Method of adjusting spacer thickness to provide variable threshold voltages in FinFETs

1. A method comprising:

providing a semiconductor structure having a substrate, the substrate including a first array of fins formed thereon;

forming first spacers having a first spacer thickness on sidewalls of fins of the first array;

adjusting the thickness of the first spacers to provide a second spacer thickness different from the first spacer thickness;

forming first supports between and adjacent the first spacers;

removing the first spacers to form first WF metal trenches defined by the fins of the first array and the first supports;

forming a gate extending laterally across the fins of the first array; and

disposing first WF metal structures within the first WF metal trenches within the gate.

2. The method of claim 1 comprising:

forming a second arrays of fins on the substrate;

forming second spacers having the first spacer thickness on sidewalls of fins of the second array;

adjusting the thickness of the second spacers to provide a third spacer thickness different from the first and second spacer thickness;

forming second supports between and adjacent the second spacers;

removing the second spacers to form second WF metal trenches defined by the fins of the second array and the second supports;

forming the gate to extend laterally across the fins of the second array; and

disposing second WF metal structures within the second WF metal trenches within the gate.

3. The method of claim 1 comprising thermally oxidizing exposed surfaces of the first spacers for a predetermined first amount of time to grow a first spacer oxide layer having a first oxide layer thickness over the first spacers, the first spacer oxide layer adjusting the overall thickness of the first spacers from the first spacers thickness to the second spacer thickness.

4. The method of claim 2 comprising:

thermally oxidizing exposed surfaces of the first spacers for a predetermined first amount of time to grow a first spacer oxide layer having a first spacer oxide layer thickness over the first spacers, the first spacer oxide layer adjusting the overall thickness of the first spacers from the first spacers thickness to the second spacer thickness; and

thermally oxidizing exposed surfaces of the second spacers for a predetermined second amount of time to grow a second spacer oxide layer having a second spacer oxide layer thickness over the second spacers, the second spacer oxide layer adjusting the overall thickness of the second spacers from the first spacer thickness to the third spacer thickness.

5. The method of claim 4 comprising:

disposing first pillars between and adjacent the first spacers;

disposing second pillars between and adjacent the second spacers;

disposing a first blocking layer over the structure to cover the second pillars and leave the first pillars exposed;

removing the first pillars to expose the first spacers; and

thermally oxidizing the first spacers to grow the first spacer oxide layer.

6. The method of claim 5 comprising:

removing the first blocking layer;

disposing a second blocking layer over the structure to cover the first pillars and leave the second pillars exposed;

removing the second pillars to expose the second spacers; and

thermally oxidizing the second spacers to grow the second spacer oxide layer.

7. The method of claim 6 comprising:

removing the second blocking layer to expose the first and second spacers;

disposing a hardmask layer over the structure; and

planarizing the hardmask layer to form the first and second supports.

8. The method of claim 1 wherein the first trench width is within a range of 3 to 10 nanometers.

9. The method of claim 1 wherein the second thickness is within a range of 0 to 20 percent larger than the first spacer thickness.

10. The method of claim 2 wherein the fins of the first array overlay a first electrically isolated region of the substrate and the fins of the second array overlay a second electrically isolated region of the substrate.

11. A method comprising:

providing a structure having a substrate, the substrate including longitudinally extending first and second arrays of fins overlaying first and second electrically isolated regions of the substrate respectively;

forming first and second spacers, each having a substantially equal first spacer thickness, on sidewalls of fins of the first and second arrays respectively;

adjusting the thickness of the first spacers to provide a second spacer thickness different from the first spacer thickness;

forming first and second supports between and adjacent the first and second spacers respectively;

removing the first and second spacers to form first and second WF metal trenches respectively;

forming a gate extending across the fins of the first and second arrays; and

disposing first and second WF metal structures within the first and second WF metal trenches respectively within the gate.

12. The method of claim 11 comprising:

forming first FinFETs utilizing the first WF metal structures, the first FinFETs having a first threshold voltage (Vt); and

forming second FinFETs utilizing the second WF metal structures, the second FinFETs having a second Vt different from the first Vt.

13. The method of claim 11 comprising:

disposing a WF metal layer over the entire structure; and

planarizing down the WF metal layer to form the first and second WF metal structures within the gate.

14. The method of claim 11 comprising:

removing the first spacers to form the first WF metal trenches, the first WF metal trenches defined by the fins of the first array and the first supports; and

removing the second spacers to form the second WF metal trenches, the second WF metal trenches defined by the fins of the second array and the second supports.

15. The method of claim 11 comprising:

disposing first pillars between and adjacent the first spacers;

disposing second pillars between and adjacent the second spacers;

disposing a first blocking layer over the structure to cover the second pillars and leave the first pillars exposed;

removing the first pillars to expose the first spacers; and

thermally oxidizing the first spacers to grow a first spacer oxide layer.

16. The method of claim 15 comprising:

removing the first blocking layer;

disposing a second blocking layer over the structure to cover the first pillars and leave the second pillars exposed;

removing the second pillars to expose the second spacers; and

thermally oxidizing the second spacers to grow a second spacer oxide layer.

17. The method of claim 16 comprising:

thermally oxidizing exposed surfaces of the first spacers for a predetermined first amount of time to grow the first spacer oxide layer, the first spacer oxide layer adjusting the overall thickness of the first spacers from the first spacers thickness to the second spacer thickness; and

thermally oxidizing exposed surfaces of the second spacers for a predetermined second amount of time to grow the second spacer oxide layer, the second spacer oxide layer adjusting the overall thickness of the second spacers from the first spacers thickness to a third spacer thickness, the third spacer thickness being different from the first and second spacer thicknesses.

18. The method of claim 16 comprising:

removing the second blocking layer to expose the first and second spacers;

disposing a hardmask layer over the structure; and

planarizing the hardmask layer to form the first and second supports.

19. The method of claim 11 wherein the first and second trench widths are within a range of 3 to 10 nanometers.

20. The method of claim 11 wherein the second spacer thickness is within a range of 0 to 20 percent larger than the first spacer thickness.