Patent Assignment
Reel/Frame 009327/0851
Assignment of Assignor's Interest
Recorded: 1998-07-07
Pages: 2
Assignors
OSADA, MITSUO
Executed: 1998-06-29
ICHIDA, AKIRA
Executed: 1998-06-29
HIRAYAMA, NORIO
Executed: 1998-06-29
ASAI, KIYOSHI
Executed: 1998-06-29
MAESATO, HIDETOSHI
Executed: 1998-06-29
ARIKAWA, TADASHI
Executed: 1998-06-29
Assignee
TOKYO TUNGSTEN CO. LTD.
24-8, HIGASHIUENO 5-CHOME, TAITO-KU, TOKYO, JAPAN
Covered Property
(1)
Heat Sink Substrate Consisting Essentially of Cooper and Molybdenum and Method of Manufacturing the Same
Patent:
6,271,585 →
Application:
09/110,669 →
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.