Trenched Faraday shielding
A device includes a semiconductor substrate having a surface with a trench, first and second conduction terminals supported by the semiconductor substrate, a control electrode supported by the semiconductor substrate between the first and second conduction terminals and configured to control flow of charge carriers during operation between the first and second conduction terminals, and a Faraday shield supported by the semiconductor substrate and disposed between the control electrode and the second conduction terminal. At least a portion of the Faraday shield is disposed in the trench.
1. A device comprising:
a semiconductor substrate having a surface with a trench;
first and second conduction terminals supported by the semiconductor substrate;
a control electrode supported by the semiconductor substrate between the first and second conduction terminals and configured to control flow of charge carriers during operation between the first and second conduction terminals; and
a Faraday shield supported by the semiconductor substrate and disposed between the control electrode and the second conduction terminal;
wherein the trench is laterally spaced from the control electrode by a lateral spacing,
wherein the Faraday shield comprises a first portion that extends laterally above the surface of the semiconductor substrate across the lateral spacing and a second portion that extends laterally in the trench,
wherein the Faraday shield is plate-shaped such that the second portion has upper and lower surfaces that conform to a topography of the trench, and
wherein the Faraday shield is not electrically connected to the control electrode.
2. The device of claim 1 , further comprising a doped region in the semiconductor substrate having a conductivity type to allow the charge carriers to drift through the doped region under an electric field arising from a bias voltage applied between the first and second conduction terminals during operation, wherein the trench is disposed in the doped region.
3. The device of claim 2 , wherein:
the doped region comprises a first section in which the trench is disposed and a second section disposed between the first section and the second conduction terminal;
a lower boundary of the first section is deeper than a lower boundary of the second section; and
the first section has a higher dopant concentration level than the second section at a given depth.
4. The device of claim 1 , wherein the trench has a cross-sectional shape selected from a V-shaped cross-section and a U-shaped cross-section.
5. A device comprising:
a semiconductor substrate having a surface with a trench;
first and second conduction terminals supported by the semiconductor substrate;
a control electrode supported by the semiconductor substrate between the first and second conduction terminals and configured to control flow of charge carriers during operation between the first and second conduction terminals; and
a Faraday shield supported by the semiconductor substrate and disposed between the control electrode and the second conduction terminal;
wherein the trench is laterally spaced from the control electrode by a lateral spacing,
wherein the Faraday shield comprises a first portion that extends laterally above the surface of the semiconductor substrate across the lateral spacing and a second portion that extends laterally in the trench,
wherein the Faraday shield is not electrically connected to the control electrode, and
wherein the second portion of the Faraday shield extends laterally in parallel with a bottom of the trench, and wherein the second portion of the Faraday shield extends less than an entire lateral extent of the trench.
6. The device of claim 1 , wherein the portion of the Faraday shield extends an entire lateral extent of the trench.
7. The device of claim 1 , further comprising a further Faraday shield extending over the trench above the first-named Faraday shield.
8. The device of claim 1 , wherein the Faraday shield extends laterally over the control electrode.
9. A device comprising:
a semiconductor substrate having a surface with a trench;
first and second conduction terminals supported by the semiconductor substrate;
a control electrode supported by the semiconductor substrate between the first and second conduction terminals and configured to control flow of charge carriers during operation between the first and second conduction terminals; and
a Faraday shield supported by the semiconductor substrate and disposed between the control electrode and the second conduction terminal;
wherein the trench is laterally spaced from the control electrode by a lateral spacing,
wherein the Faraday shield comprises a first portion that extends laterally above the surface of the semiconductor substrate across the lateral spacing and a second portion that extends laterally in the trench,
wherein the Faraday shield is not electrically connected to the control electrode, and
wherein the trench is spaced from the second conduction terminal such that the trench is closer to the control electrode than to the second conduction terminal.
10. The device of claim 1 , wherein the first and second conduction terminals are asymmetrically arranged about the control electrode.
11. The device of claim 1 , wherein the semiconductor substrate comprises an epitaxial layer that establishes the surface with the trench.
12. An electronic apparatus comprising:
a semiconductor substrate having a surface with a trench; and
a transistor structure comprising a transistor body region disposed in the semiconductor substrate, the transistor structure further comprising:
source and drain terminals supported by the semiconductor substrate;
a gate structure supported by the semiconductor substrate between the source and drain terminals and configured to control current flow during operation between the source and drain terminals through the transistor body region; and
a shield plate disposed between the gate structure and the drain terminal;
wherein the trench is laterally spaced from the gate structure by a lateral spacing,
wherein the shield plate comprises a first portion that extends laterally above the surface of the semiconductor substrate across the lateral spacing and a second portion that extends laterally in the trench at a height lower than the gate structure,
wherein the shield plate is plate-shaped such that the second portion has upper and lower surfaces that conform to a topography of the trench, and
wherein the shield plate is not electrically connected to the gate structure.
13. The electronic apparatus of claim 12 , further comprising a composite drift region disposed in the semiconductor substrate and having a conductivity type to allow charge carriers to drift through the drift region under an electric field arising from a bias voltage applied between the source and drain terminals during operation, wherein:
the composite drift region comprises a first section in which the trench is disposed and a second section disposed between the first section and the drain terminal; and
a lower boundary of the first section is deeper than a lower boundary of the second section.
14. The electronic apparatus of claim 12 , further comprising a composite drift region disposed in the semiconductor substrate and having a conductivity type to allow charge carriers to drift through the drift region under an electric field arising from a bias voltage applied between the source and drain terminals during operation, wherein:
the composite drift region comprises a first section in which the trench is disposed and a second section disposed between the first section and the drain terminal; and
the first section has a higher dopant concentration level than the second section at a given depth.
15. The electronic apparatus of claim 12 , wherein the trench is spaced from the drain terminal such that the trench is closer to the gate structure than to the drain terminal.
16. A method of fabricating a transistor, the method comprising:
forming a control electrode of the transistor on a surface of a semiconductor substrate;
implanting dopant in the semiconductor substrate to form first and second conduction terminal regions at the surface of the semiconductor substrate, the first conduction terminal region being adjacent to the control electrode, and the second conduction terminal region being spaced from the control electrode;
etching a trench in the surface of the semiconductor substrate, wherein the trench is laterally spaced from the control electrode by a lateral spacing;
forming a Faraday shield on the surface of the semiconductor substrate, wherein the Faraday shield comprises a first portion that extends laterally above the surface of the semiconductor substrate across the lateral spacing and a second portion that extends laterally in the trench at a height lower than the control electrode, and wherein the Faraday shield is plate-shaped such that the second portion has upper and lower surfaces that conform to a topography of the trench; and
depositing a dielectric layer between the Faraday shield and the control electrode such that the Faraday shield is not electrically connected to the control electrode.
17. The method of claim 16 , further comprising:
performing a first dopant implantation to form a drift region in the semiconductor substrate that extends from the control electrode to the second conduction terminal region to allow charge carriers to drift through the drift region under an electric field arising from a bias voltage applied between the first and second conduction terminal regions during operation; and
performing a second dopant implantation to increase a dopant concentration level of the drift region along sidewalls of the trench and under the trench.
18. The method of claim 17 , wherein the second dopant implantation is configured as an angled implantation.
19. The method of claim 17 , wherein the second dopant implantation has an ion energy sufficient to deepen a lower boundary of the drift region under the trench.
20. A method of fabricating a transistor, the method comprising:
forming a control electrode of the transistor on a surface of a semiconductor substrate;
implanting dopant in the semiconductor substrate to form first and second conduction terminal regions at the surface of the semiconductor substrate, the first conduction terminal region being adjacent to the control electrode, and the second conduction terminal region being spaced from the control electrode;
etching a trench in the surface of the semiconductor substrate, wherein the trench is laterally spaced from the control electrode by a lateral spacing;
forming a Faraday shield on the surface of the semiconductor substrate, wherein the Faraday shield comprises a first portion that extends laterally above the surface of the semiconductor substrate across the lateral spacing and a second portion that extends laterally in the trench at a height lower than the control electrode; and
depositing a dielectric layer between the Faraday shield and the control electrode such that the Faraday shield is not electrically connected to the control electrode;
wherein the trench is spaced from the second conduction terminal region such that the trench is closer to the control electrode than to the second conduction terminal region.