Vertical cross point reram forming method
Methods for forming non-volatile storage elements in a non-volatile storage system are described. In some embodiments, a plurality of forming operations may be performed in which non-volatile storage elements located near the far end of a plurality of word line fingers associated with a word line comb are formed prior to forming other non-volatile storage elements. In one example, non-volatile storage elements may be formed in each of the plurality of word line fingers in parallel and in an order that forms non-volatile storage elements in each of the plurality of word line fingers that are located near the far ends of the plurality of word line fingers before forming other non-volatile storage elements. Each non-volatile storage element that is formed during a forming operation may be current limited while a forming voltage is applied across the non-volatile storage element.
1. A method for operating a non-volatile storage system, comprising:
performing a first memory array operation on a first plurality of non-volatile storage elements, the first plurality of non-volatile storage elements is connected to a first word line comb, the first word line comb includes a plurality of fingers connected to a base, each of the first plurality of non-volatile storage elements is located at a far end of the plurality of fingers farthest from the base; and
performing a second memory array operation on a second plurality of non-volatile storage elements subsequent to performing the first memory array operation on the first plurality of non-volatile storage elements, the second plurality of non-volatile storage elements is connected to the first word line comb, each of the second plurality of non-volatile storage elements is located at a near end of the plurality of fingers closest to the base, the first plurality of non-volatile storage elements comprises a first number of non-volatile storage elements and the second plurality of non-volatile storage elements comprises a second number of non-volatile storage elements greater than the first number of non-volatile storage elements.
2. The method of claim 1 , further comprising:
performing a third memory array operation on a third plurality of non-volatile storage elements subsequent to performing the first memory array operation on the first plurality of non-volatile storage elements, the third plurality of non-volatile storage elements is connected to the first word line comb, each of the third plurality of non-volatile storage elements is located between the first plurality of non-volatile storage elements and the second plurality of non-volatile storage elements.
3. The method of claim 2 , wherein:
the third plurality of non-volatile storage elements comprises a third number of non-volatile storage elements greater than the first number of non-volatile storage elements and less than the second number of non-volatile storage elements.
4. The method of claim 1 , wherein:
the first memory array operation comprises a non-data pattern memory array operation.
5. The method of claim 4 , wherein:
the non-data pattern memory array operation comprises a forming operation.
6. The method of claim 1 , wherein:
the first memory array operation comprises one of a forming operation or an erase operation.
7. The method of claim 1 , wherein:
the performing a first memory array operation includes applying a first voltage across each non-volatile storage element of the first plurality of non-volatile storage elements while limiting the current through each non-volatile storage element of the first plurality of non-volatile storage elements to a first current limit; and
the performing a second memory array operation includes applying a second voltage across each non-volatile storage element of the second plurality of non-volatile storage elements while limiting the current through each non-volatile storage element of the second plurality of non-volatile storage elements to a second current limit different from the first current limit.
8. The method of claim 1 , wherein:
the performing a first memory array operation includes applying a first voltage across each non-volatile storage element of the first plurality of non-volatile storage elements; and
the performing a second memory array operation includes applying a second voltage across each non-volatile storage element of the second plurality of non-volatile storage elements, the second voltage is less than the first voltage.
9. The method of claim 1 , wherein:
the first plurality of non-volatile storage elements comprises ReRAM memory cells; and
the first plurality of non-volatile storage elements is part of a memory array, the memory array comprises a three-dimensional memory array.
10. The method of claim 1 , wherein:
the first plurality of non-volatile storage elements is part of a memory array, the memory array is monolithically formed in one or more physical levels of memory cells having active areas disposed above a silicon substrate.
11. A non-volatile storage system, comprising:
a memory array, the memory array includes a first plurality of non-volatile storage elements and a second plurality of non-volatile storage elements, the first plurality of non-volatile storage elements is connected to a first word line comb, the first word line comb includes a plurality of fingers connected to a base, each of the first plurality of non-volatile storage elements is located at a far end of the plurality of fingers farthest from the base, the second plurality of non-volatile storage elements is connected to the first word line comb, each of the second plurality of non-volatile storage elements is located at a near end of the plurality of fingers closest to the base, the first plurality of non-volatile storage elements comprises a first number of non-volatile storage elements and the second plurality of non-volatile storage elements comprises a second number of non-volatile storage elements greater than the first number of non-volatile storage elements; and
one or more control circuits in communication with the memory array, the one or more control circuits configured to cause a first memory array operation to be performed on the first plurality of non-volatile storage elements and a second memory array operation to be performed on the second plurality of non-volatile storage elements.
12. The non-volatile storage system of claim 11 , wherein:
the memory array includes a third plurality of non-volatile storage elements, the third plurality of non-volatile storage elements is connected to the first word line comb, each of the third plurality of non-volatile storage elements is located between the first plurality of non-volatile storage elements and the second plurality of non-volatile storage elements.
13. The non-volatile storage system of claim 12 , wherein:
the third plurality of non-volatile storage elements comprises a third number of non-volatile storage elements greater than the first number of non-volatile storage elements and less than the second number of non-volatile storage elements.
14. The non-volatile storage system of claim 11 , wherein:
the first memory array operation comprises a non-data pattern memory array operation.
15. The non-volatile storage system of claim 14 , wherein:
the non-data pattern memory array operation comprises a forming operation.
16. The non-volatile storage system of claim 11 , wherein:
the first memory array operation comprises one of a forming operation or an erase operation.
17. The non-volatile storage system of claim 11 , wherein:
the first memory array operation includes applying a first voltage across each non-volatile storage element of the first plurality of non-volatile storage elements; and
the second memory array operation includes applying a second voltage across each non-volatile storage element of the second plurality of non-volatile storage elements, the second voltage is less than the first voltage.
18. The non-volatile storage system of claim 11 , wherein:
the first plurality of non-volatile storage elements comprises ReRAM memory cells; and
the first plurality of non-volatile storage elements is part of a memory array, the memory array comprises a three-dimensional memory array.
19. A method for operating a non-volatile storage system, comprising:
performing a first forming operation on a first group of non-volatile storage elements, the first group of non-volatile storage elements is connected to a first word line comb, the first word line comb includes a plurality of fingers connected to a base, the first group of non-volatile storage elements includes a first storage element located at a far end of a first finger of the plurality of fingers and a second storage element located at a far end of a second finger of the plurality of fingers; and
performing a second forming operation on a second group of non-volatile storage elements subsequent to performing the first forming operation on the first group of non-volatile storage elements, the second group of non-volatile storage elements is connected to the first word line comb, the second group of non-volatile storage elements includes a third storage element located at a near end of the first finger and a fourth storage element located at a near end of the second finger, the first group of non-volatile storage elements comprises a first number of non-volatile storage elements and the second group of non-volatile storage elements comprises a second number of non-volatile storage elements greater than the first number of non-volatile storage elements.
20. The method of claim 19 , wherein:
the first group of non-volatile storage elements comprises ReRAM memory cells; and
the first group of non-volatile storage elements is part of a memory array, the memory array comprises a three-dimensional memory array.