Change of Name

Recorded: 2013-04-30 Pages: 30

Assignor

TOKYO TUNGSTEN CO., LTD.

Executed: 2000-10-02

Assignee

A.L.M.T. CORP.

1-11-11, SHIBA, MINATO-KU, TOKYO, JAPAN

Covered Properties (2)

Heat Sink Substrate Consisting Essentially of Cooper and Molybdenum and Method of Manufacturing the Same

Patent: 6,271,585 →

Application: 09/110,669 →

Semiconductor Package and Method for Producing Heat-Radiating Substrate for It

Patent: 6,926,861 →

Application: 10/671,712 →

Publication: US 2004/0056352

Related Assignments (1)

Other recorded transfers of the patents in this record — the chain of ownership.