Patent Assignment
Reel/Frame 007753/0897
Assignment of Assignor's Interest
Recorded: 1995-11-06
Pages: 3
Assignor
SHERMAN, JOHN V.
Executed: 1995-11-03
Assignee
SYMBIOS LOGIC INC.
2001 DANFIELD COURT, MAIL STOP E, FORT COLLINS, COLORADO, 80525
Covered Property
(1)
Arrangement of Pads and Through-Holes for Semiconductor Packages
Patent:
5,784,262 →
Application:
08/554,111 →
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Mar 10, 1998
From: SYMBIOS LOGIC INC.
To: SYMBIOS, INC .
Reel/Frame 009089/0936 →
Assignment of Assignor's Interest
Oct 2, 1998
From: SYMBIOS, INC.
To: LSI LOGIC CORPORATION
Reel/Frame 009500/0554 →
Change of Name
Aug 11, 2009
From: LSI LOGIC CORPORATION
To: LSI CORPORATION
Reel/Frame 023075/0361 →
Assignment of Assignor's Interest
Sep 29, 2009
From: LSI CORPORATION
To: TESSERA INTELLECTUAL PROPERTIES, INC.
Reel/Frame 023292/0897 →
Change of Name
Jun 8, 2011
From: TESSERA INTELLECTUAL PROPERTIES, INC.
To: INVENSAS CORPORATION
Reel/Frame 026423/0286 →