Semiconductor integrated circuit device and a method of manufacturing the same
A semiconductor device including a memory cell featuring a first gate insulating film over a semiconductor substrate, a control gate electrode over the first gate insulating film, a second gate insulating film over the substrate and a side wall of the control gate electrode, a memory gate electrode over the second gate insulating film arranged adjacent with the control gate electrode through the second gate insulating film, first and second semiconductor regions in the substrate positioned on a control gate electrode side and a memory gate side, respectively, the second gate insulating film featuring a first film over the substrate, a charge storage film over the first film and a third film over the second film, the first film having a first portion between the substrate and memory gate electrode and a thickness greater than that of a second portion between the control gate electrode and the memory gate electrode.
1. A semiconductor device comprising:
a semiconductor substrate having a main surface;
a first gate electrode formed over the main surface of the semiconductor substrate;
a first insulating film formed between the first gate electrode and the semiconductor substrate;
a second gate electrode formed over the main surface of the semiconductor substrate;
a second insulating film formed between the second gate electrode and semiconductor substrate, the second gate electrode being disposed adjacent to the first gate electrode;
a third insulating film formed between the first and second gate electrodes;
a semiconductor region formed in the main surface of the semiconductor substrate and positioned on a side of the first gate electrode;
a second semiconductor region formed in the main surface of the semiconductor substrate and positioned on a side of the second gate electrode;
a first metal silicide layer formed on a top surface of the first gate electrode; and
a second metal silicide layer formed on a top surface of the second gate electrode,
wherein the first insulating film includes a charge accumulation layer, wherein the first metal silicide layer on the first gate electrode and the second metal silicide layer on the second gate electrode are spaced by the third insulating film, and
wherein a highest point of the first silicide layer from the main surface of the semiconductor substrate is different from a highest point of the second silicide layer from the main surface of the semiconductor substrate.
2. The semiconductor device according to the claim 1 ,
wherein the highest point of the first silicide layer is higher than the highest point of the second silicide layer.
3. The semiconductor device according to the claim 1 ,
wherein the first insulating layer is comprised of a silicon oxide film and a silicon nitride film.
4. The semiconductor device according to the claim 1 ,
wherein the first insulating film has a first thickness,
wherein the third insulating film having a second thickness, and
wherein the second thickness is greater than the first thickness.
5. The semiconductor device according to the claim 1 ,
wherein a metal silicide film is formed on each of the first and second semiconductor regions.
6. The semiconductor device according to the claim 1 ,
wherein the third insulating film comprises a silicon oxide film and a silicon nitride film.
7. The semiconductor device according to the claim 1 ,
wherein the charge accumulation layer comprises a silicon nitride film.
8. The semiconductor device according to the claim 1 ,
wherein the second gate electrode is disposed at a sidewall surface of the first gate electrode.
9. The semiconductor device according to the claim 1 ,
wherein the metal silicide film on the first gate electrode and the metal silicide film on the second gate electrode are formed of the same film.