IP Library › Assignment 021861/0117
Patent Assignment
Reel/Frame 021861/0117

Assignment of Assignor's Interest

Recorded: 2008-11-20 Pages: 5
Assignor
HITACHI, LTD.
Executed: 2008-09-30
Assignee
RENESAS TECHNOLOGY CORP.
6-2, OTEMACHI, 2-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Properties (11)
Electronic Beam Drawing Apparatus
Patent: 4,983,864 →
Application: 07/328,854 →
Polishing Method and Apparatus
Patent: 6,180,020 →
Application: 09/029,903 →
Method and Apparatus for Picking Up 2D Image of an Object to Be Sensed
Patent: 6,507,417 →
Application: 09/105,222 →
Method for Working Semiconductor Wafer
Patent: 6,221,773 →
Application: 09/254,431 →
Polishing Method and Apparatus
Patent: 6,478,977 →
Application: 09/500,238 →
Flattening and Machining Method and Apparatus
Patent: 6,390,895 →
Application: 09/634,740 →
Method and Its Apparatus for Detecting Floating Particles in a Plasma Processing Chamber and an Apparatus for Processing a Semiconductor Device
Patent: 6,712,928 →
Application: 09/791,677 →
Publication: US 2002/0016068
Process and Apparatus for Manufacturing Semiconductor Device
Patent: 6,667,806 →
Application: 09/796,613 →
Publication: US 2002/0048020
Apparatus for Processing Semicondutor Wafers
Patent: 6,676,496 →
Application: 09/835,359 →
Publication: US 2001/0022214
Flattening and Machining Method and Apparatus
Patent: 6,477,825 →
Application: 10/124,457 →
Publication: US 2002/0111125
Method and Apparatus for Picking Up 2D Image of an Object to Be Sensed
Patent: 7,221,486 →
Application: 10/265,659 →
Publication: US 2003/0030853
Related Assignments (14)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignors Interest. Mar 27, 1989
From: MURAI, FUMIO; OKAZAKI, SHINJI
To: HITACHI, LTD., 6, KANDA SURUGADAI 4-CHOME, CHIYODA-KU, TOKYO, JAPAN, A CORP. OF JAPAN
Reel/Frame 005057/0601 →
Assignment of Assignor's Interest Jun 26, 1998
From: MAKIHIRA, HIROSHI; MAEDA, SHUNJI; OKA, KENJI; YOSHIDA, MINORU
To: HITACHI LTD
Reel/Frame 009294/0535 →
Assignment of Assignor's Interest Sep 2, 1998
From: MORIYAMA, SHIGEO; YAMAGUCHI, KATSUHIKO; HOMMA, YOSHIO; MATSUBARA, SUNAO
To: HITACHI, LTD.
Reel/Frame 009438/0429 →
Assignment of Assignor's Interest Mar 9, 1999
From: YASUI, KAN; MORIYAMA, SHIGEO; YAMAGUCHI, KATSUHIKO; HOMMA, YOSHIO
To: HITACHI LTD.
Reel/Frame 010441/0444 →
Assignment of Assignor's Interest Jun 11, 2001
From: YOSHITAKE, YASUHIRO; KATO, TAKESHI; NAKATA, TOSHIHIKO
To: HITACHI, LTD.
Reel/Frame 011884/0990 →
Assignment of Assignor's Interest Sep 4, 2001
From: NAKANO, HIROYUKI; NAKATA, TOSHIHIKO
To: HITACHI, LTD.
Reel/Frame 012357/0333 →
Assignment of Assignor's Interest Jan 23, 2002
From: KATAGIRI, SOUICHI; YASUI, KAN
To: HITACHI, LTD.
Reel/Frame 012498/0263 →
Merger Jul 30, 2010
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025204/0512 →
Merger and Change of Name Sep 2, 2010
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024944/0577 →
Merger/Change of Name Aug 31, 2011
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 026837/0505 →
Assignment of Assignor's Interest May 13, 2014
From: RENESAS ELECTRONICS CORPORATION
To: TESSERA ADVANCED TECHNOLOGIES, INC.
Reel/Frame 032892/0212 →
Security Interest Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Change of Address Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →
Release of Security Interest Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →