Vertical structure LEDs
A method of manufacturing a light emitting device can include forming an n-type GaN-based layer on a sapphire substrate; forming a GaN-based active layer on the n-type GaN-based layer; forming a p-type GaN-based layer on the GaN-based active layer; forming a p-type electrode on the p-type GaN-based layer; forming a metal substrate on the p-type electrode; removing the sapphire substrate; forming an n-type electrode on the n-type GaN-based layer; forming a passivation layer on a side surface of the p-type GaN-based layer, a side surface of the GaN-based active layer, a side surface of the n-type GaN-based layer, an upper surface of the n-type GaN-based layer, a side surface of the n-type electrode, and an upper surface of the n-type electrode after the forming the n-type electrode; and forming an open space to expose the n-type electrode by patterning the passivation layer.
1. A method of manufacturing a light emitting device, the method comprising:
forming an n-type GaN-based layer on a sapphire substrate;
forming a GaN-based active layer on the n-type GaN-based layer;
forming a p-type GaN-based layer on the GaN-based active layer;
forming a p-type electrode on the p-type GaN-based layer;
forming a metal substrate on the p-type electrode;
removing the sapphire substrate;
forming an n-type electrode on the n-type GaN-based layer;
forming a passivation layer on a side surface of the p-type GaN-based layer, a side surface of the GaN-based active layer, a side surface of the n-type GaN-based layer, an upper surface of the n-type GaN-based layer, a side surface of the n-type electrode, and an upper surface of the n-type electrode, after the forming the n-type electrode; and
forming an open space to expose the n-type electrode by patterning the passivation layer.
2. The method according to claim 1 , wherein the forming the passivation layer comprises:
forming a first portion of the passivation layer in contact with the p-type GaN-based layer;
forming a second portion of the passivation layer in contact with the GaN-based active layer;
forming a third portion of the passivation layer in contact with the n-type GaN-based layer; and
forming a fourth portion of the passivation layer in contact with the n-type electrode.
3. The method according to claim 2 , wherein the forming the passivation layer comprises:
forming the third portion of the passivation layer larger than the first portion of the passivation layer.
4. The method according to claim 3 , wherein the forming the passivation layer comprises:
forming the third portion of the passivation layer larger than the second portion of the passivation layer.
5. The method according to claim 4 , wherein the forming the passivation layer comprises:
forming the third portion of the passivation layer larger than the fourth portion of the passivation layer.
6. The method according to claim 5 , wherein the forming the passivation layer comprises:
forming the fourth portion of the passivation layer larger than the first portion of the passivation layer.
7. The method according to claim 6 , wherein the forming the passivation layer comprises:
forming the fourth portion of the passivation layer larger than the second portion of the passivation layer.
8. The method according to claim 7 , wherein the forming the passivation layer comprises:
forming a thickness of the metal substrate to be at least 10 times thicker than a total thickness of the n-type GaN-based layer, the GaN-based active layer, and the p-type GaN-based layer.
9. A method of manufacturing a light emitting device, the method comprising:
forming an n-type GaN-based layer on a sapphire substrate;
forming a GaN-based active layer on the n-type GaN-based layer;
forming a p-type GaN-based layer on the GaN-based active layer;
forming a p-type electrode on the p-type GaN-based layer;
forming a metal substrate on the p-type electrode;
removing the sapphire substrate;
forming an n-type electrode on the n-type GaN-based layer; and
forming a passivation layer on a side surface of the p-type GaN-based layer, a side surface of the GaN-based active layer, a side surface of the n-type GaN-based layer, an upper surface of the n-type GaN-based layer, a side surface of the n-type electrode, and an upper surface of the n-type electrode, after the forming the n-type electrode.
10. The method according to claim 9 , wherein the forming the passivation layer comprises:
forming a first portion of the passivation layer in contact with the p-type GaN-based layer;
forming a second portion of the passivation layer in contact with the GaN-based active layer;
forming a third portion of the passivation layer in contact with the n-type GaN-based layer; and
forming a fourth portion contacting the n-type electrode.
11. The method according to claim 10 , wherein the forming the passivation layer comprises:
forming the third portion of the passivation layer larger than the first portion of the passivation layer.
12. The method according to claim 11 , wherein the forming the passivation layer comprises:
forming the third portion of the passivation layer larger than the second portion of the passivation layer.
13. The method according to claim 12 , wherein the forming the passivation layer comprises:
forming the third portion of the passivation layer larger than the fourth portion of the passivation layer.
14. The method according to claim 13 , wherein the forming the passivation layer comprises:
forming the fourth portion of the passivation layer larger than the first portion of the passivation layer.
15. The method according to claim 14 , wherein the forming the passivation layer comprises:
forming the fourth portion of the passivation layer larger than the second portion of the passivation layer.
16. The method according to claim 15 , wherein the forming the metal substrate comprises:
forming a thickness of the metal substrate to be at least 10 times thicker than a total thickness of the n-type GaN-based layer, the GaN-based active layer, and the p-type GaN-based layer.
17. A method of manufacturing a light emitting device, the method comprising:
forming an n-type GaN-based layer on a sapphire substrate;
forming a GaN-based active layer on the n-type GaN-based layer;
forming a p-type GaN-based layer on the GaN-based active layer;
forming a p-type electrode on the p-type GaN-based layer;
forming a metal substrate on the p-type electrode;
removing the sapphire substrate;
forming an n-type electrode on the n-type GaN-based layer; and
forming a passivation layer on a side surface of the p-type GaN-based layer, a side surface of the GaN-based active layer, a side surface of the n-type GaN-based layer, and an upper surface of the n-type GaN-based layer, after the forming the n-type electrode.
18. The method according to claim 17 , wherein the forming the passivation layer comprises:
forming a first portion of the passivation layer in contact with the p-type GaN-based layer;
forming a second portion of the passivation layer in contact with the GaN-based active layer; and
forming a third portion of the passivation layer in contact with the n-type GaN-based layer.
19. The method according to claim 18 , wherein the forming the passivation layer comprises:
forming the third portion of the passivation layer larger than the first portion of the passivation layer and the second portion of the passivation layer.
20. The method according to claim 19 , wherein the forming the metal substrate comprises:
forming a thickness of the metal substrate to be at least 10 times thicker than a total thickness of the n-type GaN-based layer, the GaN-based active layer, and the p-type GaN-based layer.