Strain retention semiconductor member for channel SiGe layer of pFET
A pFET includes a semiconductor-on-insulator (SOI) substrate; and a trench isolation within the SOI substrate, the trench isolation including a raised portion extending above an upper surface of the SOI substrate. A compressive channel silicon germanium (cSiGe) layer is over the SOI substrate. A strain retention member is positioned between at least a portion of the raised portion of the trench isolation and the compressive cSiGe layer. A gate and source/drain regions are positioned over the compressive cSiGe layer.
1. A p-type field effect transistor (pFET), comprising:
a semiconductor-on-insulator (SOI) substrate;
a trench isolation within the SOI substrate, the trench isolation including a raised portion extending above an upper surface of the SOI substrate;
a compressive channel silicon germanium (cSiGe) layer over the SOI substrate;
a strain retention member positioned between at least a portion of the raised portion of the trench isolation and the compressive cSiGe layer, the strain retention member including a semiconductor ring extending about a first active region and the compressive cSiGe layer; and
a gate and source/drain regions over the compressive cSiGe layer.
2. The pFET of claim 1 , wherein the SOI substrate includes a silicon-on-insulator upper layer, and the strain retention member includes silicon.
3. The pFET of claim 1 , wherein the compressive cSiGe layer has a thickness of less than approximately 6 nanometers.
4. A method of forming a field effect transistor (FET), the method comprising:
defining a first active region by forming a trench isolation in a semiconductor-on-insulator (SOI) substrate, the trench isolation including a raised portion extending above an upper surface of the SOI substrate;
forming a compressive channel silicon germanium (cSiGe) layer having a strain retention member positioned between at least a portion of the raised portion of the trench isolation and the compressive cSiGe layer, the strain retention member including a strain retention semiconductor ring, the forming of the compressive cSiGe layer including:
forming a spacer ring adjacent the raised portion of the trench isolation using a hard mask and exposing a semiconductor-on-insulator (SOI) layer of the SOI substrate within the spacer ring,
forming the compressive cSiGe layer over the exposed SOI layer by condensing germanium thereon, the spacer ring shielding a ring portion of the SOI layer from the germanium,
removing the hard mask and the spacer ring, leaving the strain retention semiconductor ring in the SOI layer about the compressive cSiGe layer; and
forming a gate and source/drain regions over the compressive cSiGe layer in the first active region to form the FET.
5. The method of claim 4 , wherein the spacer ring includes silicon nitride.
6. The method of claim 4 , wherein the SOI substrate includes a silicon-on-insulator upper layer, and the strain retention member includes silicon.
7. The method of claim 4 , wherein the compressive cSiGe layer forming includes forming the compressive cSiGe layer having a thickness of less than approximately 6 nanometers.
8. The method of claim 4 , wherein forming the source/drain regions over the compressive cSiGe layer in the first active region to form the FET includes doping with a p-type dopant to form a p-type FET (pFET).
9. The method of claim 4 , further comprising defining a second active region by forming the trench isolation in the SOI substrate, and forming an n-type FET (nFET) in the second active region.
10. An integrated circuit (IC) structure, comprising:
a semiconductor-on-insulator (SOI) substrate;
a trench isolation within the SOI substrate, the trench isolation including a raised portion extending above an upper surface of the SOI substrate, the trench isolation defining a first active region and a second active region;
a compressive channel silicon germanium (cSiGe) layer over the SOI substrate in the first active region;
a strain retention member positioned between at least a portion of the raised portion of the trench isolation and the compressive cSiGe layer, the strain retention member including a strain retention semiconductor ring extending about the first active region and the compressive cSiGe layer;
a p-type field effect transistor (pFET) over the compressive cSiGe layer in the first active region; and
an n-type field effect transistor (nFET) in the second active region.
11. The IC structure of claim 10 , wherein the SOI substrate includes a silicon-on-insulator upper layer, and the strain retention member includes silicon.
12. The IC structure of claim 10 , wherein the compressive cSiGe layer has a thickness of less than approximately 6 nanometers.