IP Library Granted Patent US 9,979,356
Granted Patent B2
US 9,979,356 · App. 14/573,927 · Granted May 22, 2018

Magnetically coupled load modulation

Inventors: Damon G. Holmes (Scottsdale, AZ); Ramanujam Srinidhi Embar (Gilbert, AZ); Joseph Staudinger (Gilbert, AZ); Michael E. Watts (Scottsdale, AZ)
Assignee: NXP USA, INC.
H03F1/083H03F1/0288H03F3/195H03F2200/451H03F2200/537H03F2200/541
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Quick Facts
Patent No.
US 9,979,356
App. No.
14/573,927
Granted
May 22, 2018
Kind
B2
Abstract

A method, packaged semiconductor device, and system for controlling a secondary amplifier output current based on an input signal received from an amplifier input, converting electrical energy to magnetic energy at a secondary amplifier output inductor, coupling the magnetic energy from the secondary amplifier output inductor to a primary amplifier output inductor, converting the coupled magnetic energy to induced electrical energy at the primary amplifier output inductor, combining the induced electrical energy with output electrical energy from a primary amplifier gain element, and applying a combined electrical energy including the output electrical energy and the induced electrical energy to a primary amplifier load are provided.

Claims (49)

1. A method comprising:

controlling a secondary amplifier output current of a secondary radio frequency (RF) amplifier gain element based on an input signal received from an amplifier input;

providing the secondary amplifier output current to a secondary amplifier output inductor to convert electrical energy to magnetic energy;

coupling the magnetic energy from the secondary amplifier output inductor to a primary amplifier output inductor, wherein the coupled magnetic energy is converted to induced electrical energy at the primary amplifier output inductor;

combining the induced electrical energy with output electrical energy from a primary RF amplifier gain element;

applying a combined electrical energy including the output electrical energy and the induced electrical energy to a primary amplifier load; and

wherein the combining the induced electrical energy with the output electrical energy from the primary RF amplifier gain element further comprises modulating a primary amplifier load impedance of the primary amplifier load as a function of the induced electrical energy.

2. The method of claim 1 wherein the modulating comprises:

modulating the primary amplifier load impedance according to an equation Z m =jωL+R m +jX m +jωM(I p /I m ), where Z m equals the primary amplifier load impedance, j equals the square root of negative one, ω equals two times pi times a frequency of operation, L equals a self inductance of the primary amplifier output inductor, R m equals a primary amplifier load resistance of the primary amplifier load, X m equals a primary amplifier output capacitive reactance, M equals a mutual inductance, I p equals a secondary amplifier output current, and I m equals a primary amplifier output current.

3. A method comprising:

controlling a secondary amplifier output current of a secondary radio frequency (RF) amplifier gain element based on an input signal received from an amplifier input;

providing the secondary amplifier output current to a secondary amplifier output inductor to convert electrical energy to magnetic energy;

coupling the magnetic energy from the secondary amplifier output inductor to a primary amplifier output inductor, wherein the coupled magnetic energy is converted to induced electrical energy at the primary amplifier output inductor;

combining the induced electrical energy with output electrical energy from a primary RF amplifier gain element;

applying a combined electrical energy including the output electrical energy and the induced electrical energy to a primary amplifier load; and

wherein the converting the electrical energy to the magnetic energy at the secondary amplifier output inductor further comprises: providing impedance inversion of a secondary amplifier load impedance of the secondary RF amplifier gain element.

4. The method of claim 1 wherein the combining the induced electrical energy with the output electrical energy from the primary RF amplifier gain element comprises:

combining a main amplifier output signal with a peaking amplifier output signal, wherein a Doherty amplifier comprises the primary RF amplifier gain element outputting the output electrical energy and the secondary RF amplifier gain element outputting the output electrical energy.

5. The method of claim 1 further comprising:

configuring the primary amplifier output inductor and the secondary amplifier output inductor to have a maximum separation of 40 mils.

6. The method of claim 1 further comprising:

configuring the primary amplifier output inductor and the secondary amplifier output inductor as arcuate planar coils.

7. A packaged semiconductor device comprising:

a primary radio frequency (RF) amplifier gain element;

a primary amplifier output inductor electrically coupled to the primary RF amplifier gain element;

a primary amplifier load electrically coupled to the primary amplifier output inductor;

a secondary RF amplifier gain element;

a secondary amplifier output inductor electrically coupled to the secondary RF amplifier gain element and magnetically coupled to the primary amplifier output inductor; and

a secondary amplifier load electrically coupled to the secondary amplifier output inductor, wherein the secondary amplifier output inductor magnetically couples a majority of a secondary amplifier output power of the secondary RF amplifier gain element to the primary amplifier output inductor to be applied to the primary amplifier load.

8. The packaged semiconductor device of claim 7 wherein the secondary amplifier output inductor modulates a primary amplifier output inductor impedance of the primary amplifier output inductor via magnetic coupling as a function of a secondary amplifier output of the secondary RF amplifier gain element.

9. The packaged semiconductor device of claim 7 wherein a primary amplifier gain element output impedance presented to a primary amplifier output of the primary RF amplifier gain element conforms to an equation Z m =jωL+R m +jX m +jωM(I p /I m ), where Z m equals the primary amplifier load impedance, j equals the square root of negative one, ω equals two times pi times a frequency of operation, L equals a self inductance of the primary amplifier output inductor, Rm equals a primary amplifier load resistance of the primary amplifier load, X m equals a primary amplifier output capacitive reactance, M equals a mutual inductance, I p equals a secondary amplifier output current, and I m equals a primary amplifier output current.

10. The packaged semiconductor device of claim 7 wherein the secondary amplifier output inductor, in conjunction with the primary amplifier output inductor, functions as an impedance inverter.

11. The packaged semiconductor device of claim 7 wherein a Doherty amplifier comprises the primary RF amplifier gain element and the secondary RF amplifier gain element.

12. The packaged semiconductor device of claim 7 wherein the primary amplifier output inductor and the secondary amplifier output inductor have a maximum separation of 40 mils.

13. The packaged semiconductor device of claim 7 wherein the primary amplifier output inductor and the secondary amplifier output inductor are arcuate planar coils.

14. A system comprising:

a signal input;

a phase adjustment circuit coupled to the signal input for receiving a radio frequency (RF) input signal;

a primary RF amplifier gain element coupled to the phase adjustment circuit for receiving a first instance having a first phase of an RF signal;

a secondary RF amplifier gain element coupled to the phase adjustment circuit for receiving a second instance having a second phase of the RF signal;

a primary amplifier output inductor electrically coupled to a primary amplifier output of the primary RF amplifier gain element;

a primary amplifier load electrically coupled to the primary amplifier output inductor;

a secondary amplifier output inductor electrically coupled to a secondary amplifier output of the secondary RF amplifier gain element and magnetically coupled to the primary amplifier output inductor; and

a secondary amplifier load electrically coupled to the secondary amplifier output inductor, wherein the secondary amplifier output inductor magnetically couples a majority of a secondary amplifier output power of the secondary RF amplifier gain element to the primary amplifier output inductor to be applied to the primary amplifier load.

15. The system of claim 14 wherein the secondary amplifier output inductor modulates a primary amplifier output inductor impedance of the primary amplifier output inductor via magnetic coupling as a function of a secondary amplifier output of the secondary RF amplifier gain element.

16. The system of claim 14 wherein a primary amplifier output impedance presented to the primary amplifier output conforms to an equation Z m =jωL+R m +jX m +jωM(I p /I m ), where Z m equals the primary amplifier load impedance, j equals the square root of negative one, ω equals two times pi times a frequency of operation, L equals a self inductance of the primary amplifier output inductor, Rm equals a primary amplifier load resistance of the primary amplifier load, X m equals a primary amplifier output capacitive reactance, M equals a mutual inductance, I p equals a secondary amplifier output current, and I m equals a primary amplifier output current.

17. The system of claim 14 wherein the secondary amplifier output inductor, in conjunction with the primary amplifier output inductor, functions as an impedance inverter.

18. The system of claim 14 wherein a Doherty amplifier comprises the primary RF amplifier gain element and the secondary RF amplifier gain element.

19. The system of claim 14 wherein the primary amplifier output inductor and the secondary amplifier output inductor are arcuate planar coils.

Assignments (15)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040925 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Feb 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V. F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 052917/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040928 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Jan 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 052915/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050744/0097 →
CORRECTIVE ASSIGNMENT TO CORRECT THE NATURE OF CONVEYANCE PREVIOUSLY RECORDED AT REEL: 040626 FRAME: 0683. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER AND CHANGE OF NAME EFFECTIVE NOVEMBER 7, 2016. Recorded Jan 12, 2017
From: NXP SEMICONDUCTORS USA, INC. (MERGED INTO); FREESCALE SEMICONDUCTOR, INC. (UNDER)
To: NXP USA, INC.
Reel/Frame 041414/0883 →
CHANGE OF NAME Recorded Nov 16, 2016
From: FREESCALE SEMICONDUCTOR INC.
To: NXP USA, INC.
Reel/Frame 040626/0683 →
RELEASE OF SECURITY INTEREST Recorded Nov 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 040928/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 21, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V., F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 040925/0001 →
SUPPLEMENT TO THE SECURITY AGREEMENT Recorded Jun 16, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039138/0001 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 5, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037444/0444 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 5, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037444/0535 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037358/0001 →
SUPPLEMENT TO IP SECURITY AGREEMENT Recorded Feb 18, 2015
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 035034/0019 →
SUPPLEMENT TO IP SECURITY AGREEMENT Recorded Feb 18, 2015
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 035033/0923 →
SUPPLEMENT TO IP SECURITY AGREEMENT Recorded Feb 18, 2015
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 035033/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 17, 2014
From: HOLMES, DAMON G.; EMBAR, RAMANUJAM SRINIDHI; STAUDINGER, JOSEPH; WATTS, MICHAEL E.
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 034532/0677 →
Continuity (1)
Related Publication 20160181992A1 · Jun 23, 2016