Semiconductor device including accelerometer devices
A semiconductor device is formed such that a semiconductor substrate of the device has a non-uniform thickness. A cavity is etched at a selected side of the semiconductor substrate, and the selected side is then fusion bonded to another substrate, such as a carrier substrate. After fusion bonding, the side of the semiconductor substrate opposite the selected side is ground to a defined thickness. Accordingly, the semiconductor substrate has a uniform thickness except in the area of the cavity, where the substrate is thinner. Devices that benefit from a thinner substrate, such as an accelerometer, can be formed over the cavity.
1. A semiconductor device, comprising:
a first substrate having a first side and a second side, the first substrate having a cavity formed at the first side, such that the first substrate has a first thickness between the second side and a bottom of the cavity and a second thickness between the first side and the second side;
a second substrate bonded to the first side of the first substrate;
a first accelerometer device associated with a first axis, at least a portion of the first accelerometer device disposed on the second side and over a bottom of the cavity; and
a second accelerometer device associated with a second axis, the second accelerometer device disposed on the second side and not disposed over the bottom of the cavity.
2. The semiconductor device of claim 1 , wherein the first thickness is less than 65 percent of the second thickness.
3. The semiconductor device of claim 1 , wherein the first thickness is less than 60 percent of the second thickness.
4. The semiconductor device of claim 1 , wherein the first thickness is less than 25 percent of the second thickness.
5. The semiconductor device of claim 1 , wherein the portion of the first accelerometer device comprises a first accelerometer spring.
6. The semiconductor device of claim 1 , wherein the second accelerometer device comprises a second accelerometer spring.
7. The semiconductor device of claim 1 , further comprising a third accelerometer device associated with a third axis, the third accelerometer device disposed on the second side and not disposed over the bottom of the cavity.
8. The semiconductor device of claim 7 , wherein the third accelerometer device comprising a third accelerometer spring.
9. The semiconductor device of claim 1 , further comprising polysilicon runners disposed on the first side.
10. The semiconductor device of claim 1 , wherein the first accelerometer device has a characteristic inversely proportional to the first thickness.
11. The semiconductor device of claim 1 , wherein the second accelerometer device has a characteristic proportional to the second thickness.
12. A semiconductor device, comprising:
a first substrate having a front side and a back side, a cavity formed at the back side, a first portion of the front side disposed over the cavity having a first thickness defined between the front side and a bottom of the cavity, a second portion of the front side having a second thickness defined between the first side and the second side;
a first accelerometer device associated with a first axis, the first accelerometer device disposed at the first portion of the front side and over the cavity;
a second accelerometer device associated with a second axis, the second accelerometer device disposed at the second portion of the front side and not over the cavity; and
a second substrate coupled to the back side of the first substrate.
13. The semiconductor device of claim 12 , wherein the first accelerometer device comprises a first accelerometer spring.
14. The semiconductor device of claim 12 , wherein the second accelerometer device comprises a second accelerometer spring.
15. The semiconductor device of claim 12 , further comprising a third accelerometer device associated with a third axis and disposed at the second portion of the front side and not over the cavity.
16. The semiconductor device of claim 15 , wherein the third accelerator device comprises a third accelerometer spring.
17. The semiconductor device of claim 15 , wherein a characteristic of the third accelerometer device is proportional to the second thickness.
18. The semiconductor device of claim 12 , further comprising runners disposed on the back side of the first substrate.
19. The semiconductor device of claim 12 , wherein a characteristic of the first accelerometer device is inversely proportional to the first thickness.
20. The semiconductor device of claim 12 , wherein a characteristic of the second accelerometer device is proportional to the second thickness.