Patent Assignment
Reel/Frame 063270/0277
RELEASE OF SECURITY INTEREST
Recorded: 2023-04-07
Received: 2023-04-07
Pages: 37
Assignor
SILICON VALLEY BANK A DIVISION OF FIRST-CITIZENS BANK & TRUST COMPANY
Executed: 2023-04-05
Assignee
AXCELIS TECHNOLOGIES, INC.
108 CHERRY HILL DRIVE, BEVERLY, MA, 01915, UNITED STATES
Covered Applications
(100)
STEPPED INDIRECTLY HEATED CATHODE WITH IMPROVED SHIELDING
App. No. 63/040,724
→
SYSTEM AND METHOD FOR EXTENDING A LIFETIME OF AN ION SOURCE FOR MOLECULAR CARBON IMPLANTS
App. No. 16/887,571
→
CHARGE STRIPPING FOR ION IMPLANTATION SYSTEMS
App. No. 16/887,446
→
HIGH POWER WAFER COOLING
App. No. 16/860,386
→
MULTIPLE ARC CHAMBER SOURCE
App. No. 16/850,066
→
LIQUID METAL ION SOURCE
App. No. 16/824,069
→
METHOD OF MIXING UPSTREAM AND DOWNSTREAM CURRENT MEASUREMENTS FOR INFERENCE OF THE BEAM CURRENT AT THE BEND OF AN OPTICAL ELEMENT FOR REALTIME DOSE CONTROL
App. No. 16/791,308
→
APPARATUS AND METHOD FOR METAL CONTAMINATION CONTROL IN AN ION IMPLANTATION SYSTEM USING CHARGE STRIPPING MECHANISM
App. No. 62/971,473
→
SCAN AND CORRECTOR MAGNET DESIGNS FOR HIGH THROUGHPUT SCANNED BEAM ION IMPLANTER
App. No. 16/720,499
→
SUBSTRATE SUPPORT HAVING CUSTOMIZABLE AND REPLACEABLE FEATURES FOR ENHANCED BACKSIDE CONTAMINATION PERFORMANCE
App. No. 16/549,239
→
METHOD OF ENHANCING THE ENERGY AND BEAM CURRENT ON RF BASED IMPLANTER
App. No. 16/544,000
→
TOXIC OUTGAS CONTROL POST PROCESS
App. No. 16/509,915
→
SYSTEM AND METHOD FOR EXTENDING A LIFETIME OF AN ION SOURCE OBJECT FOR MOLECULAR CARBON IMPLANTS
App. No. 62/857,883
→
CHARGE STRIPPING FOR ION IMPLANTATION SYSTEMS
App. No. 62/853,945
→
HYDROGEN BLEED GAS FOR AN ION SOURCE HOUSING
App. No. 16/409,423
→
HIGH POWER WAFER COOLING
App. No. 62/841,272
→
MULTIPLE ARC CHAMBER SOURCE
App. No. 62/834,667
→
IN-SITU WAFER TEMPERATURE MEASUREMENT AND CONTROL
App. No. 16/367,948
→
LIQUID METAL ION SOURCE
App. No. 62/822,313
→
METHOD OF MIXING UPSTREAM AND DOWNSTREAM CURRENT MEASUREMENTS FOR INFERENCE OF THE BEAM CURRENT AT THE BEND OF AN OPTICAL ELEMENT FOR REALTIME DOSE CONTROL
App. No. 62/806,173
→
HYDROGEN GENERATOR FOR AN ION IMPLANTER
App. No. 16/252,884
→
REDUCTION OF CONDENSED GASES ON CHAMBER WALLS VIA PURGE GAS DILUTION AND EVACUATION FOR SEMICONDUCTOR PROCESSING EQUIPMENT
App. No. 16/240,071
→
REDUCTION OF CONDENSED GASES ON CHAMBER WALLS VIA HEATED CHAMBER HOUSING FOR SEMICONDUCTOR PROCESSING EQUIPMENT
App. No. 16/239,995
→
METHOD FOR DECREASING COOL DOWN TIME WITH HEATED SYSTEM FOR SEMICONDUCTOR MANUFACTURING EQUIPMENT
App. No. 16/229,572
→
TETRODE EXTRACTION APPARATUS FOR ION SOURCE
App. No. 16/227,296
→
WAFER SOAK TEMPERATURE READBACK AND CONTROL VIA THERMOCOUPLE EMBEDDED END EFFECTOR FOR SEMICONDUCTOR PROCESSING EQUIPMENT
App. No. 16/227,399
→
SYSTEM AND METHOD OF ARC DETECTION USING DYNAMIC THRESHOLD
App. No. 16/225,298
→
SCAN AND CORRECTOR MAGNET DESIGNS FOR HIGH THROUGHPUT SCANNED BEAM ION IMPLANTER
App. No. 16/218,884
→
ION SOURCE WITH TAILORED EXTRACTION APERTURE SHAPE
App. No. 16/217,664
→
FILM STABILIZATION THROUGH NOVEL MATERIALS MODIFICATION OF BEAMLINE COMPONENTS
App. No. 16/192,838
→
SHALLOW ANGLE, MULTI-WAVELENGTH, MULTI-RECEIVER, ADJUSTABLE SENSITIVITY ALIGNER SENSOR FOR SEMICONDUCTOR MANUFACTURING EQUIPMENT
App. No. 16/170,085
→
SYSTEM AND METHOD FOR IN-SITU BEAMLINE FILM STABILIZATION OR REMOVAL IN THE AEF REGION
App. No. 16/152,439
→
RF RESONATOR FOR ION BEAM ACCELERATION
App. No. 16/124,676
→
SYSTEM AND METHOD FOR ALIGNING LIGHT-TRANSMITTING BIREFRINGENT WORKPIECES
App. No. 16/114,745
→
SUBSTRATE SUPPORT HAVING CUSTOMIZABLE AND REPLACEABLE FEATURES FOR ENHANCED BACKSIDE CONTAMINATION PERFORMANCE
App. No. 62/722,359
→
SCANNING MAGNET DESIGN WITH ENHANCED EFFICIENCY
App. No. 16/106,745
→
LANTHANATED TUNGSTEN ION SOURCE AND BEAMLINE COMPONETS
App. No. 16/102,868
→
LOW CONDUCTANCE SELF-SHIELDING INSULATOR FOR ION IMPLANTATION SYSTEMS
App. No. 16/100,645
→
HYDROGEN CO-GAS WHEN USING ALUMINUM IODIDE AS AN ION SOURCE MATERIAL
App. No. 15/995,707
→
HYDROGEN BLEED GAS FOR AN ION SOURCE HOUSING
App. No. 62/670,307
→
WAFER COOLING SYSTEM AND METHOD
App. No. 15/951,495
→
IN-SITU WAFER TEMPERATURE MEASUREMENT AND CONTROL
App. No. 62/650,832
→
TWO-AXIS VARIABLE WIDTH MASS RESOLVING APERTURE WITH FAST ACTING SHUTTER MOTION
App. No. 15/909,318
→
OUTGASSING IMPACT ON PROCESS CHAMBER REDUCTION VIA CHAMBER PUMP AND PURGE
App. No. 15/884,492
→
HYDROGEN GENERATOR FOR AN ION IMPLANTER
App. No. 62/620,144
→
ACTIVE WORKPIECE HEATING OR COOLING FOR AN ION IMPLANTATION SYSTEM
App. No. 15/866,209
→
METHOD TO PROVIDE CONSISTENT ELECTROSTATIC CLAMPING THROUGH REAL TIME CONTROL OF ELECTROSTATIC CHARGE DEPOSITION IN AN ELECTROSTATIC CHUCK
App. No. 15/831,972
→
PHOSPHINE CO-GAS FOR CARBON IMPLANTS
App. No. 15/807,652
→
PHOSPHOROUS TRIFLUORIDE CO-GAS FOR CARBON IMPLANTS
App. No. 15/807,664
→
SHALLOW ANGLE, MULTI-WAVELENGTH, MULTI-RECEIVER, ADJUSTABLE SENSITIVITY ALIGNER SENSOR FOR SEMICONDUCTOR MANUFACTURING EQUIPMENT
App. No. 62/576,791
→
WAFER TEMPERATURE CONTROL WITH CONSIDERATION TO BEAM POWER INPUT
App. No. 15/707,473
→
ION IMPLANTATION SYSTEM HAVING BEAM ANGLE CONTROL IN DRIFT AND DECELERATION MODES
App. No. 15/637,538
→
IMPLANTATION USING SOLID ALUMINUM IODIDE (ALI3) FOR PRODUCING ATOMIC ALUMINUM IONS AND IN SITU CLEANING OF ALUMINUM IODIDE AND ASSOCIATED BY-PRODUCTS
App. No. 15/627,989
→
IMPLANTATION USING SOLID ALUMINUM IODIDE (ALI3) FOR PRODUCING ATOMIC ALUMINUM IONS AND IN SITU CLEANING OF ALUMINUM IODIDE AND ASSOCIATED BY-PRODUCTS
App. No. 15/627,952
→
WAFER COOLING APPARATUS AND METHOD
App. No. 15/609,273
→
ION SOURCE REPELLER SHIELD
App. No. 15/477,680
→
ION SOURCE CATHODE SHIELD
App. No. 15/410,711
→
MULTI-PIECE ELECTRODE APERTURE
App. No. 15/410,707
→
ACTIVE WORKPIECE HEATING OR COOLING FOR AN ION IMPLANTATION SYSTEM
App. No. 62/444,620
→
HIGH THROUGHPUT SERIAL WAFER HANDLING END STATION
App. No. 15/391,086
→
TWO-AXIS VARIABLE WIDTH MASS RESOLVING APERTURE WITH FAST ACTING SHUTTER MOTION
App. No. 15/363,728
→
SYSTEM FOR SEMICONDUCTOR WAFER RETENTION AND SENSING IN A VACUUM LOAD LOCK
App. No. 15/361,813
→
LOW CONDUCTANCE SELF-SHIELDING INSULATOR FOR ION IMPLANTATION SYSTEMS
App. No. 15/350,832
→
ION SOURCE LINER HAVING A LIP FOR ION IMPLANTATION SYSTEMS
App. No. 15/344,502
→
INTEGRATED EMISSIVITY SENSOR ALIGNMENT CHARACTERIZATION
App. No. 15/281,757
→
ADJUSTABLE CIRCUMFERENCE ELECTROSTATIC CLAMP
App. No. 15/281,540
→
MULTIPLE DIAMETER IN-VACUUM WAFER HANDLING
App. No. 15/281,600
→
IN-SITU CLEANING USING HYDROGEN PEROXIDE AS CO-GAS TO PRIMARY DOPANT OR PURGE GAS FOR MINIMIZING CARBON DEPOSITS IN AN ION SOURCE
App. No. 15/281,844
→
IN SITU BEAM CURRENT MONITORING AND CONTROL IN SCANNED ION IMPLANTATION SYSTEMS
App. No. 15/258,723
→
IMPLANTATION USING SOLID ALUMINUM IODIDE (ALI3) FOR PRODUCING ATOMIC ALUMINUM IONS AND IN SITU CLEANING OF ALUMINUM IODIDE AND ASSOCIATED BY-PRODUCTS
App. No. 62/352,673
→
SYSTEM AND METHOD TO IMPROVE PRODUCTIVITY OF HYBRID SCAN ION BEAM IMPLANTERS
App. No. 14/979,663
→
Combined Electrostatic Lens System for Ion Implantation
App. No. 14/978,089
→
Beam Profiling Speed Enhancement for Scanned Beam Implanters
App. No. 14/978,120
→
Combined Multipole Magnet and Dipole Scanning Magnet
App. No. 14/978,776
→
Method of Measuring Vertical Beam Profile in an Ion Implantation System Having a Vertical Beam Angle Device
App. No. 14/972,334
→
WAFER CLAMP DETECTION BASED ON VIBRATION OR ACOUSTIC CHARACTERISTIC ANALYSIS
App. No. 14/963,703
→
SYSTEM AND METHOD FOR ELECTROSTATIC CLAMPING OF WORKPIECES
App. No. 14/855,667
→
CAM ACTUATED FILAMENT CLAMP
App. No. 14/835,780
→
HIGH THROUGHPUT COOLED ION IMPLANTATION SYSTEM AND METHOD
App. No. 14/817,893
→
ANGULAR SCANNING USING ANGULAR ENERGY FILTER
App. No. 14/692,395
→
INTEGRATED EXTRACTION ELECTRODE MANIPULATOR FOR ION SOURCE
App. No. 14/674,694
→
BIPOLAR WAFER CHARGE MONITOR SYSTEM AND ION IMPLANTATION SYSTEM COMPRISING SAME
App. No. 14/631,066
→
ION IMPLANTATION SYSTEM AND METHOD WITH VARIABLE ENERGY CONTROL
App. No. 14/584,252
→
HIGH THROUGHPUT HEATED ION IMPLANTATION SYSTEM AND METHOD
App. No. 14/317,778
→
Variable Electrode Pattern for Versatile Electrostatic Clamp Operation
App. No. 14/178,719
→
CONSTANT MASS FLOW MULTI-LEVEL COOLANT PATH ELECTROSTATIC CHUCK
App. No. 14/178,795
→
Multi Fluid Cooling System for Large Temperature Range Chuck
App. No. 14/178,681
→
METHOD FOR ENHANCING BEAM UTILIZATION IN A SCANNED BEAM ION IMPLANTER
App. No. 14/168,770
→
REDUCED TRACE METALS CONTAMINATION ION SOURCE FOR AN ION IMPLANTATION SYSTEM
App. No. 14/135,754
→
METHOD FOR MEASURING TRANSVERSE BEAM INTENSITY DISTRIBUTION
App. No. 14/086,578
→
IMPLANT-INDUCED DAMAGE CONTROL IN ION IMPLANTATION
App. No. 14/013,728
→
Multi-Resistivity Johnsen-Rahbek Electrostatic Clamp
App. No. 13/930,220
→
OPTICAL HEAT SOURCE WITH RESTRICTED WAVELENGTHS FOR PROCESS HEATING
App. No. 13/923,955
→
WORKPIECE CARRIER
App. No. 13/915,149
→
EXTRACTION ELECTRODE ASSEMBLY VOLTAGE MODULATION IN AN ION IMPLANTATION SYSTEM
App. No. 13/886,963
→
CHARGE INTEGRATION BASED ELECTROSTATIC CLAMP HEALTH MONITOR
App. No. 13/729,524
→
METHOD AND APPARATUS FOR IMPROVED UNIFORMITY CONTROL WITH DYNAMIC BEAM SHAPING
App. No. 13/713,251
→
SYSTEM AND METHOD FOR ION IMPLANTATION WITH IMPROVED PRODUCTIVITY AND UNIFORMITY
App. No. 13/625,277
→
IN-VACUUM HIGH SPEED PRE-CHILL AND POST-HEAT STATIONS
App. No. 13/566,013
→
Inert Atmospheric Pressure Pre-Chill and Post-Heat
App. No. 13/485,186
→