Patent Assignment
Reel/Frame 009438/0429
Assignment of Assignor's Interest
Recorded: 1998-09-02
Pages: 2
Assignors
MORIYAMA, SHIGEO
Executed: 1998-02-20
YAMAGUCHI, KATSUHIKO
Executed: 1998-02-20
HOMMA, YOSHIO
Executed: 1998-02-20
MATSUBARA, SUNAO
Executed: 1998-02-20
ISHIDA, YOSHIHIRO
Executed: 1998-02-20
KAWA-AI, RYOUSEI
Executed: 1998-02-20
Assignee
HITACHI, LTD.
CHIYODA-KU, 6, KANDA SURUGADAI 4-CHOME, TOKYO, JAPAN
Covered Property
(1)
Polishing Method and Apparatus
Patent:
6,180,020 →
Application:
09/029,903 →
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 20, 2008
From: HITACHI, LTD.
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 021861/0117 →
Merger and Change of Name
Sep 2, 2010
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024944/0577 →
Assignment of Assignor's Interest
May 13, 2014
From: RENESAS ELECTRONICS CORPORATION
To: TESSERA ADVANCED TECHNOLOGIES, INC.
Reel/Frame 032892/0212 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →