Patent Application
Provisional
App. No. 60/594,614
· Confirmation No. 2577
DOWN SET SEMICONDUCTOR PACKAGE SYSTEM
Provisional Application Expired
|
⬇ PDF
|
Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2005-04-23 | ADS |
Application Data Sheet | 3 | View | |
| 2005-04-23 | WFEE |
Fee Worksheet (SB06) | 1 | View | |
| 2005-04-23 | TRNA |
Transmittal of New Application | 2 | View | |
| 2005-04-23 | N417 |
Electronic Filing System Acknowledgment Receipt | 2 | View | |
| 2005-04-23 | SPEC |
Specification | 6 | View | |
| 2005-04-23 | CLM |
Claims | 1 | View | |
| 2005-04-23 | ABST |
Abstract | 1 | View | |
| 2005-04-23 | DRW |
Drawings-only black and white line drawings | 2 | View |
Inventors
Taesung Lee
Seoul-si, KOREA, REPUBLIC OF
Jae Soo Lee
Kyoungki-do, KOREA, REPUBLIC OF
Geun Sik Kim
Sungnam, KOREA, REPUBLIC OF
Attorneys & Agents of Record
Prosecution
- Customer No.
- 22898
- Docket No.
- 27-147P
- Confirmation No.
- 2577
No recorded assignments were found for this patent.
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this application's details
Quick Facts
- App. No.
- 60/594,614
- Filed
- 2005-04-23
External Links