Method to form interconnect structure with tungsten fill
Aspects of the present disclosure include a method for forming a contact on a semiconductor device, the semiconductor device including a conductive region disposed over a substrate, the method comprising: depositing a dielectric material on the substrate; forming an opening in the dielectric material to expose the conductive region; forming a barrier layer on a lower surface and sidewalls of the opening in the dielectric material, the barrier layer terminating below an upper surface of the dielectric material and surrounding a lower portion of the opening; depositing cobalt in the lower portion of the opening, the cobalt terminating at an upper surface of the barrier layer; depositing tungsten to fill the opening to at least the upper surface of the dielectric material; and planarizing the upper surface of the dielectric material with the tungsten in the opening.
1. A method for forming a contact on a semiconductor device, the semiconductor device including a conductive region disposed over a substrate, the method comprising:
depositing a dielectric material on the substrate;
forming an opening in the dielectric material to expose the conductive region;
siliciding a surface of the exposed conductive region by depositing titanium on the exposed conductive region; depositing a barrier layer on sidewalls and the titanium of the opening;
depositing a spacer material in the opening having the barrier layer;
ashing a portion of the spacer material to form an upper opening that extends downward from an upper surface of the dielectric material to an upper surface of an unashed portion of the spacer material;
removing the barrier layer in the opening to expose the sidewalls above the unashed portion of the spacer material, and
ashing the unashed portion of the spacer material from a lower portion of the opening;
depositing cobalt in the lower portion of the opening, the cobalt terminating at an upper surface of the barrier layer;
depositing tungsten to fill the opening to at least the upper surface of the dielectric material; and
planarizing the upper surface of the dielectric material with the tungsten in the opening.
2. The method of claim 1 , wherein the depositing tungsten to fill the opening comprises:
depositing a fluorine-free tungsten layer in the opening; and depositing a tungsten fill on the fluorine-free tungsten layer to fill the opening.
3. The method of claim 1 , wherein the barrier layer comprises titanium nitride.
4. The method of claim 1 , wherein the barrier layer comprises a dual layer of titanium deposited on titanium nitride.
5. The method of claim 1 , wherein the spacer material comprises one of a polymeric photo-resist, a polymeric organic dielectric layer, or a carbon-based material.
6. A method for forming a contact on a semiconductor device, the semiconductor device including a conductive region disposed over a substrate, the method comprising:
depositing a dielectric material on the substrate;
forming an opening in the dielectric material to expose the conductive region;
siliciding a surface of the exposed conductive region by depositing titanium on the exposed conductive region; depositing a barrier layer on sidewalls and the titanium of the opening;
depositing a spacer material in the opening having the barrier layer;
ashing a portion of the spacer material to form an upper opening that extends downward from an upper surface of the dielectric material to an upper surface of an unashed portion of the spacer material;
removing the barrier layer in the opening to expose the sidewalls above the unashed portion of the spacer material;
ashing the unashed portion of the spacer material from a lower portion of the opening;
depositing cobalt in the lower portion of the opening, the cobalt terminating at an upper surface of the barrier layer;
depositing a first tungsten layer on the deposited cobalt and on sidewalls of the dielectric material, wherein the first tungsten layer includes a cavity having a lower surface positioned vertically between the cobalt and the upper surface of the dielectric material;
depositing a second tungsten layer to fill the cavity to at least the upper surface of the dielectric material; and
planarizing the upper surface of the dielectric material with the first and second tungsten layers within the opening.
7. The method of claim 6 , wherein an upper surface of the first tungsten material is substantially coplanar with the upper surface of the dielectric layer and an upper surface of the second tungsten layer within the opening, after the planarizing.
8. The method of claim 6 , wherein the first tungsten layer comprises a tungsten-rich film, and wherein the second tungsten layer comprises a tungsten fill region within the tungsten-rich film.
9. The method of claim 6 , wherein the barrier layer comprises a dual layer of titanium deposited on titanium nitride.
10. The method of claim 6 , wherein the spacer material comprises one of a polymeric photo-resist, a polymeric organic dielectric layer, or a carbon-based material.
11. The method of claim 6 , further comprising depositing a fluorine-free tungsten layer in the opening the sidewalls of the opening, before depositing the first and second tungsten layers.