Uniform depth fin trench formation
Methods for forming substantially uniform depth trenches and/or semiconductor fins from the trenches are disclosed. Embodiments of the method may include depositing a germanium including layer over a substrate, the substrate including a plurality of sacrificial semiconductor fins, each pair of sacrificial semiconductor fins separated by a sacrificial pillar. Germanium is diffused from the germanium including layer into the plurality of sacrificial semiconductor fins to a defined uniform depth. The germanium including layer is removed, and the plurality of sacrificial semiconductor fins are etched to the defined uniform depth and selective to the substrate, creating a plurality of trenches having a substantially uniform depth. The trenches can be used to epitaxial grow semiconductor fins having substantially uniform height.
1. A method, comprising:
depositing a germanium including layer over a substrate, the substrate including a plurality of sacrificial semiconductor fins, each pair of sacrificial semiconductor fins separated by a sacrificial pillar;
diffusing germanium from the germanium including layer into the plurality of sacrificial semiconductor fins to a defined uniform depth; and
etching the plurality of sacrificial semiconductor fins including the diffused germanium to the defined uniform depth and selective to the substrate, creating a plurality of trenches having a substantially uniform depth.
2. The method of claim 1 , wherein the substrate includes a bulk semiconductor, and the plurality of sacrificial semiconductor fins include silicon germanium after the diffusing.
3. The method of claim 1 , wherein the sacrificial pillars include an insulator.
4. The method of claim 1 , wherein the germanium including layer includes one of: amorphous germanium and silicon germanium.
5. The method of claim 1 , further comprising planarizing the substrate prior to depositing the germanium including layer.
6. The method of claim 1 , further comprising forming a cap layer over the germanium including layer prior to the diffusing, and removing the cap layer before the etching.
7. The method of claim 1 , further comprising forming the plurality of sacrificial semiconductor fins in the substrate prior to the depositing the germanium including layer.
8. The method of claim 7 , wherein forming the sacrificial semiconductor fins includes:
etching another plurality of trenches into the substrate, the substrate including a semiconductor;
depositing a sacrificial material into the another plurality of trenches to form the plurality of sacrificial pillars; and
planarizing the sacrificial material.
9. The method of claim 1 , wherein the diffusing germanium into the plurality of sacrificial semiconductor fins includes annealing to diffuse germanium into the plurality of sacrificial semiconductor fins.
10. The method of claim 1 , wherein etching the plurality of sacrificial semiconductor fins includes applying reactive ion etching (RIE) in etching the plurality of sacrificial semiconductor fins.
11. The method of claim 1 , further comprising epitaxial growing a plurality of fins within the plurality of trenches.
12. A method, comprising:
forming a plurality of sacrificial semiconductor fins separated by a plurality of sacrificial pillars in a substrate;
depositing a germanium including layer over the substrate;
annealing to diffuse germanium from the germanium including layer into the plurality of sacrificial semiconductor fins to a defined uniform depth;
etching the plurality of sacrificial semiconductor fins including the diffused germanium to the defined uniform depth and selective to the substrate, creating a plurality of trenches having a substantially uniform depth;
epitaxial growing a plurality of fins within the plurality of trenches; and
removing the plurality of sacrificial pillars.
13. The method of claim 12 , wherein the substrate includes a bulk semiconductor, and the plurality of sacrificial semiconductor fins include silicon germanium after the diffusing.
14. The method of claim 12 , wherein the sacrificial pillars include an insulator.
15. The method of claim 12 , wherein the germanium including layer includes one of: amorphous germanium and silicon germanium.
16. The method of claim 12 , further comprising planarizing the substrate prior to depositing the germanium including layer.
17. The method of claim 12 , further comprising forming a cap layer over the germanium including layer prior to the diffusing, and removing the cap layer before the etching.
18. The method of claim 12 , wherein the plurality of sacrificial semiconductor fins forming includes:
etching another plurality of trenches into the substrate, the substrate including a semiconductor;
depositing a sacrificial material into the another plurality of trenches to form the plurality of sacrificial pillars; and
planarizing the sacrificial material.
19. The method of claim 18 , wherein etching the plurality of sacrificial semiconductor fins includes applying reactive ion etching (RIE) in etching the plurality of sacrificial semiconductor fins.
20. A method, comprising:
forming a plurality of sacrificial silicon fins separated by a plurality of sacrificial insulator pillars in a bulk silicon substrate;
depositing a germanium including layer over the bulk silicon substrate;
forming a cap layer over the germanium including layer;
annealing to diffuse germanium from the germanium including layer into the plurality of sacrificial silicon fins to a defined uniform depth, causing the plurality of sacrificial silicon fins to become a plurality of silicon germanium fins;
reactive ion etching selective to the bulk silicon substrate to remove the cap layer and remove the plurality of silicon germanium fins including the diffused germanium to the defined uniform depth, creating a plurality of trenches having a substantially uniform depth;
epitaxial growing a plurality of fins within the plurality of trenches; and
removing the plurality of sacrificial insulator pillars.