Copper ball bond features and structure
View Patent ↗An integrated circuit wire bond connection is provided having an aluminum bond pad ( 51 ) that is directly bonded to a copper ball ( 52 ) to form an aluminum splash structure ( 53 ) and associated crevice opening ( 55 ) at a peripheral bond edge of the copper ball ( 54 ), where the aluminum splash structure ( 53 ) is characterized by a plurality of geometric properties indicative of a reliable copper ball bond, such as lateral splash size, splash shape, relative position of splash-ball crevice to the aluminum pad, crevice width, crevice length, crevice angle, and/or crevice-pad splash index.
1. An integrated circuit wire bond connection comprising:
a copper bond wire comprising a copper ball and an aluminum bond pad that is directly bonded to the copper ball to form an aluminum splash structure and associated crevice opening between the aluminum splash structure and copper ball at a peripheral bond edge of the copper ball, where the aluminum splash structure is characterized by a first plurality of geometric features indicative of a reliable copper ball bond comprising:
a splash height measure of the vertical distance from a top surface of the aluminum bond pad to a top surface of the aluminum splash structure that is less than half a ball bond height measure for the copper ball and more than half an original pad thickness measure for the aluminum bond pad; and
a gap height measure of the vertical distance from a lowest point of the crevice opening to the top surface of the aluminum splash structure that is less than eighty percent of the splash height measure.
2. The integrated circuit wire bond connection of claim 1 , where the original pad thickness measure for the aluminum bond pad is less than 1.5μm.
3. The integrated circuit wire bond connection of claim 1 , where the splash height measure is more than twice the original pad thickness measure for the aluminum bond pad.
4. The integrated circuit wire bond connection of claim 1 , where the gap height measure is less than seventy-five percent of the splash height measure.
5. The integrated circuit wire bond connection of claim 1 , where the first plurality of geometric features comprises a lateral splash size measure of a lateral extent of the aluminum splash structure which extends at least substantially to, but not substantially past, an outer perimeter of the copper ball.
6. The integrated circuit wire bond connection of claim 5 , where the aluminum splash structure is formed around substantially an entirety of the outer perimeter of the copper ball.
7. The integrated circuit wire bond connection of claim 1 , where the first plurality of geometric features for the aluminum splash structure comprises an elevated splash pad measure of a lateral extent of a base portion of the aluminum splash structure that is less than or equal to twice the lateral splash size measure.
8. The integrated circuit wire bond connection of claim 1 , where the crevice opening is characterized by a second plurality of geometric features comprising a crevice mouth width measure and a crevice length measure, where a ratio of the crevice mouth width measure to the crevice length measure is between 0.3 and 0.4.
9. An integrated circuit wire bond connection comprising:
a copper bond wire comprising a copper ball and an aluminum bond pad that is directly bonded to the copper ball to form an aluminum splash structure and associated crevice opening between the aluminum splash structure and copper ball at a peripheral bond edge of the copper ball, where the aluminum splash structure is characterized by a first plurality of geometric features comprising an elevated splash pad measure of a lateral extent of a base portion of the aluminum splash structure that is greater than the lateral splash size measure and less than or equal to twice the lateral splash size measure.
10. The integrated circuit wire bond connection of claim 8 , where the crevice mouth width is measured along a first tangent line from a first tangent intersection point on the aluminum splash structure to a second tangent intersection point on the copper ball, and where the crevice length measure is measured along a line from the lowest point of the crevice opening to a midpoint on the first tangent line.
11. The integrated circuit wire bond connection of claim 8 , where the crevice mouth width is measured along a first tangent line (1) that extends from a first tangent intersection point on the aluminum splash structure to a second intersection point on the copper ball, and (2) that is perpendicular to a second tangent line extending from the lowest point of the crevice opening to a second tangent intersection point on the aluminum splash structure; and where the crevice length measure is measured along a line from the lowest point of the crevice opening to the first tangent line.
12. The integrated circuit wire bond connection of claim 9 , where the first plurality of geometric features comprises:
a splash height measure of the vertical distance from a top surface of the aluminum bond pad to a top surface of the aluminum splash structure that is less than half a ball bond height measure for the copper ball and more than half an original pad thickness measure for the aluminum bond pad; and
a gap height measure of the vertical distance from a lowest point of the crevice opening to the top surface of the aluminum splash structure that is less than 80 percent of the splash height measure.
13. The integrated circuit wire bond connection of claim 9 , where the crevice opening is characterized by a second plurality of geometric features comprising a crevice mouth width measure and a crevice length measure, where a ratio of the crevice mouth width measure to the crevice length measure is between 0.3 and 0.4.
14. An integrated circuit wire bond connection comprising:
a copper bond wire comprising a copper ball and an aluminum bond pad that is directly bonded to the copper ball to form an aluminum splash structure and associated crevice opening between the aluminum splash structure and copper ball at a peripheral bond edge of the copper ball, where the aluminum splash structure is characterized by a first plurality of geometric features indicative of a reliable copper ball bond, and where the crevice opening between the aluminum splash structure and copper ball is characterized by a second plurality of geometric features comprising:
a crevice initiation plane intersecting the lowest point of the crevice opening and positioned above a top surface of the aluminum bond pad; and
a crevice mouth width measure and a crevice length measure, where a ratio of the crevice mouth width measure to the crevice length measure is between 0.1 and 0.5.
15. The integrated circuit wire bond connection of claim 14 , where the ratio of the crevice mouth width measure to the crevice length measure is greater than 0.3.
16. The integrated circuit wire bond connection of claim 15 , where the ratio of the crevice mouth width measure to the crevice length measure is less than 0.4.
17. The integrated circuit wire bond connection of claim 14 , where the first plurality of geometric features comprises:
a splash height measure of the vertical distance from a top surface of the aluminum bond pad to a top surface of the aluminum splash structure that is less than half a ball bond height measure for the copper ball and more than half an original pad thickness measure for the aluminum bond pad; and
a gap height measure of the vertical distance from a lowest point of the crevice opening to the top surface of the aluminum splash structure that is less than 80 percent of the splash height measure.
18. The integrated circuit wire bond connection of claim 14 , where the first plurality of geometric features for the aluminum splash structure comprises an elevated splash pad measure of a lateral extent of a base portion of the aluminum splash structure that is less than or equal to twice the lateral splash size measure.