Integrated circuit package system
An integrated circuit package system includes a leadframe with leads configured to provide electrical contact between an integrated circuit chip and an external electrical source. Configuring the leads to include outer leads, down set transitional leads, and down set inner leads. Connecting the integrated circuit chip electrically to the down set inner leads. Depositing an encapsulating material to prevent exposure of the down set inner leads.
1. An integrated circuit package system for manufacturing an integrated circuit package comprising:
providing a leadframe including a paddle and leads for providing electrical contact for an integrated circuit chip, the leads configured to include outer leads, down set transitional leads, and down set inner leads;
configuring the integrated circuit chip to overlap a portion of the down set inner leads with electrical interconnects therebetween, the paddle physically isolated from the integrated circuit chip and the leads; and
depositing an encapsulating material for preventing exposure of the down set inner leads, an end surface of the outer leads coplanar to a non-horizontal encapsulation side of the encapsulating material.
2. The system as claimed in claim 1 wherein:
configuring the leads includes stamping the leads.
3. The system as claimed in claim 1 wherein:
configuring the down set inner leads includes down setting the down set inner leads by about 0.100 mm to about 1.000 mm.
4. The system as claimed in claim 1 further comprising:
configuring the down set inner leads and the down set transition leads to form a cavity for retaining the integrated circuit chip.
5. The system as claimed in claim 1 wherein:
depositing the encapsulation material is facilitated by the structure of the leadframe.
6. An integrated circuit package system for manufacturing an integrated circuit package comprising:
providing a leadframe including a paddle offset from an integrated circuit chip and leads for providing electrical contact between the integrated circuit chip and an external electrical source, the leads including outer leads, down set transitional leads, and down set inner leads;
configuring the integrated circuit chip to overlap a portion of the down set inner leads with electrical interconnects therebetween, the paddle physically isolated from the integrated circuit and the leads; and
depositing an encapsulating material for preventing exposure of the down set inner leads, an end surface of the outer leads coplanar to a non-horizontal encapsulation side of the encapsulating material.
7. The system as claimed in claim 6 wherein:
depositing the encapsulating material is facilitated by the structure of the integrated circuit package system.
8. The system as claimed in claim 6 wherein:
configuring the leads includes forming a cavity for retaining the integrated circuit chip.
9. The system as claimed in claim 6 wherein:
configuring the leads includes a pitch design of about 0.200 mm or less.
10. An integrated circuit package system comprising:
an integrated circuit chip;
a leadframe including a paddle and leads configured for providing electrical contact for the integrated circuit chip, the paddle physically isolated from the integrated circuit chip and the leads and the leads configured to include outer leads, down set transitional leads, and down set inner leads;
an encapsulating material for preventing exposure of the down set inner leads, an end surface of the outer leads coplanar to a non-horizontal encapsulation side of the encapsulating material; and
wherein the integrated circuit chip is configured to overlap a portion of the down set inner leads with electrical interconnects therebetween.
11. The system as claimed in claim 10 wherein:
the integrated circuit chip includes a flip chip die.
12. The system as claimed in claim 10 wherein:
the down set inner leads are down set by about 0.100 mm to about 1.000 mm.
13. The system as claimed in claim 10 wherein:
the integrated circuit chip is electrically connected to a bottom surface of the down set inner leads.
14. The system as claimed in claim 10 wherein:
the integrated circuit chip is electrically connected to a top surface of the down set inner leads.
15. The system as claimed in claim 10 wherein:
the leadframe has a thickness of about 0.203 mm or less.
16. The system as claimed in claim 10 wherein:
the leadframe has a thickness between about 0.127 mm and about 0.152 mm.
17. The system as claimed in claim 10 further comprising:
a cavity for retaining the integrated circuit chip.
18. The system as claimed in claim 10 wherein:
the down set inner leads are configured to include a pitch design of about 0.200 mm or less.
19. The system as claimed in claim 10 wherein:
the integrated circuit package system facilitates deposition of the encapsulation material.