Semiconductor device having a protective material with a first pH formed around cooper wire bonds and aluminum pads for neutralizes a second pH of an outer encapsulant material
A semiconductor device includes a plurality of wire bonds formed on a surface of the semiconductor device by bonding each of a plurality of copper wires onto corresponding ones of a plurality of aluminum pads; a protective material is applied around the plurality of wire bonds, the protective material having a first pH; and at least a portion of the semiconductor device and the protective material are encapsulated with an encapsulating material having a second pH, wherein the first pH of the protective material is for neutralizing the second pH of the encapsulating material around the plurality of wire bonds.
1. An encapsulated semiconductor device, comprising:
a plurality of wire bonds formed on a surface of the semiconductor device by bonding each of a plurality of copper wires onto corresponding ones of a plurality of aluminum pads;
a protective material applied around the plurality of wire bonds, the protective material having a first pH; and
at least a portion of the semiconductor device and the protective material encapsulated with an encapsulating material having a second pH,
wherein the first pH of the protective material is for neutralizing the second pH of the encapsulating material around the plurality of wire bonds.
2. The semiconductor device of claim 1 wherein the protective material is a type of material that requires curing after being applied around the plurality of wire bonds.
3. The semiconductor device of claim 2 , wherein the protective material is cured by at least one of the group consisting of: thermal energy, ultraviolet energy, and infrared energy to the semiconductor device.
4. The semiconductor device of claim 1 , wherein the protective material has a pH of greater than about 7.0, and the encapsulating material around at least a portion of the semiconductor device and the protective material has a pH of less than about 7.0.
5. The semiconductor device of claim 1 , wherein the protective material comprises a suspension comprising a polymer having a filler material for producing a neutral to alkaline pH.
6. The semiconductor device of claim 5 , wherein the filler material comprises one or more of magnesium hydroxide, aluminum hydroxide, calcium carbonate, magnesium carbonate, and calcium hydroxide.
7. The semiconductor device of claim 5 , wherein the filler material comprises particulates having a diameter of between 0.005 to 30.0 microns (μm), and a surface area in a range of between 0.5 to 500 square meters per gram (m 2 /g).
8. The semiconductor device of claim 1 , wherein the protective material is formed around a bond interface region between each of plurality of copper wires and the corresponding ones of the plurality of aluminum pads.
9. An encapsulated semiconductor device, comprising:
a plurality of wire bonds on a surface of the semiconductor device, each of a plurality of copper wires are bonded onto corresponding ones of a plurality of aluminum pads;
a protective material applied around an interface region between each of the plurality of aluminum pads and the plurality of wire bonds, the protective material comprising a suspension comprising a liquid polymer having a filler material for producing a first pH of greater than about 7.0; and
encapsulating material around at least a portion of the semiconductor device and the protective material, wherein the encapsulating material has a second pH of less than about 7.0,
wherein the first pH of the protective material neutralizes the second pH of the encapsulating material around the interface region between each of the plurality of aluminum pads and the plurality of wire bonds.
10. The semiconductor device of claim 9 wherein the protective material is a type of material that requires curing using at least one of the group consisting of: thermal energy, ultraviolet energy, and infrared energy.
11. The semiconductor device of claim 9 , wherein the filler material comprises one or more of magnesium hydroxide, aluminum hydroxide, calcium carbonate, calcium hydroxide, and magnesium carbonate.
12. The semiconductor device of claim 9 , wherein the filler material comprises particulates having a diameter of between 0.005 to 30.0 microns (μm), and a surface area in a range of between 0.5 to 500 square meters per gram (m 2 /g).
13. A semiconductor device comprising:
a plurality of aluminum bond pads on a surface of the semiconductor device;
a plurality of copper wire bonds, a copper wire bond of the plurality of copper wire bonds formed on each of the plurality of aluminum pads;
a protective material applied around the plurality of copper wire bonds, the protective material having a first pH; and
encapsulating material around at least a portion of the semiconductor device and over the protective material, the encapsulating material having a second pH,
wherein the first pH of the protective material neutralizes the second pH of the encapsulating material around the plurality of wire bonds.
14. The semiconductor device of claim 13 , wherein the protective material comprises one or more of magnesium hydroxide, aluminum hydroxide, calcium carbonate, calcium hydroxide, and magnesium carbonate.
15. The semiconductor device of claim 13 , wherein the protective material comprises a suspension comprising a liquid polymer having a filler material for producing the first pH of greater than about 7.0, and wherein the second pH of the encapsulating material is less than about 7.0.
16. The semiconductor device of claim 13 , wherein the filler material comprises particulates having a diameter of between 0.005 to 30.0 microns (μm), and a surface area in a range of between 0.5 to 500 square meters per gram (m 2 /g).
17. The semiconductor device of claim 13 , wherein the filler material is in range of about 10 to 90 weight percent of the protective material and the protective material has a thickness ranging between 0.005 millimeters (mm) and 0.250 mm.