IP Library Granted Patent US 9,455,116
Granted Patent B2
US 9,455,116 · App. 14/692,395 · Granted Sep 27, 2016

Angular scanning using angular energy filter

Inventors: Causon Ko-Chuan Jen (San Jose, CA); William Bintz (Londonderry, NH)
Assignee: Axcells Technologies, Inc.
H01J37/1474H01J37/1478H01J37/20H01J37/3171H01J2237/08H01J2237/151H01J2237/152H01J2237/1506H01J2237/20207H01J2237/20214H01J2237/31701H01J2237/31708
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Quick Facts
Patent No.
US 9,455,116
App. No.
14/692,395
Granted
Sep 27, 2016
Kind
B2
Abstract

An ion implantation system and method is provided for varying an angle of incidence of a scanned ion beam relative to the workpiece concurrent with the scanned ion beam impacting the workpiece. The system has an ion source configured to form an ion beam and a mass analyzer configured to mass analyze the ion beam. An ion beam scanner is configured to scan the ion beam in a first direction, therein defining a scanned ion beam. A workpiece support is configured to support a workpiece thereon, and an angular implant apparatus is configured to vary an angle of incidence of the scanned ion beam relative to the workpiece. The angular implant apparatus comprises one or more of an angular energy filter and a mechanical apparatus operably coupled to the workpiece support, wherein a controller controls the angular implant apparatus, thus varying the angle of incidence of the scanned ion beam relative to the workpiece concurrent with the scanned ion beam impacting the workpiece.

Claims (32)

1. An ion implantation system, comprising:

an ion source configured to form an ion beam;

a mass analyzer configured to mass analyze the ion beam;

an ion beam scanner configured to scan the ion beam along a first axis, therein defining a scanned ion beam;

a workpiece support configured to support a workpiece thereon;

an angular implant apparatus, wherein the angular implant apparatus is configured to vary an angle of incidence of the scanned ion beam relative to the workpiece along a second axis; and

a controller configured to control the angular implant apparatus, wherein the controller is configured to vary the angle of incidence of the scanned ion beam relative to the workpiece concurrent with the scanned ion beam impacting the workpiece, wherein the angular implant apparatus comprises an angular energy filter positioned downstream of the ion beam scanner, and wherein the controller is configured to vary an input to the angular energy filter, therein varying the angle of incidence of the scanned ion beam relative to the workpiece concurrent with the scanned ion beam impacting the workpiece.

2. The ion implantation system of claim 1 , wherein the angular energy filter comprises one or more of a magnetic deflection module and an electrostatic deflection module.

3. The ion implantation system of claim 1 , wherein the angular implant apparatus further comprises a mechanical apparatus operably coupled to the workpiece support, wherein the mechanical apparatus is further configured to further vary the angle of incidence of the scanned ion beam relative to the workpiece.

4. The ion implantation system of claim 3 , wherein the controller is further configured to control the mechanical apparatus and angular energy filter.

5. The ion implantation system of claim 3 , wherein the mechanical apparatus is configured to rotate the workpiece with respect to the ion beam.

6. The ion implantation system of claim 1 , wherein the angular implant apparatus further comprises a mechanical apparatus operably coupled to the workpiece support, wherein the mechanical apparatus is further configured to further vary the angle of incidence of the scanned ion beam relative to the workpiece, and wherein the controller is further configured to control the mechanical apparatus concurrent with the scanned ion beam impacting the workpiece.

7. The ion implantation system of claim 1 , further comprising a workpiece scanner configured to scan the workpiece relative to the ion beam.

8. A method for implanting ions into a workpiece at multiple incident angles, the method comprising:

providing a workpiece on a workpiece support;

scanning an ion beam relative to the workpiece; and

varying an angle of incidence of the scanned ion beam relative to the workpiece via an angular implant apparatus concurrent with the scanned ion beam impacting the workpiece, wherein varying the angle of incidence of the scanned ion beam relative to the workpiece comprises varying an input to an angular energy filter, therein varying the angle of incidence of the scanned ion beam relative to the workpiece concurrent with the scanned ion beam impacting the workpiece.

9. The method of claim 8 , wherein the angular energy filter comprises one or more of a magnetic deflection module and an electrostatic deflection module.

10. The method of claim 8 , varying the angle of incidence of the scanned ion beam relative to the workpiece further comprises mechanically varying an angle of the workpiece support with respect to the scanned ion beam.

11. The method of claim 10 , wherein mechanically varying the angle of the workpiece support is performed concurrent with the scanned ion beam impacting the workpiece.

12. An ion implantation system, comprising:

an ion source configured to form an ion beam;

a mass analyzer configured to mass analyze the ion beam;

an ion beam scanner configured to scan the ion beam along a first axis, therein defining a scanned ion beam;

a workpiece support configured to support a workpiece thereon;

an angular energy filter, wherein the angular energy filter is configured to vary an angle of incidence of the scanned ion beam relative to the workpiece along a second axis; and

a controller configured to control the angular energy filter, wherein the controller is configured to vary the angle of incidence of the scanned ion beam relative to the workpiece concurrent with the scanned ion beam impacting the workpiece.

13. The ion implantation system of claim 12 , wherein the angular energy filter positioned downstream of the ion beam scanner, and wherein the controller is configured to vary an input to the angular energy filter, therein varying the angle of incidence of the scanned ion beam relative to the workpiece along the second axis concurrent with the scanned ion beam impacting the workpiece.

14. The ion implantation system of claim 13 , wherein the angular energy filter comprises one or more of a magnetic deflection module and an electrostatic deflection module.

15. The ion implantation system of claim 12 , wherein the workpiece support further comprises a mechanical apparatus operably coupled thereto, wherein the mechanical apparatus is configured to further vary the angle of incidence of the scanned ion beam relative to the workpiece, and wherein the controller is further configured to control the mechanical apparatus.

16. The ion implantation system of claim 15 , wherein the mechanical apparatus is configured to rotate the workpiece with respect to the ion beam.

17. The ion implantation system of claim 16 , wherein the controller is configured to evenly expose a plurality of sides of a three-dimensional structure disposed on a surface of the workpiece via a control of the angular energy filter and mechanical apparatus.

Assignments (3)
RELEASE OF SECURITY INTEREST Recorded Apr 7, 2023
From: SILICON VALLEY BANK A DIVISION OF FIRST-CITIZENS BANK & TRUST COMPANY
To: AXCELIS TECHNOLOGIES, INC.
Reel/Frame 063270/0277 →
SECURITY INTEREST Recorded Jul 31, 2020
From: AXCELIS TECHNOLOGIES, INC.
To: SILICON VALLEY BANK, AS ADMINISTRATIVE AGENT
Reel/Frame 053375/0055 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 21, 2015
From: JEN, CAUSON KO-CHUAN; BINTZ, WILLIAM
To: AXCELIS TECHNOLOGIES, INC.
Reel/Frame 035461/0375 →
Continuity (2)
Provisional Application 61986350 · Apr 30, 2014
Related Publication 20150318142A1 · Nov 5, 2015