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App. No. 18/982,848 · Confirmation No. 6038

SEMICONDUCTOR DEVICE INCLUDING VERTICAL WIRE BONDS

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2026-06-18 NTC.PUB Notice of Publication 1 View
2024-12-30 APP.FILE.REC Filing Receipt 4 View
2024-12-30 WFEE Fee Worksheet (SB06) 1 View
2024-12-30 WELCOME.LET Welcome Letter from USPTO Director and Deputy Director 1 View
2024-12-16 DRW.SUPP Drawings-black and white line and/or other drawings — View
2024-12-16 APP.TEXT Application body structured text document — View
2024-12-16 IDS Information Disclosure Statement (IDS) Form (SB08) 4 View
2024-12-16 SPEC Specification 20 View
2024-12-16 CLM Claims 4 View
2024-12-16 ABST Abstract 1 View
2024-12-16 N417.PYMT Electronic Fee Payment 2 View
2024-12-16 DRW.NONBW Drawings-other than black and white line drawings 12 View
2024-12-16 N417 Electronic Filing System Acknowledgment Receipt 2 View
2024-12-16 ADS Application Data Sheet 9 View
2024-12-16 OATH Oath or Declaration filed 4 View
2024-12-16 DRW.SUPP Drawings-black and white line and/or other drawings — View
2024-12-16 SCORE Placeholder sheet indicating presence of supplemental content in Supplemental Complex Repository for Examiners(SCORE) 1 View
2024-12-16 SCORE Placeholder sheet indicating presence of supplemental content in Supplemental Complex Repository for Examiners(SCORE) 1 View
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Quick Facts
App. No.
18/982,848
Filed
2024-12-16
Pub. No.
US20260173955A1
Art Unit
OPAP