Patent Assignment
Reel/Frame 005347/0482
Assignment of Assignors Interest.
Recorded: 1990-04-02
Pages: 4
Assignors
SHEPHERD, LLOYD T.
Executed: 1990-03-22
AUGUST, MELVIN C.
Executed: 1990-02-23
KRUCHOWSKI, JAMES N.
Executed: 1990-02-23
Assignee
CRAY RESEARCH, INC.
608 SECOND AVENUE SOUTH, A CORP OF DE, MINNEAPOLIS, MINNESOTA, 55402
Covered Property
(1)
High Power, High Density Interconnect Method and Apparatus for Integrated Circuits
Patent:
5,127,986 →
Application:
07/444,747 →
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 28, 2000
From: CRAY RESEARCH, L.L.C.
To: SILICON GRAPHICS, INC.
Reel/Frame 010927/0853 →
Security Agreement
Jan 15, 2002
From: SILICON GRAPHICS, INC.
To: FOOTHILL CAPITAL CORPORATION
Reel/Frame 012428/0236 →
Security Interest
Dec 29, 2003
From: SILICON GRAPHICS, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS TRUSTEE
Reel/Frame 014805/0855 →
Security Interest
Oct 24, 2006
From: SILICON GRAPHICS, INC.
To: GENERAL ELECTRIC CAPITAL CORPORATION
Reel/Frame 018545/0777 →
Assignment of Assignor's Interest
Oct 18, 2007
From: GENERAL ELECTRIC CAPITAL CORPORATION
To: MORGAN STANLEY & CO., INCORPORATED
Reel/Frame 019995/0895 →
Assignment of Assignor's Interest
Feb 16, 2012
From: SILICON GRAPHICS, INC. ET AL.; SGI INTERNATIONAL, INC.
To: SILICON GRAPHICS INTERNATIONAL, CORP.
Reel/Frame 027727/0086 →