High voltage diode
View Patent ↗A trench-isolated RESURF diode structure ( 100 ) is provided which includes a substrate ( 150 ) in which is formed anode ( 130, 132 ) and cathode ( 131 ) contact regions separated from one another by a shallow trench isolation region ( 114, 115 ), along with a non-uniform cathode region ( 104 ) and peripheral anode regions ( 106, 107 ) which define vertical and horizontal p-n junctions under the anode contact regions ( 130, 132 ), including a horizontal cathode/anode junction that is shielded by the heavily doped anode contact region ( 132 ).
1. A semiconductor diode device, comprising:
a semiconductor substrate region;
an isolation structure for electrically isolating the semiconductor substrate region;
a heavily doped first terminal contact region of a first conductivity type formed in the semiconductor substrate region;
a heavily doped second terminal contact region of a second conductivity type located in the semiconductor substrate region to be spaced apart from the heavily doped first terminal contact region;
a first terminal well region of the first conductivity type located in the semiconductor substrate region and under a first portion of the heavily doped first terminal contact region; and
a second terminal well region of the second conductivity type located in the semiconductor substrate region comprising a deep portion located around the heavily doped second terminal contact region and a shallow portion that extends from the deep portion to the first terminal well region, where a peripheral portion of the shallow portion is located under a second portion of the heavily doped first terminal contact region.
2. The semiconductor diode device of claim 1 , where the first conductivity type is p-type, and the second conductivity type is n-type.
3. The semiconductor diode device of claim 1 , where the first terminal well region and shallow portion of the second terminal well region form a p-n junction located below the heavily doped first terminal contact region.
4. The semiconductor diode device of claim 1 , where the peripheral portion of the second terminal well region and the heavily doped first terminal contact region form a vertical p-n junction that is shielded by the heavily doped first terminal contact region.
5. The semiconductor diode device of claim 1 , where a shallow trench isolation region located on a surface of the semiconductor substrate region is the only isolation between the heavily doped first terminal and second terminal contact regions.
6. The semiconductor diode device of claim 1 , where the first terminal well region is separated from a shallow trench isolation region formed on a surface of the semiconductor substrate region by a lateral spacing dimension that is controlled to maximize breakdown voltage for the semiconductor diode device.
7. The semiconductor diode device of claim 1 , where the shallow portion of the second terminal well region is separated from the heavily doped second terminal contact region by a lateral spacing dimension that is controlled to maximize breakdown voltage for the semiconductor diode device.
8. The semiconductor diode device of claim 1 , where the heavily doped first terminal contact region, first terminal well region, and underlying semiconductor substrate region enclose the bottom and sides of the second terminal well region.
9. The semiconductor diode device of claim 1 , where the isolation structure comprises a deep trench isolation region formed to surround the semiconductor substrate region, a buried insulator layer formed at the bottom of the semiconductor substrate region, and at least a first shallow trench isolation region formed on a surface of the semiconductor substrate region.
10. An integrated circuit device, comprising:
a semiconductor substrate region of a first conductivity type;
a heavily doped first terminal contact region of the first conductivity type located in a first terminal contact area of the semiconductor substrate region;
a heavily doped second terminal contact region of a second conductivity type located in a second terminal contact area of the semiconductor substrate region to be spaced apart from the first terminal contact area by a shallow trench isolation region;
a first terminal extension region of the first conductivity type located in the semiconductor substrate region under at least the heavily doped first terminal contact region to be in ohmic contact with the first terminal contact region; and
a second terminal extension region of the second conductivity type located in the semiconductor substrate region under at least the heavily doped second terminal contact region to be in ohmic contact with the second terminal contact region, where the second terminal extension region extends laterally to a peripheral end portion that is located under the heavily doped first terminal contact region and that is adjacent to the first terminal extension region.
11. The integrated circuit device of claim 10 , further comprising an isolation structure for electrically isolating the semiconductor substrate region comprising a deep trench isolation region and a buried insulation layer formed around the semiconductor substrate region.
12. The integrated circuit device of claim 10 , where the heavily doped first terminal contact region and first terminal extension region form either an anode terminal or a cathode terminal of a diode, and where the heavily doped second terminal contact region and the second terminal extension region form, respectively, either a cathode terminal or an anode terminal of the diode.
13. The integrated circuit device of claim 10 , wherein the first terminal extension region and second terminal extension region form a lateral p-n junction at a bottom surface of the heavily doped first terminal contact region.
14. The integrated circuit device of claim 13 , where the lateral p-n junction is shielded by the heavily doped first terminal contact region to enhance charging immunity.
15. The integrated circuit device of claim 10 , where the first terminal extension region, the heavily doped first terminal contact region, and underlying semiconductor substrate region completely enclose the bottom and sides of the second terminal extension region.
16. The integrated circuit device of claim 10 , where the integrated circuit device comprises a high voltage diode device.
17. The integrated circuit device of claim 10 , where the second terminal extension region comprises:
a deep terminal well region of the second conductivity type in the semiconductor substrate region around the heavily doped second terminal contact region; and
a shallow terminal well region of the second conductivity type in the semiconductor substrate region to extend laterally from the deep terminal well region to a peripheral end portion located under the heavily doped first terminal contact region.
18. A high voltage RESURF diode device, comprising:
a semiconductor-on-insulator (SOI) substrate;
a cathode region located in the SOI substrate and comprising a cathode contact;
an anode region located in the SOI substrate and comprising an anode contact; and
at least a first shallow trench isolation region located on a surface of the SOI substrate to separate the cathode contact from the anode contact,
where the cathode region comprises a deep terminal well region formed around the cathode contact and a shallow terminal well region which extends laterally from the deep terminal well region and above at least part of the anode region to a peripheral end portion that is located under the anode contact such that the shallow terminal well region and the anode region define a vertical p-n junction and a lateral p-n junction below the anode contact.
19. The high voltage RESURF diode device of claim 18 , where the anode region comprises a well tie region and a buried RESURF layer to deplete the cathode region.
20. The high voltage RESURF diode device of claim 19 , where the lateral p-n junction is shielded by the anode contact against surface charging.