Patent Assignment
Reel/Frame 014747/0004
Assignment of Assignor's Interest
Recorded: 2003-11-24
Pages: 3
Assignors
RAMAKRISHANAN, ARUN
Executed: 2003-11-24
GOVIND, ANAND
Executed: 2003-11-24
GHAHGHAHI, FARSHAD
Executed: 2003-11-24
Assignee
LSI LOGIC CORPORATION
1621 BARBER LANE, MILPITAS, CALIFORNIA, 95035
Covered Property
(1)
Routing Scheme for Differential Pairs in Flip Chip Substrates
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Apr 14, 2011
From: LSI LOGIC CORPORATION
To: LSI CORPORATION
Reel/Frame 026126/0351 →
Assignment of Assignor's Interest
Jul 18, 2011
From: LSI CORPORATION
To: INVENSAS CORPORATION
Reel/Frame 026617/0481 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →