Lanthanated tungsten ion source and beamline components
An ion implantation system is provided having one or more conductive components comprised of one or more of lanthanated tungsten and a refractory metal alloyed with a predetermined percentage of a rare earth metal. The conductive component may be a component of an ion source, such as one or more of a cathode, cathode shield, a repeller, a liner, an aperture plate, an arc chamber body, and a strike plate. The aperture plate may be associated with one or more of an extraction aperture, a suppression aperture and a ground aperture.
1. A conductive component for an ion source in an ion implantation system, wherein the conductive component comprises a lanthanated alloy comprising lanthanated tungsten mixed with a refractory metal, wherein the refractory metal comprises one or more of molybdenum and tantalum, and wherein the conductive component is generally passivated during an operation of the ion implantation system.
2. The conductive component of claim 1 , wherein the lanthanated alloy comprises between 1% and 3% lanthanum.
3. The conductive component of claim 1 , wherein the conductive component is coated with the lanthanated alloy.
4. The conductive component of claim 1 , wherein the conductive component comprises an aperture plate.
5. The conductive component of claim 1 , wherein the conductive component comprises a cathode.
6. The conductive component of claim 1 , wherein the conductive component comprises a cathode shield.
7. The conductive component of claim 1 , wherein the conductive component comprises a repeller.
8. The conductive component of claim 1 , wherein the conductive component comprises a strike plate.
9. A conductive component for an ion source in an ion implantation system, wherein the conductive component comprises a lanthanated alloy comprising lanthanated tungsten mixed with a refractory metal, wherein the lanthanated alloy comprises between 1% and 3% lanthanum powder, and wherein the conductive component is generally passivated during an operation of the ion implantation system.
10. The conductive component of claim 9 , wherein the conductive component is coated with the lanthanated alloy.
11. The conductive component of claim 9 , wherein the conductive component comprises an aperture plate.
12. The conductive component of claim 9 , wherein the conductive component comprises one or more of a cathode and a cathode shield.
13. The conductive component of claim 9 , wherein the conductive component comprises a repeller.
14. The conductive component of claim 9 , wherein the conductive component comprises a strike plate.