Patent Assignment
Reel/Frame 026617/0481
Assignment of Assignor's Interest
Recorded: 2011-07-18
Pages: 3
Assignor
LSI CORPORATION
Executed: 2011-07-08
Assignee
INVENSAS CORPORATION
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Properties
(6)
Process for Making an Interconnect Bump for Flip-Chip Integrated Circuit Including Integral Standoff and Hourglass Shaped Solder Coating
Patent:
5,466,635 →
Application:
08/252,691 →
Process for Manufacturing an Interconnect Bump for Flip-Chip Inter- Grated Circuit Including Integral Standoff and Hourglass Shaped Solder Coating
Patent:
5,698,465 →
Application:
08/474,305 →
Interconnect Bump for Flip-Chip Integrated Circuit Including Integral Standoff and Hourglass Shaped Solder Coating
Patent:
5,872,404 →
Application:
08/795,107 →
Method of Providing Electrical Connection Between an Integrated Circuit Die and a Printed Circuit Board
Patent:
5,933,710 →
Application:
08/910,608 →
Routing Scheme for Differential Pairs in Flip Chip Substrates
Method and Apparatus of Power Ring Positioning to Minimize Crosstalk
Related Assignments
(9)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 2, 1994
From: LYNCH, BRIAN; O'BRIEN, PATRICK
To: LSI LOGIC CORPORATION
Reel/Frame 007021/0817 →
Assignment of Assignor's Interest
Nov 24, 2003
From: RAMAKRISHANAN, ARUN; GOVIND, ANAND; GHAHGHAHI, FARSHAD
To: LSI LOGIC CORPORATION
Reel/Frame 014747/0004 →
Assignment of Assignor's Interest
Oct 31, 2006
From: ALI, ANWAR; LAU, TAUMAN T.; DODDAPANENI, KALYAN
To: LSI LOGIC CORPORATION
Reel/Frame 018500/0864 →
Change of Name
Apr 14, 2011
From: LSI LOGIC CORPORATION
To: LSI CORPORATION
Reel/Frame 026126/0351 →
Change of Name
Apr 18, 2011
From: LSI LOGIC CORPORATION
To: LSI CORPORATION
Reel/Frame 026143/0945 →
Assignment of Assignor's Interest
Sep 27, 2013
From: CHIA, CHOK J.; VARIOT, PATRICK
To: LSI LOGIC CORPORATION
Reel/Frame 031352/0666 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →