sensor die, a passive component, a sensor device, and a mechanically rigid object.
13 . The packaged semiconductor device of claim 9 wherein the package substrate is one of a group consisting of a redistributed chip package (RCP) substrate, ball grid array package substrate, flip chip package substrate, wire bond ball grid array package substrate, an enhanced wafer level ball grid array substrate, and a fan out wafer level package substrate.
14 . The packaged semiconductor device of claim 9 further comprising a plurality of conductive traces, each of the conductive traces is connected to the contact perimeter portion of a corresponding one of the plurality of electrical contacts.
15 . The packaged semiconductor device of claim 9 wherein the plurality of electrical contacts include solder material.
16 . The packaged semiconductor device of claim 9 wherein the contact perimeter portion is directly adjacent a connection between a pad on the substrate and a corresponding one of the plurality of electrical contacts.
17 . A method comprising:
forming electrical contacts in openings in a solder mask on a first surface of a package substrate, wherein
the first surface includes a die perimeter that corresponds to a die location on a second surface of the package substrate, the second surface opposing the first surface,
each opening in the solder mask located within the die perimeter is in contact with more than fifty percent of a contact perimeter portion of a corresponding electrical contact, and
each opening in the solder mask located outside of the die perimeter is in contact with less than fifty percent of a contact perimeter portion of a corresponding electrical contact; and
coupling a die to the die location on the second surface of the package substrate, wherein edges of the die correspond to the die perimeter on the first surface.
18 . The method of claim 17 further comprising at least one of a group of:
encapsulating the die in a mold compound, coupling the electrical contacts to a carrier substrate, and bonding the die to the package substrate.
19 . The method of claim 17 wherein the die is one of a group consisting of an integrated circuit die, a sensor die, a passive component, a sensor device, and a mechanically rigid object.
20 . The method of claim 17 wherein the package substrate is one of a group consisting of a redistributed chip package (RCP) substrate, ball grid array package substrate, flip chip package substrate, wire bond ball grid array package substrate, an enhanced wafer level ball grid array, and a fan out wafer level package.