IP Library Patent Application 14715586
Patent Application
App. No. 14/715,586

REDUCING DISTURB WITH ADJUSTABLE RESISTANCE BIT LINE STRUCTURES

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Quick Facts
Patent No.
US None
App. No.
14/715,586
Abstract

Methods for reducing leakage currents through unselected memory cells of a memory array during a memory operation are described. In some cases, the leakage currents through the unselected memory cells of the memory array may be reduced by setting an adjustable resistance bit line structure connected to the unselected memory cells into a non-conducting state. The adjustable resistance bit line structure may comprise a bit line structure in which the resistance of an intrinsic (or near intrinsic) polysilicon portion of the bit line structure may be adjusted via an application of a voltage to a select gate portion of the bit line structure that is not directly connected to the intrinsic polysilicon portion. The intrinsic polysilicon portion may be set into a conducting state or a non-conducting state based on the voltage applied to the select gate portion.

Claims (55)

1 . A method for operating a non-volatile memory, comprising:

identifying a first word line within a memory array;

identifying a first global bit line within the memory array, the first global bit line is connected to an adjustable resistance bit line structure that includes an adjustable resistance local bit line and a select gate, a first memory cell is arranged between the adjustable resistance local bit line and the first word line;

determining a plurality of unselected word line voltages to be applied to a plurality of unselected word lines within the memory array, a plurality of unselected memory cells is arranged between the adjustable resistance local bit line and the plurality of unselected word lines; and

performing a memory operation on the memory array, the memory operation includes applying a selected word line voltage to the first word line and applying a selected bit line voltage to the first global bit line while the adjustable resistance local bit line is set into a conducting state, the memory operation includes applying the plurality of unselected word line voltages to the plurality of unselected word lines while the adjustable resistance local bit line is set into the conducting state.

2 . The method of claim 1 , wherein:

the memory operation comprises a RESET operation; and

the determining a plurality of unselected word line voltages includes determining the plurality of unselected word line voltages such that the voltage stress across each of the plurality of unselected memory cells is substantially 0V prior to the first memory cell being RESET.

3 . The method of claim 1 , wherein:

the memory operation comprises a RESET operation; and

the determining a plurality of unselected word line voltages includes determining the plurality of unselected word line voltages such that the voltage stress across each of the plurality of unselected memory cells is at most a particular voltage prior to the first memory cell being RESET.

4 . The method of claim 3 , wherein:

the particular voltage comprises 500 mV.

5 . The method of claim 1 , wherein:

the memory operation comprises a SET operation; and

the determining a plurality of unselected word line voltages includes determining the plurality of unselected word line voltages such that the voltage stress across each of the plurality of unselected memory cells is substantially 0V after the first memory cell is SET.

6 . The method of claim 1 , wherein:

the memory operation comprises a SET operation; and

the determining a plurality of unselected word line voltages includes determining the plurality of unselected word line voltages such that the voltage stress across each of the plurality of unselected memory cells is at most a threshold voltage after the first memory cell is SET.

7 . The method of claim 1 , wherein:

the determining a plurality of unselected word line voltages includes determining the plurality of unselected word line voltages based on locations of the plurality of unselected memory cells along the adjustable resistance local bit line.

8 . The method of claim 1 , further comprising:

identifying a dummy word line within the memory array, the dummy word line comprises the word line closest to the first global bit line; and

generating a dummy word line voltage greater than any of the plurality of unselected word line voltages, the dummy word line voltage is less than the selected bit line voltage, the memory operation includes applying the dummy word line voltage to the dummy word line while the adjustable resistance local bit line is set into the conducting state.

9 . The method of claim 8 , wherein:

the determining a plurality of unselected word line voltages includes determining the plurality of unselected word line voltages for unselected word lines positioned between the first word line and the dummy word line, the dummy word line is arranged within a word line layer that is closest to a substrate.

10 . The method of claim 1 , wherein:

the memory operation comprises one of a programming operation or a read operation;

the adjustable resistance local bit line comprises undoped polysilicon;

the first memory cell comprises a ReRAM memory cell; and

the memory array comprises a three-dimensional memory array.

11 . A non-volatile storage system, comprising:

a memory array, the memory array includes a first adjustable resistance bit line structure, the first adjustable resistance bit line structure includes an adjustable resistance local bit line and a select gate; and

one or more managing circuits in communication with the first adjustable resistance bit line structure, the one or more managing circuits identify a first word line within the memory array, a first memory cell is arranged between the adjustable resistance local bit line and the first word line, the one or more managing circuits identify a first global bit line within the memory array, the first global bit line is connected to the adjustable resistance local bit line, the one or more managing circuits determine a plurality of unselected word line voltages to be applied to a plurality of unselected word lines, a plurality of unselected memory cells is arranged between the adjustable resistance local bit line and the plurality of unselected word lines, the one or more managing circuits cause a selected word line voltage to be applied to the first word line and a selected bit line voltage to be applied to the first global bit line while the adjustable resistance local bit line is set into a conducting state, the one or more managing circuits cause the plurality of unselected word line voltages to be applied to the plurality of unselected word lines while the adjustable resistance local bit line is set into the conducting state.

12 . The non-volatile storage system of claim 11 , wherein:

the one or more managing circuits cause the plurality of unselected word line voltages to be applied to the plurality of unselected word lines while the adjustable resistance local bit line is set into the conducting state during a memory operation.

13 . The non-volatile storage system of claim 12 , wherein:

the memory operation comprises a programming operation.

14 . The non-volatile storage system of claim 12 , wherein:

the one or more managing circuits determine the plurality of unselected word line voltages such that the voltage stress across each of the plurality of unselected memory cells is substantially 0V during at least a portion of the memory operation.

15 . The non-volatile storage system of claim 12 , wherein:

the one or more managing circuits determine the plurality of unselected word line voltages such that the voltage stress across each of the plurality of unselected memory cells is at most a particular voltage during at least a portion of the memory operation.

16 . The non-volatile storage system of claim 15 , wherein:

the particular voltage comprises 1V.

17 . The non-volatile storage system of claim 11 , wherein:

the one or more managing circuits determine the plurality of unselected word line voltages based on locations of the plurality of unselected memory cells along the adjustable resistance local bit line.

18 . The non-volatile storage system of claim 11 , wherein:

the one or more managing circuits identify a dummy word line within the memory array, the dummy word line comprises the word line closest to the first global bit line, the one or more managing circuits cause a dummy word line voltage to be applied to the dummy word line while the adjustable resistance local bit line is set into the conducting state, the dummy word line voltage is greater than any of the plurality of unselected word line voltages.

19 . The non-volatile storage system of claim 11 , wherein:

the adjustable resistance local bit line comprises undoped polysilicon;

the first memory cell comprises a ReRAM memory cell; and

the memory array comprises a three-dimensional memory array.

20 . A method for operating a non-volatile memory, comprising:

determining a plurality of unselected word lines within a memory array, the memory array includes a first word line and a first global bit line, the first global bit line is connected to an adjustable resistance bit line structure that includes an adjustable resistance local bit line and a select gate, a first memory cell is arranged between the adjustable resistance local bit line and the first word line, a plurality of unselected memory cells is arranged between the adjustable resistance local bit line and the plurality of unselected word lines; and

performing a memory operation on the memory array, the memory operation includes generating a plurality of unselected word line voltages based on the memory operation, the memory operation includes applying a selected word line voltage to the first word line and applying a selected bit line voltage to the first global bit line while the adjustable resistance local bit line is set into a conducting state, the memory operation includes applying the plurality of unselected word line voltages to the plurality of unselected word lines while the adjustable resistance local bit line is set into the conducting state such that the voltage stress across each of the plurality of unselected memory cells is substantially 0V during at least a portion of the memory operation.

Assignments (4)
CHANGE OF NAME Recorded May 25, 2016
From: SANDISK TECHNOLOGIES INC
To: SANDISK TECHNOLOGIES LLC
Reel/Frame 038812/0954 →
CORRECTIVE ASSIGNMENT TO CORRECT THE INCORRECT LISTED PATENT NUMBER 8853569 TO THE CORRECT PATENT NUMBER 8883569 PREVIOUSLY RECORDED ON REEL 038300 FRAME 0665. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Apr 25, 2016
From: SANDISK 3D LLC
To: SANDISK TECHNOLOGIES INC.
Reel/Frame 038520/0552 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 30, 2016
From: SANDISK 3D LLC.
To: SANDISK TECHNOLOGIES INC.
Reel/Frame 038300/0665 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 21, 2015
From: RATNAM, PERUMAL; PETTI, CHRISTOPHER; YAN, TIANHONG
To: SANDISK 3D LLC
Reel/Frame 035693/0181 →