IP Library Assignment 031352/0666
Patent Assignment
Reel/Frame 031352/0666

Assignment of Assignor's Interest

Recorded: 2013-09-27 Pages: 3
Assignors
CHIA, CHOK J.
Executed: 1994-01-05
VARIOT, PATRICK
Executed: 1994-01-05
Assignee
LSI LOGIC CORPORATION
1551 MCCARTHY BLVD., MILPITAS, CALIFORNIA, USA 95035
Covered Property (1)
Method of Providing Electrical Connection Between an Integrated Circuit Die and a Printed Circuit Board
Patent: 5,933,710 →
Application: 08/910,608 →
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Apr 14, 2011
From: LSI LOGIC CORPORATION
To: LSI CORPORATION
Reel/Frame 026126/0351 →
Assignment of Assignor's Interest Jul 18, 2011
From: LSI CORPORATION
To: INVENSAS CORPORATION
Reel/Frame 026617/0481 →