IP Library Granted Patent US 12,036,628
Granted Patent B2
US 12,036,628 · App. 18/140,662 · Granted Jul 16, 2024

Electrical connector

Inventors: Stephen Antaya (West Kingston, RI); William Falk (Warwick, RI); Justin Amalfitano (East Providence, RI); Amit Datta (East Greenwich, RI)
Assignee: APTIV TECHNOLOGIES AG
B23K35/262C22C13/00C22C30/04C22C30/06B23K2103/02B23K2103/12B23K2103/54Y10T428/12597Y10T428/12715Y10T428/12722
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Quick Facts
Patent No.
US 12,036,628
App. No.
18/140,662
Granted
Jul 16, 2024
Kind
B2
Abstract

An electrical connector includes a first layer formed of a copper based material and a second layer formed of an iron-nickel alloy. The second layer has a thickness of 8% to 30% of the thickness of the electrical connector. The electrical connector also includes a third layer which is formed of a solder alloy that consists essentially of 17% to 28% indium by weight, 12% to 20% zinc by weight, 1% to 6% silver by weight, 1% to 3% copper by weight, and a remaining weight of the solder alloy that is tin.

Claims (15)

1. An electrical connector, comprising:

a first layer formed of a copper based material;

a second layer formed of an iron-nickel alloy, wherein the second layer has a thickness 8% to 30% of the thickness of the electrical connector; and

a solder layer formed of a solder alloy consisting essentially of:

17% to 28% indium by weight;

12% to 20% zinc by weight;

1% to 6% silver by weight;

1% to 3% copper by weight; and

a remaining weight of the solder alloy being tin.

2. The electrical connector according to claim 1 , wherein the solder alloy includes 23% to 26% indium by weight.

3. The electrical connector according to claim 1 , wherein the solder alloy includes 24% to 26% indium by weight.

4. The electrical connector according to claim 1 , wherein the solder alloy includes 25% to 26% indium by weight.

5. The electrical connector according to claim 1 , wherein the solder alloy includes 5.5% to 6% silver by weight.

6. The electrical connector according to claim 1 , wherein the solder alloy includes 5.75% to 6% silver by weight.

7. The electrical connector according to claim 1 , wherein the solder layer is in direct and intimate contact with the second layer.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 11, 2024
From: APTIV MANUFACTURING MANAGEMENT SERVICES S.À R.L.
To: APTIV TECHNOLOGIES AG
Reel/Frame 066551/0219 →
MERGER Recorded Feb 11, 2024
From: APTIV TECHNOLOGIES (2) S.À R.L.
To: APTIV MANUFACTURING MANAGEMENT SERVICES S.À R.L.
Reel/Frame 066566/0173 →
ENTITY CONVERSION Recorded Feb 11, 2024
From: APTIV TECHNOLOGIES LIMITED
To: APTIV TECHNOLOGIES (2) S.À R.L.
Reel/Frame 066746/0001 →
Continuity (3)
Continuation 17835153 · Jun 8, 2022
Continuation 17027036 · Sep 21, 2020
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