FinFET fabrication by forming isolation trenches prior to fin formation
A semiconductor structure for a FinFET in fabrication is provided, the structure including a bulk semiconductor substrate initially with a hard mask over the substrate. Isolation trenches between regions of the structure where the fins will be are formed prior to the fins, and filled with selectively removable sacrificial isolation material. Remains of the hard mask are removed and another hard mask formed over the structure with filled isolation trenches. Fins are then formed throughout the structure, including the regions of sacrificial isolation material, which is thereafter selectively removed.
1. A method, comprising:
providing a starting semiconductor structure, the starting semiconductor structure comprising a bulk semiconductor substrate and a first hard mask over the semiconductor substrate;
removing portions of the first hard mask;
forming isolation trenches in the starting semiconductor structure prior to fin formation;
filling the isolation trenches with sacrificial isolation material that is selectively removable;
removing remaining portions of the first hard mask and replacing with a blanket second hard mask, resulting in an intermediate structure;
after the removing and the replacing, forming in the intermediate structure semiconductor fins and fins in the sacrificial isolation material; and
selectively removing the remaining sacrificial isolation material.
2. The method of claim 1 , wherein filling the isolation trenches with sacrificial isolation material comprises selective growth of epitaxial semiconductor material in the isolation trenches.
3. The method of claim 2 , wherein the epitaxial semiconductor material comprises single crystal epitaxial silicon germanium having greater than 30% germanium.
4. The method of claim 1 , further comprising commonly filling with isolation material between the fins and in the isolation trenches.
5. The method of claim 1 , further comprising, after the selectively removing, forming a liner around each fin.
6. The method of claim 5 , wherein the sacrificial isolation material comprises a material other than epitaxial silicon germanium, and wherein filling the isolation trenches with the sacrificial isolation material comprises:
overfilling the isolation trenches with the sacrificial isolation material;
planarizing the sacrificial isolation material down to a top surface of the second hard mask; and
recessing the sacrificial isolation material down to top surface of the substrate.
7. The method of claim 5 , wherein filling the isolation trenches with sacrificial isolation material comprises selective growth of epitaxial semiconductor material in the isolation trenches.
8. The method of claim 7 , wherein the epitaxial semiconductor material comprises single crystal epitaxial silicon germanium having greater than 30% germanium.
9. The method of claim 5 , further comprising commonly filling with isolation material between the fins and in the isolation trenches.
10. The method of claim 1 , wherein forming the isolation trenches comprises patterning and etching the starting semiconductor structure, and wherein selectively removing the remaining sacrificial isolation material comprises single-fin removal.
11. A method, comprising:
providing a starting semiconductor structure, the starting semiconductor structure comprising a bulk semiconductor substrate and a first hard mask over the semiconductor substrate;
removing portions of the first hard mask;
forming isolation trenches in the starting semiconductor structure prior to fin formation;
filling the isolation trenches with sacrificial isolation material that is selectively removable;
removing remaining portions of the first hard mask and replacing with a blanket second hard mask, resulting in an intermediate structure;
after the removing and the replacing, forming in the intermediate structure semiconductor fins and fins in the sacrificial isolation material; and
selectively removing the remaining sacrificial isolation material;
wherein the sacrificial isolation material comprises a material other than epitaxial silicon germanium, and wherein filling the isolation trenches with the sacrificial isolation material comprises:
overfilling the isolation trenches with the sacrificial isolation material;
planarizing the sacrificial isolation material down to a top surface of the second hard mask; and
recessing the sacrificial isolation material down to a top surface of the substrate.
12. The method of claim 11 , wherein filling the isolation trenches with sacrificial isolation material comprises selective growth of epitaxial semiconductor material in the isolation trenches.
13. The method of claim 12 , wherein the epitaxial semiconductor material comprises single crystal epitaxial silicon germanium having greater than 30% germanium.
14. The method of claim 11 , further comprising commonly filling with isolation material between the fins and in the isolation trenches.
15. The method of claim 11 , further comprising, after the selectively removing, forming a liner around each fin.
16. The method of claim 15 , wherein the sacrificial isolation material comprises a material other than epitaxial silicon germanium, and wherein filling the isolation trenches with the sacrificial isolation material comprises:
overfilling the isolation trenches with the sacrificial isolation material;
planarizing the sacrificial isolation material down to a top surface of the second hard mask; and
recessing the sacrificial isolation material down to top surface of the substrate.
17. The method of claim 15 , wherein filling the isolation trenches with sacrificial isolation material comprises selective growth of epitaxial semiconductor material in the isolation trenches.
18. The method of claim 17 , wherein the epitaxial semiconductor material comprises single crystal epitaxial silicon germanium having greater than 30% germanium.
19. The method of claim 15 , further comprising commonly filling with isolation material between the fins and in the isolation trenches.
20. The method of claim 11 , wherein forming the isolation trenches comprises patterning and etching the starting semiconductor structure, and wherein selectively removing the remaining sacrificial isolation material comprises single-fin removal.