Data processing device
A microcomputer provided on a rectangular semiconductor board has memory interface circuits. The memory interface circuits are separately disposed in such positions as to extend along the peripheries of the semiconductor board on both sides from one corner as a reference position. In this case, limitations to size reduction imposed on the semiconductor board can be reduced compared with a semiconductor board having memory interface circuits only on one side. Respective partial circuits on each of the separated memory interface circuits have equal data units associated with data and data strobe signals. Thus, the microcomputer has simplified line design on a mother board and on a module board.
1. A semiconductor device, comprising:
a semiconductor chip having a main surface including a first chip edge, a second chip edge opposite to the first chip edge, a third chip edge intersecting with the first and second chip edges, a fourth chip edge opposite to the third chip edge and also intersecting with the first and second chip edges, a first chip corner defined by the first and third chip edges, a second chip corner defined by the second and fourth chip edges, a third chip corner defined by the second and third chip edges, and a fourth chip corner defined by the first and fourth chip edges,
wherein the semiconductor chip has a first data interface, and a second data interface,
wherein, in plan view, the first data interface is arranged closer to the first chip edge than the second chip edge,
wherein, in plan view, the second data interface is arranged closer to the third chip edge than the fourth chip edge, and
wherein the first data interface and the second data interface are adapted for DDR memory devices that are operable on the basis of matched timing with each other in conformity with a JEDEC STANDARD.
2. The semiconductor device according to claim 1 , wherein the first data interface and the second data interface read data for DDR memory devices, respectively, that are operated on the basis of matched timing with each other in conformity with a JEDEC STANDARD.
3. A semiconductor device for use with DDR memory devices on a mother board, and for providing clock signals to the DDR memory devices on the basis of matched timing with each other in conformity with a JEDEC STANDARD, comprising:
a semiconductor chip having a main surface including a first chip edge, a second chip opposite to the first chip edge, a third chip edge intersecting with the first and second chip edges, a fourth chip edge opposite to the third chip edge and also intersecting with the first and second chip edges, a first chip corner defined by the first and third chip edges, a second chip corner defined by the second and fourth chip edges, a third chip corner defined by the second and third chip edges, and a fourth chip corner defined by the first and fourth chip edges,
wherein the semiconductor chip has a first data interface, and a second data interface,
wherein, in plan view, the first data interface is arranged closer to the first chip edge than the second chip edge, and
wherein, in plan view, the second data interface is arranged closer to the third chip edge than the fourth chip edge.
4. The semiconductor device according to claim 3 , wherein the first data interface and the second data interface are adapted for DDR memory devices that are operable on the basis of matched timing with each other in conformity with a JEDEC STANDARD.
5. The semiconductor device according to claim 4 , wherein the first data interface and the second data interface read data for DDR memory devices, respectively, that are operated on the basis of matched timing with each other in conformity with a JEDEC STANDARD.
6. The semiconductor device according to claim 1 ,
wherein, in plan view, the first data interface is arranged closer to the first chip corner than the fourth chip corner, and
wherein, in plan view, the second data interface is arranged closer to the first chip corner than the third chip corner.
7. The semiconductor device according to claim 3 ,
wherein, in plan view, the first data interface is arranged closer to the first chip corner than the fourth chip corner, and
wherein, in plan view, the second data interface is arranged closer to the first chip corner than the third chip corner.
8. A semiconductor device, comprising:
a semiconductor chip having a main surface including a first chip edge, a second chip edge opposite to the first chip edge, a third chip edge intersecting with the first and second chip edges, a fourth chip edge opposite to the third chip edge and also intersecting with the first and second chip edges, a first chip corner defined by the first and third chip edges, a second chip corner defined by the second and fourth chip edges, a third chip corner defined by the second and third chip edges, and a fourth chip corner defined by the first and fourth chip edges,
wherein the semiconductor chip has a first data interface, a second data interface, a first data strobe interface, a second data strobe interface, a first clock interface, and a second clock interface,
wherein, in plan view, the first data interface, the first data strobe interface and the first clock interface are arranged closer to the first chip edge than the second chip edge,
wherein, in plan view, the second data interface, the second data strobe interface and the second clock interface are arranged closer to the third chip edge than the fourth chip edge, and
wherein the first data interface and the second data interface are adapted for DDR memory devices that are operable on the basis of matched timing with each other in conformity with a JEDEC STANDARD.
9. The semiconductor device according to claim 8 , wherein the first data interface and the second data interface read data for DDR memory devices, respectively, that are operated on the basis of matched timing with each other in conformity with a JEDEC STANDARD.
10. The semiconductor device according to claim 8 ,
wherein, in plan view, the first data interface, the first data strobe interface and the first clock interface are arranged closer to the first chip corner than the fourth chip corner, and
wherein, in plan view, the second data interface, the second data strobe interface and the second clock interface are arranged closer to the first chip corner than the third chip corner.
11. A semiconductor device for use with DDR memory devices on a mother board, and for providing clock signals to the DDR memory devices on the basis of matched timing with each other in conformity with a JEDEC STANDARD, comprising:
a semiconductor chip having a main surface including a first chip edge, a second chip edge opposite to the first chip edge, a third chip edge intersecting with the first and second chip edges, a fourth chip edge opposite to the third chip edge and also intersecting with the first and second chip edges, a first chip corner defined by the first and third chip edges, a second chip corner defined by the second and fourth chip edges, a third chip corner defined by the second and third chip edges, and a fourth chip corner defined by the first and fourth chip edges,
wherein the semiconductor chip has a first data interface, a second data interface, a first data strobe interface, a second data strobe interface, a first clock interface, and a second clock interface,
wherein, in plan view, the first data interface, the first data strobe interface and the first clock interface are arranged closer to the first chip edge than the second chip edge, and
wherein, in plan view, the second data interface, the second data strobe interface and the second clock interface are arranged closer to the third chip edge than the fourth chip edge.
12. The semiconductor device according to claim 11 , wherein the first data interface and the second data interface are adapted for DDR memory devices that are operable on the basis of matched timing with each other in conformity with a JEDEC STANDARD.
13. The semiconductor device according to claim 12 , wherein the first data interface and the second data interface read data for DDR memory devices, respectively, that are operated on the basis of matched timing with each other in conformity with a JEDEC STANDARD.
14. The semiconductor device according to claim 11 , wherein, in plan view, the first data interface, the first data strobe interface and the first clock interface are arranged closer to the first chip corner than the fourth chip corner, and
wherein, in plan view, the second data interface, the second data strobe interface and the second clock interface are arranged closer to the first chip corner than the third chip corner.