Patent Assignment
Reel/Frame 026126/0351
Change of Name
Recorded: 2011-04-14
Pages: 7
Assignor
LSI LOGIC CORPORATION
Executed: 2007-05-04
Assignee
LSI CORPORATION
1621 BARBER LANE, MS: D-105 LEGAL, MILPITAS, CALIFORNIA, 95035
Covered Properties
(5)
Process for Making an Interconnect Bump for Flip-Chip Integrated Circuit Including Integral Standoff and Hourglass Shaped Solder Coating
Patent:
5,466,635 →
Application:
08/252,691 →
Process for Manufacturing an Interconnect Bump for Flip-Chip Inter- Grated Circuit Including Integral Standoff and Hourglass Shaped Solder Coating
Patent:
5,698,465 →
Application:
08/474,305 →
Interconnect Bump for Flip-Chip Integrated Circuit Including Integral Standoff and Hourglass Shaped Solder Coating
Patent:
5,872,404 →
Application:
08/795,107 →
Method of Providing Electrical Connection Between an Integrated Circuit Die and a Printed Circuit Board
Patent:
5,933,710 →
Application:
08/910,608 →
Routing Scheme for Differential Pairs in Flip Chip Substrates
Related Assignments
(7)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 2, 1994
From: LYNCH, BRIAN; O'BRIEN, PATRICK
To: LSI LOGIC CORPORATION
Reel/Frame 007021/0817 →
Assignment of Assignor's Interest
Nov 24, 2003
From: RAMAKRISHANAN, ARUN; GOVIND, ANAND; GHAHGHAHI, FARSHAD
To: LSI LOGIC CORPORATION
Reel/Frame 014747/0004 →
Assignment of Assignor's Interest
Jul 18, 2011
From: LSI CORPORATION
To: INVENSAS CORPORATION
Reel/Frame 026617/0481 →
Assignment of Assignor's Interest
Sep 27, 2013
From: CHIA, CHOK J.; VARIOT, PATRICK
To: LSI LOGIC CORPORATION
Reel/Frame 031352/0666 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →