Patent Assignment
Reel/Frame 040945/0252
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNMENT DOCUMENTATION - INITIAL CONVENYANCE LISTED CHANGE OF NAME. PREVIOUSLY RECORDED ON REEL 040579 FRAME 0827. ASSIGNOR(S) HEREBY CONFIRMS THE UPDATE CONVEYANCE TO MERGER AND CHANGE OF NAME EFFECTIVE NOVEMBER 7, 2016.
Recorded: 2016-12-15
Received: 2016-12-15
Pages: 15
Assignors
FREESCALE SEMICONDUCTOR, INC. (UNDER)
Executed: 2016-11-07
NXP SEMICONDUCTORS USA, INC. (MERGED INTO)
Executed: 2016-11-07
Assignee
NXP USA, INC.
6501 WILLIAM CANNON DRIVE WEST, AUSTIN, TX, 78735, UNITED STATES
Covered Applications
(100)
SYSTEM AND METHOD FOR LINEARITY CALIBRATION IN MIXED-SIGNAL DEVICES
App. No. 15/221,286
→
Stress isolated detector element and microbolometer detector incorporating same
App. No. 14/999,523
→
METHOD AND APPARATUS FOR CONTROLLING AN IGBT DEVICE
App. No. 15/037,473
→
MEMORY HAVING A PLURALITY OF RESISTIVE NON-VOLATILE MEMORY CELLS
App. No. 15/082,419
→
MAGNETIC RANDOM ACCESS MEMORY (MRAM) AND METHOD OF OPERATION
App. No. 15/057,004
→
SEMICONDUCTOR DEVICES AND RELATED FABRICATION METHODS
App. No. 15/053,745
→
LVDS AND SUBLVDS DRIVER CIRCUIT
App. No. 15/053,673
→
RESISTIVE NON-VOLATILE MEMORY CELL AND METHOD FOR PROGRAMMING SAME
App. No. 15/018,095
→
DEVICES AND STACKED MICROELECTRONIC PACKAGES WITH PACKAGE SURFACE CONDUCTORS AND METHODS OF THEIR FABRICATION
App. No. 14/994,967
→
SPREAD-SPECTRUM CLOCK GENERATOR
App. No. 14/992,007
→
DIGITAL-TO-ANALOG CONVERTER CIRCUIT
App. No. 14/991,869
→
RADIO SIGNAL DECODING AND DECODER
App. No. 14/899,516
→
OSCILLATOR CIRCUIT AND METHOD OF GENERATING A CLOCK SIGNAL
App. No. 14/899,170
→
NON-VOLATILE MEMORY (NVM) WITH ENDURANCE CONTROL
App. No. 14/957,778
→
METHOD OF MAKING A NON-VOLATILE MEMORY (NVM) WITH TRAP-UP REDUCTION
App. No. 14/945,981
→
A NETWORK RECEIVER FOR A NETWORK USING DISTRIBUTED CLOCK SYNCHRONIZATION AND A METHOD OF ADJUSTING A FREQUENCY OF AN INTERNAL CLOCK OF THE NETWORK RECEIVER
App. No. 14/889,467
→
DUAL SIGMA-DELTA ANALOG-TO-DIGITAL CONVERTER
App. No. 14/934,442
→
ENHANCED SENSITIVITY ION SENSING DEVICES
App. No. 14/928,877
→
RF POWER TRANSISTORS WITH IMPEDANCE MATCHING CIRCUITS, AND METHODS OF MANUFACTURE THEREOF
App. No. 14/919,513
→
MEMORY ARRAY AND COUPLED TCAM ARCHITECTURE FOR IMPROVED ACCESS TIME DURING SEARCH OPERATION
App. No. 14/860,945
→
SEMICONDUCTOR DEVICE AND DRIVER CIRCUIT WITH AN ACTIVE DEVICE AND ISOLATION STRUCTURE INTERCONNECTED THROUGH A DIODE CIRCUIT, AND METHOD OF MANUFACTURE THEREOF
App. No. 14/859,806
→
PARTIALLY BIASED ISOLATION IN SEMICONDUCTOR DEVICES
App. No. 14/851,355
→
SHIELDED TRENCH SEMICONDUCTOR DEVICES AND RELATED FABRICATION METHODS
App. No. 14/850,486
→
SYSTEMS AND METHODS FOR RIPPLE COMMUNICATION DECODING
App. No. 14/835,512
→
HEAT SPREADER FOR PACKAGE-ON-PACKAGE (POP) TYPE PACKAGES
App. No. 14/835,534
→
TERNARY CONTENT ADDRESSABLE MEMORY (TCAM) WITH PROGRAMMABLE RESISTIVE ELEMENTS
App. No. 14/833,287
→
DIODES WITH MULTIPLE JUNCTIONS
App. No. 14/832,379
→
RF AMPLIFIER MODULE AND METHODS OF MANUFACTURE THEREOF
App. No. 14/832,525
→
DEEP TRENCH ISOLATION STRUCTURES AND SYSTEMS AND METHODS INCLUDING THE SAME
App. No. 14/831,000
→
LDMOS DEVICE WITH HIGH-POTENTIAL-BIASED ISOLATION RING
App. No. 14/822,122
→
PROGRAMMABLE RESISTIVE ELEMENTS AS VARIABLE TUNING ELEMENTS
App. No. 14/807,157
→
SYSTEMS AND METHODS TO DYNAMICALLY CALIBRATE AND ADJUST GAINS IN A DIRECT CONVERSION RECEIVER
App. No. 14/749,884
→
APPARATUS AND METHODS FOR STACKABLE PACKAGING
App. No. 14/749,243
→
SEMICONDUCTOR DEVICE PACKAGE FOR DEBUGGING AND RELATED FABRICATION METHODS
App. No. 14/741,088
→
Multiple Connection Management For Bluetooth Low Energy Devices
App. No. 14/728,368
→
COMMON SOURCE ARCHITECTURE FOR SPLIT GATE MEMORY
App. No. 14/696,013
→
DATA PROCESSING SYSTEM HAVING MESSAGING
App. No. 14/694,601
→
METHODS OF MAKING A MONOLITHIC MICROWAVE INTEGRATED CIRCUIT
App. No. 14/693,781
→
LOW DROP OUT VOLTAGE REGULATOR AND METHOD THEREFOR
App. No. 14/690,896
→
DEVICE WITH VERTICALLY INTEGRATED SENSORS AND METHOD OF FABRICATION
App. No. 14/682,282
→
DATA PROCESSING SYSTEM WITH TEMPERATURE MONITORING FOR SECURITY
App. No. 14/667,303
→
METHOD AND APPARATUS FOR SELECTING DATA PATH ELEMENTS FOR CLONING
App. No. 14/424,220
→
EQUALIZER FOR JOINT-EQUALIZATION
App. No. 14/628,480
→
HEAT SPREADER AND METHOD FOR FORMING
App. No. 14/628,852
→
METHOD AND SYSTEM FOR OBTAINING RUN-TIME INFORMATION ASSOCIATED WITH EXECUTING AN EXECUTABLE
App. No. 14/421,273
→
SAMPLE-AND-HOLD CIRCUIT AND CAPACITIVE SENSING DEVICE THAT INCLUDES THE SAMPLE-AND-HOLD CIRCUIT
App. No. 14/420,364
→
METHOD FOR RE-CENTERING A VCO, INTEGRATED CIRCUIT AND WIRELESS DEVICE
App. No. 14/606,492
→
MAGNETOMETER TEST ARRANGEMENT AND METHOD
App. No. 14/599,076
→
NON-VOLATILE STATIC RANDOM ACCESS MEMORY (NVSRAM) HAVING A SHARED PORT
App. No. 14/588,177
→
SECURE COMMUNICATION DEVICE AND METHOD
App. No. 14/582,133
→
REDUCING MEMS STICTION BY INCREASING SURFACE ROUGHNESS
App. No. 14/574,784
→
MICROELECTRONIC DEVICES WITH MULTI-LAYER PACKAGE SURFACE CONDUCTORS AND METHODS OF THEIR FABRICATION
App. No. 14/573,519
→
DUAL-BAND DOHERTY AMPLIFIER AND METHOD THEREFOR
App. No. 14/573,669
→
METHOD AND APPARATUS FOR COMPENSATING FOR A LOSS OF LOW-FREQUENCY SIGNAL CONTENT OF AN INPUT SIGNAL AT A RECEIVER INPUT
App. No. 14/572,778
→
AMPLIFIERS WITH A SHORT PHASE PATH, PACKAGED RF DEVICES FOR USE THEREIN, AND METHODS OF MANUFACTURE THEREOF
App. No. 14/572,136
→
NANOCRYSTAL MEMORY AND METHODS FOR FORMING SAME
App. No. 14/568,155
→
SEMICONDUCTOR DEVICE AND RELATED FABRICATION METHODS
App. No. 14/567,357
→
PACKAGED SENSOR WITH INTEGRATED OFFSET CALIBRATION
App. No. 14/562,154
→
RADIATION DEVICES
App. No. 14/560,675
→
MULTIPLE-STATE, SWITCH-MODE POWER AMPLIFIER SYSTEMS AND METHODS OF THEIR OPERATION
App. No. 14/559,895
→
RF POWER AMPLIFICATION AND DISTRIBUTION SYSTEMS, PLASMA IGNITION SYSTEMS, AND METHODS OF OPERATION THEREFOR
App. No. 14/559,903
→
RESISTIVE MEMORY WITH PROGRAM VERIFY AND ERASE VERIFY CAPABILITY
App. No. 14/554,826
→
HIGH AVAILABILITY MULTI-PARTITION NETWORKING DEVICE WITH RESERVE PARTITION AND METHOD FOR OPERATING
App. No. 14/551,645
→
MEMORY CONTROLLER, COMPUTING DEVICE WITH A MEMORY CONTROLLER, AND METHOD FOR CALIBRATING DATA TRANSFER OF A MEMORY SYSTEM
App. No. 14/401,162
→
METHOD AND CIRCUIT FOR RECHARGING A BOOTSTRAP CAPACITOR USING A TRANSFER CAPACITOR
App. No. 14/536,912
→
SHARED ESD CIRCUITRY
App. No. 14/529,282
→
BROADBAND RADIO FREQUENCY POWER AMPLIFIERS, AND METHODS OF MANUFACTURE THEREOF
App. No. 14/529,407
→
DIE ATTACHMENT FOR PACKAGED SEMICONDUCTOR DEVICE
App. No. 14/521,451
→
COMPUTER SYSTEM AND A METHOD FOR GENERATING AN OPTIMIZED PROGRAM CODE
App. No. 14/395,103
→
SEMICONDUCTOR DEVICE WITH UPSET EVENT DETECTION AND METHOD OF MAKING
App. No. 14/514,449
→
Electronic Devices With Semiconductor Die Coupled to a Thermally Conductive Substrate
App. No. 14/508,645
→
SEMICONDUCTOR DEVICE WITH NON-ISOLATED POWER TRANSISTOR WITH INTEGRATED DIODE PROTECTION
App. No. 14/507,063
→
MODIFIABLE SIGNAL ADJUSTMENT DEVICES FOR POWER AMPLIFIERS AND CORRESPONDING METHODS & APPARATUS
App. No. 14/500,992
→
PACKAGED RF AMPLIFIER DEVICES WITH GROUNDED ISOLATION STRUCTURES AND METHODS OF MANUFACTURE THEREOF
App. No. 14/496,477
→
ELECTRONIC DEVICE HAVING A RUNTIME INTEGRITY CHECKER
App. No. 14/494,767
→
METHOD AND APPARATUS FOR CONTROL OF A SWITCHED CURRENT CIRCUIT
App. No. 14/486,430
→
HIGH VOLTAGE FAILURE RECOVERY FOR EMULATED ELECTRICALLY ERASABLE (EEE) MEMORY SYSTEM
App. No. 14/484,876
→
EDGE TERMINATION FOR TRENCH GATE FET
App. No. 14/473,358
→
SEMICONDUCTOR PACKAGE WITH EMBEDDED CAPACITOR AND METHODS OF MANUFACTURING SAME
App. No. 14/469,645
→
TRENCHED FARADAY SHIELDING
App. No. 14/463,982
→
MODE-CONTROLLED VOLTAGE EXCURSION DETECTOR APPARATUS AND A METHOD OF OPERATING THEREOF
App. No. 14/445,679
→
SYSTEMS AND METHODS FOR TEST CIRCUITRY FOR INSULATED-GATE BIPOLAR TRANSISTORS
App. No. 14/341,269
→
METHOD AND APPARATUS FOR A MULTI-HARMONIC MATCHING NETWORK
App. No. 14/317,864
→
MICROELECTRONIC PACKAGES HAVING EMBEDDED SIDEWALL SUBSTRATES AND METHODS FOR THE PRODUCING THEREOF
App. No. 14/316,580
→
RADIO FREQUENCY COUPLING STRUCTURE
App. No. 14/303,705
→
3D DEVICE PACKAGING USING THROUGH-SUBSTRATE POSTS
App. No. 14/303,128
→
DEVICE AND METHOD FOR CONNECTING AN RF GENERATOR TO A COAXIAL CONDUCTOR
App. No. 14/293,741
→
MEMS DEVICE HAVING VARIABLE GAP WIDTH AND METHOD OF MANUFACTURE
App. No. 14/290,297
→
SEMICONDUCTOR PACKAGE AND SYSTEM WITH AN ISOLATION STRUCTURE TO REDUCE ELECTROMAGNETIC COUPLING
App. No. 14/261,899
→
TEMPERATURE SENSOR CIRCUITRY WITH SCALED VOLTAGE SIGNAL
App. No. 14/258,629
→
SYNCHRONIZATION CIRCUITRY, COMMON PUBLIC RADIO INTERFACE ENABLE DEVICE, AND A METHOD OF SYNCHRONIZING A SYNCHRONIZED CLOCK SIGNAL OF A SECOND TRANSCEIVER TO A CLOCK OF A FIRST TRANSCEIVER
App. No. 14/258,415
→
INTERRUPT CONTROLLER AND A METHOD OF CONTROLLING PROCESSING OF INTERRUPT REQUESTS BY A PLURALITY OF PROCESSING UNITS
App. No. 14/246,832
→
Solder Pad for Semiconductor Device Package
App. No. 14/243,649
→
Test Mode Entry Interlock
App. No. 14/243,386
→
VERIFICATION SYSTEM AND METHOD FOR AUTOMATED VERIFICATION OF REGISTER INFORMATION FOR AN ELECTRONIC SYSTEM
App. No. 14/222,918
→
SEMICONDUCTOR DEVICE WITH PERIPHERAL BREAKDOWN PROTECTION
App. No. 14/218,330
→
DEVICES WITH ARBITRATED INTERFACE BUSSES, AND METHODS OF THEIR OPERATION
App. No. 14/216,633
→
SEMICONDUCTOR DEVICE AND METHOD OF OPERATING A SEMICONDUCTOR DEVICE
App. No. 14/214,801
→
Protection Circuit, Circuit Employing Same, and Associated Method of Operation
App. No. 14/212,777
→
MEMORY DEVICE AND METHOD FOR ORGANIZING A HOMOGENEOUS MEMORY
App. No. 14/342,449
→