Devices and stacked microelectronic packages with package surface conductors and methods of their fabrication
Embodiments of methods for forming a device include performing an oxidation inhibiting treatment to exposed ends of first and second device-to-edge conductors, and forming a package surface conductor to electrically couple the exposed ends of the first and second device-to-edge conductors. Performing the oxidation inhibiting treatment may include applying an organic solderability protectant coating to the exposed ends, or plating the exposed ends with a conductive plating material. The method may further include applying a conformal protective coating over the package surface conductor. An embodiment of a device formed using such a method includes a package body, the first and second device-to-edge conductors, the package surface conductor on a surface of the package body and extending between the first and second device-to-edge conductors, and the conformal protective coating over the package surface conductor.
1. A device, comprising:
a package body having an exterior and planar package surface, a first device-to-edge conductor with a first exposed end at the package surface, and a second device-to-edge conductor with a second exposed end at the package surface;
a package surface conductor deposited on the package surface, and which electrically couples the first exposed end of the first device-to-edge conductor and the second exposed end of the second device-to-edge conductor; and
a conformal protective coating over a portion of the package surface conductor that extends between the first exposed end and the second exposed end,
wherein the package body includes a first microelectronic package stacked upon a second microelectronic package, the first device-to-edge conductor is included within the first microelectronic package, the second device-to-edge conductor is included within the second microelectronic package, and the package surface conductor is an inter-package package surface conductor.
2. The device of claim 1 , wherein the package body comprises:
the first microelectronic package, which has an embedded first microelectronic device that is electrically coupled with the first device-to-edge conductor, and a first sidewall that forms a first portion of the package surface; and
the second microelectronic package stacked on the first microelectronic package, wherein the second microelectronic package has an embedded second microelectronic device that is electrically coupled with the second device-to-edge conductor, and a second sidewall that forms a second portion of the package surface.
3. The device of claim 1 , wherein the conformal protective coating is selected from silicone, urethane, and parylene.
4. The device of claim 1 , wherein the package surface conductor is formed from one or more conductive materials selected from an electrically conductive adhesive, conductive polymer, a polymer filled with conductive particles, a metal alloy, metal coated organic particles, metal coated ceramic particles, solder paste, solder-filled adhesive, nanoparticle-filled ink, a liquid metal, a metal-containing adhesive, a metal-containing epoxies, electrically-conductive pastes, indium, and bismuth.
5. The device of claim 1 , further comprising:
an oxidation inhibiting material on exposed ends of the first and second device-to-edge conductors, wherein the oxidation inhibiting material is selected from an organic solderability protectant and a conductive plating material.
6. A device, comprising:
a package body having an exterior and planar package surface, a first device-to-edge conductor with a first exposed end at the package surface, and a second device-to-edge conductor with a second exposed end at the package surface;
a package surface conductor deposited on the package surface, and which electrically couples the first exposed end of the first device-to-edge conductor and the second exposed end of the second device-to-edge conductor;
a conformal protective coating over a portion of the package surface conductor that extends between the first exposed end and the second exposed end; and
an oxidation inhibiting material on exposed ends of the first and second device-to-edge conductors, wherein the oxidation inhibiting material is selected from an organic solderability protectant and a conductive plating material.
7. The device of claim 6 , wherein the conformal protective coating is selected from silicone, urethane, and parylene.
8. The device of claim 6 , wherein the package surface conductor is formed from one or more conductive materials selected from an electrically conductive adhesive, conductive polymer, a polymer filled with conductive particles, a metal alloy, metal coated organic particles, metal coated ceramic particles, solder paste, solder-filled adhesive, nanoparticle-filled ink, a liquid metal, a metal-containing adhesive, a metal-containing epoxies, electrically-conductive pastes, indium, and bismuth.
9. A device, comprising:
a package body that includes
a first microelectronic package that has a first sidewall, a first device-to-edge conductor with a first exposed end at a surface of the package body, and an embedded first microelectronic device that is electrically coupled with the first device-to-edge conductor, wherein the first sidewall forms a first portion of the surface of the package body, and
a second microelectronic package stacked on the first microelectronic package, wherein the second microelectronic package has a second sidewall, a second device-to-edge conductor with a second exposed end at the surface of the package body, and an embedded second microelectronic device that is electrically coupled with the second device-to-edge conductor, wherein the second sidewall forms a second portion of the surface of the package body;
a package surface conductor deposited on the package surface, which electrically couples the first exposed end of the first device-to-edge conductor and the second exposed end of the second device-to-edge conductor; and
a conformal protective coating over a portion of the package surface conductor that extends between the first exposed end and the second exposed end.
10. The device of claim 9 , wherein the conformal protective coating is selected from silicone, urethane, and parylene.
11. The device of claim 9 , further comprising:
an oxidation inhibiting material on exposed ends of the first and second device-to-edge conductors, wherein the oxidation inhibiting material is selected from an organic solderability protectant and a conductive plating material.
12. The device of claim 9 , wherein the package surface conductor is formed from one or more conductive materials selected from an electrically conductive adhesive, conductive polymer, a polymer filled with conductive particles, a metal alloy, metal coated organic particles, metal coated ceramic particles, solder paste, solder-filled adhesive, nanoparticle-filled ink, a liquid metal, a metal-containing adhesive, a metal-containing epoxies, electrically-conductive pastes, indium, and bismuth.
13. A device, comprising:
a package body having an exterior and planar package surface, a first device-to-edge conductor with a first exposed end at the package surface, and a second device-to-edge conductor with a second exposed end at the package surface;
a package surface conductor deposited on the package surface, and which electrically couples the first exposed end of the first device-to-edge conductor and the second exposed end of the second device-to-edge conductor; and
a conformal protective coating over a portion of the package surface conductor that extends between the first exposed end and the second exposed end,
wherein the package body includes a single microelectronic package, the first device-to-edge conductor is included within a first layer that is proximate a top surface of the microelectronic package, and the second device-to-edge conductor is included within a second layer that is proximate a bottom surface of the microelectronic package, the package surface extends between the top and bottom surfaces of the microelectronic package, and the package surface conductor is a top-side-to-bottom-side package surface conductor.
14. The device of claim 13 , wherein the package surface conductor is formed from one or more conductive materials selected from an electrically conductive adhesive, conductive polymer, a polymer filled with conductive particles, a metal alloy, metal coated organic particles, metal coated ceramic particles, solder paste, solder-filled adhesive, nanoparticle-filled ink, a liquid metal, a metal-containing adhesive, a metal-containing epoxies, electrically-conductive pastes, indium, and bismuth.
15. The device of claim 13 , further comprising:
an oxidation inhibiting material on exposed ends of the first and second device-to-edge conductors, wherein the oxidation inhibiting material is selected from an organic solderability protectant and a conductive plating material.
16. The device of claim 13 , wherein the conformal protective coating is selected from silicone, urethane, and parylene.
17. A device, comprising:
a package body having an exterior and planar package surface, a first device-to-edge conductor with a first exposed end at the package surface, and a second device-to-edge conductor with a second exposed end at the package surface;
a package surface conductor deposited on the package surface, and which electrically couples the first exposed end of the first device-to-edge conductor and the second exposed end of the second device-to-edge conductor; and
a conformal protective coating over a portion of the package surface conductor that extends between the first exposed end and the second exposed end,
wherein the package body includes a single microelectronic package, the first device-to-edge conductor is included within a first layer of the microelectronic package that is proximate a bottom surface of the microelectronic package, the second device-to-edge conductor is included within a second layer that is proximate the bottom surface of the microelectronic package, the package surface is orthogonal to the bottom surface, and the package surface conductor is an inter-layer package surface conductor.
18. The device of claim 17 , further comprising:
an oxidation inhibiting material on exposed ends of the first and second device-to-edge conductors, wherein the oxidation inhibiting material is selected from an organic solderability protectant and a conductive plating material.
19. The device of claim 17 , wherein the package surface conductor is formed from one or more conductive materials selected from an electrically conductive adhesive, conductive polymer, a polymer filled with conductive particles, a metal alloy, metal coated organic particles, metal coated ceramic particles, solder paste, solder-filled adhesive, nanoparticle-filled ink, a liquid metal, a metal-containing adhesive, a metal-containing epoxies, electrically-conductive pastes, indium, and bismuth.
20. The device of claim 17 , wherein the conformal protective coating is selected from silicone, urethane, and parylene.