Method for protecting copper wire bonds on aluminum pads of a semiconductor device from corrosion
View Patent ↗A semiconductor device and method for encapsulating the semiconductor device are provided. The method includes: forming a plurality of wire bonds on a surface of the semiconductor device by bonding each of a plurality of copper wires onto corresponding ones of a plurality of aluminum pads; applying a protective material around the plurality of wire bonds, the protective material having a first pH; and encapsulating at least a portion of the semiconductor device and the protective material with an encapsulating material having a second pH, wherein the first pH of the protective material is for neutralizing the second pH of the encapsulating material around the plurality of wire bonds.
1. A method for encapsulating a semiconductor device, the method comprising:
forming a plurality of wire bonds on a surface of the semiconductor device by bonding each of a plurality of copper wires onto corresponding ones of a plurality of aluminum pads;
covering the plurality of wire bonds with a protective material having a first pH; and
depositing encapsulating material over the semiconductor device and the protective material, the encapsulating material having a second pH,
wherein the first pH of the protective material is for neutralizing the second pH of the encapsulating material.
2. The method of claim 1 further comprising curing the protective material after the step of covering the plurality of wire bonds with-the protective material.
3. The method of claim 2 , wherein curing the protective material comprises applying at least one of the group consisting of: thermal energy, ultraviolet energy, and infrared energy to the semiconductor device.
4. The method of claim 1 , wherein covering the plurality of wire bonds with the protective material further comprises applying the protective material to the semiconductor device after the semiconductor device has been heated to a temperature between 100 and 250 degrees Celsius.
5. The method of claim 1 , wherein covering the plurality of wire bonds with the protective material having the first pH further comprises applying the protective material having a pH of greater than about 7.0, and encapsulating at least a portion of the semiconductor device and the protective material with an encapsulating material having a pH of less than about 7.0.
6. The method of claim 1 , wherein covering the plurality of wire bonds with the protective material further comprises applying the protective material comprising a suspension comprising a liquid polymer having a filler material for producing a neutral to alkaline pH.
7. The method of claim 6 , wherein the filler material comprises one or more of magnesium hydroxide, aluminum hydroxide, calcium carbonate, magnesium carbonate, and calcium hydroxide.
8. The method of claim 6 , wherein the filler material comprises particulates having a diameter of between 0.005 to 30.0 microns (μm), and a surface area in a range of between 0.5 to 500 square meters per gram (m 2 /g).
9. The method of claim 6 , wherein the liquid polymer has a viscosity in a range of between 30.0 to 6000.0 milli-Pascal seconds (mPa·S) when measured at shear rates typically used in defining viscosity of dispensable filled liquid polymer systems.
10. The method of claim 1 , wherein the protective material is formed around a bond interface region between each of plurality of copper wires and the corresponding ones of the plurality of aluminum pads.
11. A method for encapsulating a semiconductor device, the method comprising:
forming a plurality of wire bonds on a surface of the semiconductor device by bonding each of a plurality of copper wires onto corresponding ones of a plurality of aluminum pads;
applying a protective material to cover an interface region between each of the plurality of aluminum pads and the plurality of wire bonds, the protective material comprising a suspension comprising a liquid polymer having a filler material for producing a first pH of greater than about 7.0; and
encapsulating at least a portion of the semiconductor device and exposed portions of the protective material with an encapsulating material having a second pH of less than about 7.0,
wherein the first pH of the protective material is for neutralizing the second pH of the encapsulating material around the interface region between each of the plurality of aluminum pads and the plurality of wire bonds.
12. The method of claim 11 further comprising curing the protective material using at least one of the group consisting of: thermal energy, ultraviolet energy, and infrared energy after the step of applying the protective material.
13. The method of claim 11 , wherein the filler material comprises one or more of magnesium hydroxide, aluminum hydroxide, calcium carbonate, calcium hydroxide, and magnesium carbonate.
14. The method of claim 11 , wherein the filler material comprises particulates having a diameter of between 0.005 to 30.0 microns (μm), and a surface area in a range of between 0.5 to 500 square meters per gram (m 2 /g).
15. The method of claim 11 , wherein the liquid polymer has a viscosity in a range of between 30.0 to 6000.0 milli-Pascal seconds (mPa·S) when measured at shear rates typically used in defining viscosity of dispensable filled liquid polymer systems.
16. A method of making a semiconductor device comprising:
forming a plurality of aluminum bond pads on a surface of the semiconductor device;
forming a plurality of copper wire bonds, a copper wire bond of the plurality of copper wire bonds formed on each of the plurality of aluminum pads;
applying a protective material on the plurality of copper wire bonds at an interface with the aluminum bond pads, the protective material having a first pH; and
depositing encapsulating material over at least a portion of the semiconductor device and over the protective material, the encapsulating material having a second pH,
wherein the first pH of the protective material is for neutralizing the second pH of the encapsulating material around the plurality of wire bonds.
17. The method of claim 16 , wherein the protective material comprises one or more of magnesium hydroxide, aluminum hydroxide, calcium carbonate, calcium hydroxide, and magnesium carbonate.
18. The method of claim 16 , wherein the protective material comprises a suspension comprising a liquid polymer having a filler material for producing the first pH of greater than about 7.0, and wherein the second pH of the encapsulating material is less than about 7.0.
19. The method of claim 16 , wherein the filler material comprises particulates having a diameter of between 0.005 to 30.0 microns (μm), and a surface area in a range of between 0.5 to 500 square meters per gram (m 2 /g).
20. The method of claim 16 , wherein the filler material is in range of about 10 to 90 weight percent of the protective material and the protective material has a thickness ranging between 0.005 millimeters (mm) and 0.250 mm.