Patent Assignment
Reel/Frame 007021/0817
Assignment of Assignor's Interest
Recorded: 1994-06-02
Pages: 2
Assignee
LSI LOGIC CORPORATION
1551 MCCARTHY BLVD., MILPITAS, CALIFORNIA, 95035
Covered Property
(1)
Process for Making an Interconnect Bump for Flip-Chip Integrated Circuit Including Integral Standoff and Hourglass Shaped Solder Coating
Patent:
5,466,635 →
Application:
08/252,691 →
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.