Sputter and surface modification etch processing for metal patterning in integrated circuits
View Patent ↗One embodiment of an integrated circuit includes a plurality of semiconductor devices and a plurality of conductive lines connecting the plurality of semiconductor devices, wherein at least some of the plurality of conductive lines have pitches of less than one hundred nanometers and sidewall tapers of between approximately eighty and ninety degrees. Another embodiment of an integrated circuit includes a plurality of semiconductor devices and a plurality of conductive lines connecting the plurality of semiconductor devices, wherein at least some of the plurality of conductive lines are fabricated by providing a layer of conductive metal in a multi-layer structure fabricated upon a wafer and sputter etching the layer of conductive metal using a methanol plasma, wherein a portion of the layer of conductive metal that remains after the sputter etching forms the one or more conductive lines.
1. A method for fabricating an integrated circuit, comprising:
providing a layer of conductive metal in a multi-layer structure fabricated upon a wafer; and
sputter etching the layer of conductive metal using a methanol plasma, wherein a portion of the layer of conductive metal that remains after the sputter etching forms the one or more conductive lines.
2. The method of claim 1 , wherein the multi-layer structure comprises:
a first dielectric layer formed on the wafer;
a first liner layer formed on the first dielectric layer;
the layer of conductive metal formed on the first liner layer;
a first hard mask layer formed on the layer of conductive material;
a second hard mask layer formed on the first hard mask layer;
an organic underlayer formed on the second hard mask layer; and
a photoresist layer formed on the organic underlayer.
3. The method of claim 2 , further comprising, prior to the sputter etching:
transferring a pattern from the organic underlayer and the photoresist layer to the second hard mask layer.
4. The method of claim 3 , wherein the transferring comprises:
etching the second hard mask layer down to the first hard mask layer, such that only a portion of the second hard mask layer residing directly beneath organic underlayer remains and becomes a patterned second hard mask layer;
removing the organic underlayer and the photoresist layer; and
etching the first hard mask layer down to the layer of conductive metal, such that only a portion of the first hard mask layer residing directly beneath the patterned second hard mask layer metal remains and becomes a patterned first hard mask layer.
5. The method of claim 4 , wherein the sputter etching etches the layer of conductive metal down to the first liner layer, such that a remaining portion of the layer of conductive metal comprises a pyramidal profile residing directly beneath the patterned first hard mask layer.
6. The method of claim 5 , further comprising, subsequent to the sputter etching:
forming a liner that surrounds the one or more conductive lines; and
depositing a second dielectric layer on the multi-layer structure.
7. The method of claim 6 , wherein the forming comprises:
etching the first liner layer down to the first dielectric layer, such that only a portion of the first liner layer residing directly beneath the layer of conductive metal remains and lines a base of one or more trenches;
depositing a second liner layer on the multi-layer structure; and
etching the second liner layer such that a remaining portion of the second liner layer lines sidewalls of the one or more trenches.
8. The method of claim 7 , wherein the one or more trenches surround the one or more conductive lines.
9. The method of claim 1 , wherein the sputter etching comprises a single etching step using only the methanol plasma.
10. The method of claim 1 , wherein the integrated circuit is a complementary metal-oxide-semiconductor device.