Patent Assignment
Reel/Frame 034042/0112
Assignment of Assignor's Interest
Recorded: 2014-10-27
Pages: 9
Assignor
PANASONIC CORPORATION
Executed: 2014-09-25
Assignee
INVENSAS CORPORATION
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Properties
(7)
Method of Making a Semiconductor Device Including Testing Before Thinning the Semiconductor Substrate
Patent:
6,365,513 →
Application:
09/162,232 →
Semiconductor Device and Method of Producing the Same
Patent:
6,534,874 →
Application:
09/688,816 →
Semiconductor Chip, Wiring Board and Manufacturing Process Thereof as Well as Semiconductor Device
Semiconductor Chip, Wiring Board and Manufacturing Process Thereof as Well as Semiconductor Device
Formation of a Through-Electrode by Inkjet Deposition of Resin Pastes
Semiconductor Device and Method for Manufacturing Semiconductor Device
Semiconductor Device Manufacturing Method and Semiconductor Device
Related Assignments
(14)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 29, 1998
From: FURUKAWA, HIDETOSHI; NOMA, ATSUSHI; TANAKA, TSUYOSHI; ISHIDA, HIDETOSHI
To: MATSUSHITA ELECTRONICS CORPORATION
Reel/Frame 009496/0393 →
Assignment of Assignor's Interest
Oct 17, 2000
From: MATSUMURA, KAZUHIKO
To: MATSUSHITA ELECTRONICS CORPORATION
Reel/Frame 011237/0010 →
Merger
Jun 5, 2001
From: MATSUSHITA ELECTRONICS CORPORATION
To: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
Reel/Frame 011862/0901 →
Assignment of Assignor's Interest
Jun 7, 2001
From: MATSUSHITA ELECTRONICS CORPORATION
To: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
Reel/Frame 011855/0674 →
Assignment of Assignor's Interest
Oct 10, 2001
From: YAMADA, YUICHIRO; HAMATANI, TSUYOSHI
To: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
Reel/Frame 012254/0574 →
Assignment of Assignor's Interest
Jun 15, 2009
From: HIGASHI, KAZUSHI
To: PANASONIC CORPORATION
Reel/Frame 022827/0499 →
Assignment of Assignor's Interest
Feb 23, 2012
From: SAITO, DAISHIRO; KAI, TAKAYUKI; OKUMA, TAKAFUMI; YAMANISHI, HITOSHI
To: PANASONIC CORPORATION
Reel/Frame 027746/0372 →
Assignment of Assignor's Interest
Mar 27, 2012
From: MURAGISHI, ISAO; KAI, TAKAYUKI; SAITO, DAISHIRO; YAMAMOTO, DAISUKE
To: PANASONIC CORPORATION
Reel/Frame 027930/0907 →
Change of Name
Dec 4, 2013
From: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
To: PANASONIC CORPORATION
Reel/Frame 031765/0415 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →
Change of Name
Nov 24, 2025
From: INVENSAS LLC
To: ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Reel/Frame 073508/0745 →
Change of Name
Nov 24, 2025
From: INVENSAS CORPORATION
To: INVENSAS LLC
Reel/Frame 073941/0814 →