Semiconductor device and lead frame having vertical connection bars
View Patent ↗A semiconductor device includes a lead frame having a die support area and a plurality of inner and outer row leads surrounding the die support area, and a semiconductor die mounted on the die support area and electrically connected to the leads with bond wires. A molding material encapsulates the semiconductor die, the bond wires, and the leads, and defines a package body. The semiconductor device further includes connection bars extending vertically from the leads to a top surface of the package body. The connection bars connect the inner row leads to respective ones of the outer row leads before the molding process is performed.
1. A semiconductor device, comprising:
a lead frame having a die support area and at least two rows of leads surrounding the die support area, wherein the two rows of leads include a plurality of inner row leads and a plurality of outer row leads;
a semiconductor die mounted on the die support area and electrically connected to the two rows of leads with a plurality of bond wires;
a molding material encapsulating the semiconductor die, the bond wires and the two rows of leads, wherein the molding material defines a package body and the two rows of leads are exposed on a bottom surface of the package body; and
inner connection bars connected to the inner row leads, wherein the inner connection bars extend vertically from the inner row leads to a top surface of the package body, wherein the inner connection bars are connected to respective ones of the outer row leads before the molding material is provided to encapsulate the semiconductor die, the bond wires and the two rows of leads, and
wherein at least one of the outer row leads has an outer connection bar extending vertically to the top surface of the package body, wherein the outer connection bar is connected to at least one of the inner connection bars before the molding material is provided to encapsulate the semiconductor die, the bond wires and the two rows of leads.
2. The semiconductor device of claim 1 , wherein each lead comprises a proximal end and an opposing distal end, the inner connection bar of each inner row lead extends from the distal end of each inner row lead, and the outer connection bar of each outer row lead extends from the proximal end of each outer row lead.
3. The semiconductor device of claim 2 , wherein each lead further comprises two sides opposite to each other and adjacent to the proximal and distal ends, and wherein each of the inner and outer connection bars is offset to one of the two sides of each lead.
4. The semiconductor device of claim 1 , wherein at least one of the inner and outer connection bars extends to the top surface of the package body with an inclination angle that is greater than 90°.
5. The semiconductor device of claim 1 , wherein the inner row leads and the outer row leads are staggered.
6. The semiconductor device of claim 5 , wherein the outer row leads are connected to each other by a dam bar before molding, wherein the dam bar comprises at least one outer connection bar that extends between two outer row leads for connecting to one of the inner row leads before molding.
7. A lead frame, comprising:
a die support area for supporting a semiconductor die;
at least two rows of leads surrounding the die support area, wherein the two rows of leads include a plurality of inner row leads and a plurality of outer row leads;
a plurality of inner row connection bars respectively connected to each of the inner row leads, wherein the plurality of inner row connection bars is bendable to a vertical position; and
a plurality of outer row connection bars respectively connected to each of the outer row leads, wherein the plurality of outer row connection bars is bendable to a vertical position, and wherein each of the plurality of outer row connection bars is connected to a respective one of the plurality of inner row connection bars.
8. The lead frame of claim 7 , wherein each lead comprises a proximal end and an opposing distal end, and the plurality of inner row and outer row connection bars respectively extend from the distal end of each inner row lead, and the proximal end of each outer row lead.
9. The lead frame of claim 8 , wherein each lead further comprises two sides opposite to each other and adjacent to the proximal and distal ends, and the inner row and outer row connection bars are offset to one of the two sides.
10. The lead frame of claim 7 , wherein the inner row leads and the outer row leads are staggered.
11. The lead frame of claim 10 , further comprising a dam bar connecting adjacent outer row leads, and wherein the inner row and outer row connection bars connect the inner row leads to the dam bar.