Patent Assignment
Reel/Frame 009496/0393
Assignment of Assignor's Interest
Recorded: 1998-09-29
Pages: 3
Assignors
FURUKAWA, HIDETOSHI
Executed: 1998-09-24
NOMA, ATSUSHI
Executed: 1998-09-24
TANAKA, TSUYOSHI
Executed: 1998-09-24
ISHIDA, HIDETOSHI
Executed: 1998-09-24
UEDA, DAISUKE
Executed: 1998-09-24
Assignee
MATSUSHITA ELECTRONICS CORPORATION
1-1, SAIWAI-CHO, TAKATSUKU-SHI, OSAKA 569-1193, JAPAN
Covered Property
(1)
Method of Making a Semiconductor Device Including Testing Before Thinning the Semiconductor Substrate
Patent:
6,365,513 →
Application:
09/162,232 →
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 7, 2001
From: MATSUSHITA ELECTRONICS CORPORATION
To: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
Reel/Frame 011855/0674 →
Change of Name
Dec 4, 2013
From: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
To: PANASONIC CORPORATION
Reel/Frame 031765/0415 →
Assignment of Assignor's Interest
Oct 27, 2014
From: PANASONIC CORPORATION
To: INVENSAS CORPORATION
Reel/Frame 034042/0112 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →