WAFER-LEVEL MAGNETIC FIELD PROGRAMMING OF MAGNETIC FIELD SENSORS
A system for programming magnetic field sensors formed on a wafer includes a magnetic field transmitter that outputs a digital test program as a magnetic signal. At least one digital magnetic sensor (e.g., magnetoresistive sensor) is formed with the magnetic field sensors on the wafer and is distinct from the magnetic field sensors. The digital magnetic sensor detects and receives the magnetic signal. A processor formed on the wafer converts the magnetic signal to the digital test program and the digital test program is stored in memory on the wafer in association with one of the magnetic field sensors. The magnetic field transmitter does not physically contact the wafer, but can flood an entire surface of the wafer with the magnetic signal so that all of the magnetic field sensors are concurrently programmed with the digital test program.
1 . A system for wafer-level programming of magnetic field sensors formed on a wafer comprising:
a magnetic field transmitter configured to output a digital program as a magnetic signal;
a digital magnetic sensor formed on said wafer, said digital magnetic sensor being distinct from said magnetic field sensors formed on said wafer, and said digital magnetic sensor being configured to receive said magnetic signal from said magnetic field transmitter;
a processor formed on said wafer and in communication with said digital magnetic sensor, said processor being adapted to convert said magnetic signal to said digital program; and
a memory element associated with one of said magnetic field sensors on said wafer, said memory element being adapted to store said digital program.
2 . The system of claim 1 wherein said magnetic field transmitter does not physically contact said magnetic field sensors.
3 . The system of claim 1 wherein said magnetic field transmitter is adapted to modulate said digital program as a sequence of pulses of a magnetic field, said sequence of pulses forming said magnetic signal.
4 . The system of claim 1 wherein said magnetic field transmitter includes at least one magnetic coil configured to flood an entire surface of said wafer with said magnetic signal.
5 . The system of claim 1 wherein said digital magnetic sensor comprises a magnetic material.
6 . The system of claim 1 wherein one of said r digital magnetic sensor comprises a magnetoresistive sensor.
7 . The system of claim 1 wherein said digital magnetic sensor is one of a plurality of digital magnetic sensor, one each of said digital magnetic sensor being formed with one each of said magnetic field sensors of said wafer.
8 . The system of claim 1 wherein said processor is one of a plurality of processors, one each of said processors being formed with one each of said magnetic field sensors of said wafer, and said each of said processors is adapted to receive and convert said magnetic signal to said digital program.
9 . The system of claim 1 wherein said memory element is one of a plurality of memory elements, one each of said memory elements being formed with one each of said magnetic field sensors of said wafer, and said each of said memory elements is adapted to store said digital program.
10 . The system of claim 1 wherein said processor is further configured to execute said digital program and receive a test result indicative of a functionality of said one of said magnetic field sensors.
11 . The system of claim 10 wherein said one of said magnetic field sensors includes a built-in self-test (BIST) mechanism to determine said functionality of said one of said magnetic field sensors, and said processor is configured to communicate with said BIST mechanism, wherein execution of said digital program initiates operation of said BIST mechanism and receipt of said test result from said BIST mechanism.
12 . The system of claim 1 further comprising:
a wafer test unit having a probe card, said magnetic field transmitter and a probe element being coupled to said probe card, wherein said probe element provides source power; and
a probe pad on said wafer and electrically coupled with said magnetic field sensors, said probe element being configured for touchdown on said probe pad to selectively provide said source power to each of said magnetic field sensors.
13 . The system of claim 12 wherein said processor is further configured to execute said digital program, receive a test result indicative of a functionality of said one of said magnetic field sensors, and modulate said source power in accordance with said test result to return said test result to said wafer test unit.
14 . A system for programming magnetic field sensors formed on a wafer comprising:
a magnetic field transmitter configured to output a digital program as a magnetic signal;
a plurality of subsystems, one each of said subsystems being formed with one each of said magnetic field sensors of said wafer, each of said subsystems comprising:
a digital magnetic sensor for receiving said magnetic signal from said magnetic field transmitter, said digital magnetic sensor being distinct from said magnetic field sensors;
a processor in communication with said digital magnetic sensor for converting said magnetic signal to said digital program; and
a memory element in communication with said processor for storing said digital program, wherein said magnetic field transmitter is configured to flood an entire surface of said wafer with said magnetic signal such that each of said subsystems concurrently receives said magnetic signal, converts said magnetic signal to said digital program, and stores said digital program.
15 . The system of claim 14 wherein said magnetic field transmitter does not physically contact said magnetic field sensors.
16 . The system of claim 14 further comprising:
a wafer test unit having a probe card, said magnetic field transmitter and a probe element being coupled to said probe card, wherein said probe element provides source power; and
a probe pad on said wafer and electrically coupled with said magnetic field sensors, said probe element being configured for touchdown on said probe pad to selectively provide said source power to each of said magnetic field sensors.
17 . The system of claim 16 wherein each of said magnetic field sensors includes a built-in self-test (BIST) mechanism to determine a functionality of said each of said magnetic field sensors, said processor is configured to communicate with said BIST mechanism and execute said digital program, wherein execution of said digital program initiates operation of said BIST mechanism and receipt of a test result from said BIST mechanism, said test result being indicative of said functionality of said one of said magnetic field sensors, and said processor is further configured to modulate said source power in accordance with said test result to return said test result to said wafer test unit.
18 . A method of programming magnetic field sensors formed on a wafer comprising:
transmitting a digital program as a magnetic signal from a magnetic field transmitter;
receiving said magnetic signal from said magnetic field transmitter at a digital magnetic sensor formed with said magnetic field sensors of said wafer;
converting said magnetic signal to said digital program at a processor formed on said wafer and in communication with said magnetic field transmitter; and
storing said digital program in a memory element associated with one of said magnetic field sensors on said wafer.
19 . The method of claim 18 further comprising:
fabricating said wafer to include a plurality of subsystems, one each of said subsystems being formed with one each of said magnetic field sensors of said wafer, each of said subsystems comprising said digital magnetic sensor, said processor in communication with said digital magnetic sensor, and said memory element in communication with said processor; and
flooding an entire surface of said wafer with said magnetic signal such that each of said subsystems concurrently receives said magnetic signal, converts said magnetic signal to said digital program, and stores said digital program in association with said one each of said magnetic field sensors.
20 . The method of claim 18 wherein a wafer test unit includes a probe card, said magnetic field transmitter and a probe element are coupled to said probe card, and said method further comprises:
fabricating a probe pad on said wafer that is electrically coupled with said magnetic field sensors;
touching said probe element on said probe pad to selectively provide source power to each of said magnetic field sensors; and
following provision of said source power, performing said transmitting operation without said magnetic field transmitter contacting said magnetic field sensors.